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公开(公告)号:US20170104020A1
公开(公告)日:2017-04-13
申请号:US15290560
申请日:2016-10-11
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kyungho Lee , Seounghyun Kim , Hyuk An , Yun Ki Lee , Hyuk Soon Choi
IPC: H01L27/146
CPC classification number: H01L27/1463 , H01L27/14605 , H01L27/14607 , H01L27/1461 , H01L27/14621 , H01L27/14627 , H01L27/1464
Abstract: An image sensor includes a semiconductor substrate, a first pair of photoelectric conversion regions in a first pixel region of the substrate and a first isolation structure between the photoelectric conversion regions of the first pair of photoelectric conversion regions. The sensor further includes a second pair of photoelectric conversion regions in a second pixel region of the substrate adjacent the first pixel region and a second isolation structure between the photoelectric conversion regions of the second pair of photoelectric conversion regions and having different optical properties than the first isolation structure. First and second different color filters (e.g., green and red) may be disposed on respective ones of the first and second pixel regions
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公开(公告)号:US12170299B2
公开(公告)日:2024-12-17
申请号:US18297679
申请日:2023-04-10
Applicant: Samsung Electronics Co., Ltd.
Inventor: Bomi Kim , BumSuk Kim , Jung-Saeng Kim , Yun Ki Lee , Taesub Jung
IPC: H01L27/146 , H04N25/40
Abstract: Image sensors are provided. The image sensors may include a plurality of unit pixels and a color filter array on the plurality of unit pixels. The color filter array may include a color filter unit including four color filters that are arranged in a two-by-two array, and the color filter unit may include two yellow color filters, a cyan color filter, and one of a red color filter or a green color filter.
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公开(公告)号:US11784202B2
公开(公告)日:2023-10-10
申请号:US17739640
申请日:2022-05-09
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Yun Ki Lee , Jung-Saeng Kim , Hyungeun Yoo
IPC: H01L27/146
CPC classification number: H01L27/14623 , H01L27/1463 , H01L27/14621 , H01L27/14627 , H01L27/14636 , H01L27/14643 , H01L27/14685 , H01L27/14612
Abstract: An image sensor includes a semiconductor layer including a first section and a second section, the semiconductor layer having a first surface and a second surface that face each other; a device isolation layer in the semiconductor layer and defining a plurality of pixels; a first grid pattern on the first surface of the semiconductor layer over the first section; and a light-shield pattern on the first surface of the semiconductor layer over the second section. A top surface of the first grid pattern is located at a first level, a top surface of the light-shield pattern is located at a second level, the first level is lower than the second level, and the first and second levels are defined with respect to the first surface of the semiconductor layer.
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公开(公告)号:US20230246046A1
公开(公告)日:2023-08-03
申请号:US18297679
申请日:2023-04-10
Applicant: Samsung Electronics Co., Ltd.
Inventor: Bomi KIM , BumSuk Kim , Jung-Saeng Kim , Yun Ki Lee , Taesub Jung
IPC: H01L27/146 , H04N25/40
CPC classification number: H01L27/14621 , H01L27/1464 , H01L27/14685 , H01L27/1463 , H04N25/40 , H01L27/14627
Abstract: Image sensors are provided. The image sensors may include a plurality of unit pixels and a color filter array on the plurality of unit pixels. The color filter array may include a color filter unit including four color filters that are arranged in a two-by-two array, and the color filter unit may include two yellow color filters, a cyan color filter, and one of a red color filter or a green color filter.
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公开(公告)号:US20220285415A1
公开(公告)日:2022-09-08
申请号:US17453253
申请日:2021-11-02
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Dong Min Keum , Yun Ki Lee , Jun Sung Park , Dong Kyu Lee , Bum Suk Kim , Kwang Hee Lee , Tae Sung Lee
IPC: H01L27/146
Abstract: An image sensor that provides a uniform sensitivity for pixels having color filters of the same color to increase the image quality is provided. The image sensor includes a substrate, a first grid pattern disposed on the substrate and including a first side wall and a second side wall opposite to the first side wall, a first pixel including a first photoelectric conversion element and a first color filter, and a second pixel including a second photoelectric conversion element and a second color filter. The first color filter contacts the first side wall and the second color filter contacts the second side wall. The first color filter and the second color filter are color filters of same color, and a first thickness of the first color filter is greater than a second thickness of the second color filter.
