公开(公告)号：US20240293884A1

公开(公告)日：2024-09-05

申请号：US18397354

申请日：2023-12-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngja Kim ,  Seungyeop Oh

IPC: B23K1/015 ,  B23K1/00 ,  B23K1/20 ,  H01L21/56 ,  H01L23/00

CPC classification number: B23K1/015 ,  B23K1/0016 ,  B23K1/20 ,  H01L21/56 ,  H01L24/81 ,  B23K2101/40 ,  H01L2224/81815

Abstract: In a method of manufacturing an electronic device, a substrate having a plurality of bonding pads formed on a first surface of the substrate is provided. Solder balls are attached on the bonding pads respectively. At least one radiant heating cover is disposed on the first surface of the substrate to cover the solder balls. The substrate on which the at least one radiant heating cover is disposed is loaded into a vapor generating chamber that accommodates a heat transfer fluid therein. The heat transfer fluid is heated to form the heat transfer fluid in a vapor phase within the chamber. The solder balls are soldered by transferring heat generated when the heat transfer fluid in the vapor phase is brought to contact a surface of the radiant heating cover and condenses toward the solder balls as radiant heat emitted from the radiant heating cover.

公开(公告)号：US20240178181A1

公开(公告)日：2024-05-30

申请号：US18504418

申请日：2023-11-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngja Kim

IPC: H01L23/00

CPC classification number: H01L24/81 ,  H01L2224/8121 ,  H01L2224/81815

Abstract: In a method of manufacturing an electronic device, a substrate having a plurality of mounting regions on which first electronic components and second electronic components are mounted is provided, the substrate having a first surface and a second surface opposite the first surface. First electronic components are mounted on the first surface of the board via first bumps. At least one vapor shielding cover is positioned on the first surface of the substrate to cover at least one of the first electronic components. Second electronic components are mounted on the second surface of the substrate via second bumps. The second bumps are soldered with a vapor phase reflow process and during the vapor phase reflow process, the at least one vapor shielding cover is configured to prevent a heat transfer fluid in a vapor state from moving to the at least one first electronic component covered by the at least one vapor shielding cover.

公开(公告)号：US20240128229A1

公开(公告)日：2024-04-18

申请号：US18337860

申请日：2023-06-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byungkeun Kang ,  Chaein Moon ,  Youngja Kim ,  Youngmin Lee

IPC: H01L23/00

CPC classification number: H01L24/75 ,  H01L2224/75272 ,  H01L2224/75704 ,  H01L2224/75803 ,  H01L2224/75804 ,  H01L2924/40

Abstract: A solder reflow apparatus may include a reflow chamber, a heater and a stage. The reflow chamber may be configured to receive a heat transfer fluid. The heat transfer fluid may be configured for transferring heat to a solder for mounting an electronic part on a substrate. The heater may be configured to heat the heat transfer fluid in the reflow chamber. The stage may be in the reflow chamber to support the substrate. The stage may be inclined to a bottom surface of the reflow chamber to induce the heat transfer fluid toward a central portion of the substrate. Thus, the vertically ascended heat transfer fluid may be uniformly applied to the central portion and an edge portion of the substrate so that the solders at the central portion and the edge portion of the substrate may be uniformly soldered.