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公开(公告)号:US11101314B2
公开(公告)日:2021-08-24
申请号:US16775481
申请日:2020-01-29
Applicant: Samsung Electronics Co., Ltd.
Inventor: Yun Ki Lee , Jong Hoon Park , Jun Sung Park
IPC: H01L27/146 , H01L27/32
Abstract: In some example embodiments, a back side illumination (BSI) image sensor may include a pixel configured to generate electrical signals in response to light incident on a back side of a substrate. In some example embodiments, the pixel includes, a photodiode, a device isolation film adjacent to the photodiode, a dark current suppression layer above the photodiode, a light shield grid above the photodiode and including an opening area of 1 to 15% of an area of the pixel, a light shielding filter layer above the light shield grid, a planarization layer above the light shielding filter layer, a lens above the planarization layer, and/or an anti-reflective film between the photodiode and the lens.
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公开(公告)号:US11081514B2
公开(公告)日:2021-08-03
申请号:US16907890
申请日:2020-06-22
Applicant: Samsung Electronics Co., Ltd.
Inventor: Yun Ki Lee
IPC: H01L27/146 , H04N5/361
Abstract: An image sensor includes a substrate including a light-receiving region and a light-shielding region, a device isolation pattern in the substrate of the light-receiving region to define active pixels, and a device isolation region in the substrate of the light-shielding region to define reference pixels. An isolation technique of the device isolation pattern is different from that of the device isolation region.
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公开(公告)号:US10861891B2
公开(公告)日:2020-12-08
申请号:US16750160
申请日:2020-01-23
Applicant: Samsung Electronics Co., Ltd.
Inventor: Bum Suk Kim , Yun Ki Lee , Jung-Saeng Kim , Jong Hoon Park , Jun Sung Park , Chang Rok Moon
IPC: H01L27/146 , H04N5/378 , G06K9/00 , H04N5/376 , H04N5/357
Abstract: An electronic device may include a photoelectric element, a shielding layer on the photoelectric element, and a color filter structure on the shielding layer. The shielding layer may define a first opening over the photoelectric element. The color filter structure may define a second opening over the photoelectric element and the first opening. The color filter structure may appear dark from a view facing the color filter structure.
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公开(公告)号:US10515992B2
公开(公告)日:2019-12-24
申请号:US16025355
申请日:2018-07-02
Applicant: Samsung Electronics Co., Ltd.
Inventor: Bum Suk Kim , Yun Ki Lee , Jung-Saeng Kim , Jong Hoon Park , Jun Sung Park , Chang Rok Moon
IPC: H01L27/146 , H04N5/378 , G06K9/00 , H04N5/376 , H04N5/357
Abstract: An electronic device may include a photoelectric element, a shielding layer on the photoelectric element, and a color filter structure on the shielding layer. The shielding layer may define a first opening over the photoelectric element. The color filter structure may define a second opening over the photoelectric element and the first opening. The color filter structure may appear dark from a view facing the color filter structure.
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公开(公告)号:US10229950B2
公开(公告)日:2019-03-12
申请号:US15458617
申请日:2017-03-14
Applicant: Samsung Electronics Co., Ltd.
Inventor: Yun Ki Lee , Joonkyoung Lee
IPC: H01L27/146
Abstract: An image sensor includes a substrate including a first surface and a second surface, a first device isolation layer disposed in the substrate and defining a plurality of pixels in the substrate, and having a lower surface adjacent the first surface of the substrate and an upper surface adjacent the second surface of the substrate. Each of the pixels includes a photoelectric conversion element, a floating diffusion region adjacent the first surface of the substrate, and a grid pattern on the second surface of the substrate. At least one of the grid patterns is not vertically aligned with the first device isolation layer.
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