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    INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
    11.
    发明公开
    INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME 审中-公开

    公开(公告)号：US20240006328A1

    公开(公告)日：2024-01-04

    申请号：US18244350

    申请日：2023-09-11

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Yukyung PARK ,  Minseung YOON ,  Yunseok CHOI

    IPC: H01L23/538 ,  H01L23/498 ,  H01L23/367

    CPC classification number: H01L23/5386 ,  H01L23/49838 ,  H01L23/5383 ,  H01L23/3675 ,  H01L23/49822

    Abstract: An interposer includes a base layer including a first surface and a second surface that are opposite to each other. An interconnect structure is disposed on the first surface. The interconnect structure includes a metal interconnect pattern and an insulating layer surrounding the metal interconnect pattern. A first lower protection layer is disposed on the second surface. A plurality of lower conductive pads is disposed on the first lower protection layer. A plurality of through electrodes penetrates the base layer and the first lower protection layer. The plurality of through electrodes electrically connects the metal interconnect pattern of the interconnect structure to the lower conductive pads. At least one of the insulating layer and the first lower protection layer has compressive stress. A thickness of the first lower protection layer is in a range of about 13% to about 30% of a thickness of the insulating layer.

    IMAGE SENSOR, ELECTRONIC DEVICE, AND OPERATING METHOD OF IMAGE SENSOR
    14.
    发明申请
    IMAGE SENSOR, ELECTRONIC DEVICE, AND OPERATING METHOD OF IMAGE SENSOR 有权

    公开(公告)号：US20210385389A1

    公开(公告)日：2021-12-09

    申请号：US17337879

    申请日：2021-06-03

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jeongguk LEE ,  Yunseok CHOI ,  Dochang AHN ,  Soyoung JEONG

    IPC: H04N5/243 ,  H04N5/235 ,  H04N5/265 ,  H04N9/04

    Abstract: Provided is an image sensor including: a pixel array including a plurality of pixel groups each including first pixels to which a first conversion gain is applied and second pixels to which a second conversion gain is applied; a readout circuit configured to receive a first pixel signal corresponding to the first pixels and a second pixel signal corresponding to the second pixels through a single readout with respect to each of the plurality of pixel groups, generate first image data, based on first pixel signals of the plurality of pixel groups, and generate second image data, based on second pixel signals of the plurality of pixel groups; and an image signal processor configured to generate output image data by merging the first image data and the second image data in units of a pixel group.

    SEMICONDUCTOR PACKAGE
    17.
    发明申请
    SEMICONDUCTOR PACKAGE 有权

    公开(公告)号：US20220199577A1

    公开(公告)日：2022-06-23

    申请号：US17478247

    申请日：2021-09-17

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Sungwoo PARK ,  Ungcheon KIM ,  Heonwoo KIM ,  Yunseok CHOI

    IPC: H01L25/065 ,  H01L23/48 ,  H01L23/498 ,  H01L23/31 ,  H01L23/00 ,  H01L23/367

    Abstract: A semiconductor package includes a base substrate and an interposer substrate. The interposer substrate includes a semiconductor substrate, a first passivation layer, a wiring region, a through via penetrating through the semiconductor substrate and the first passivation layer, and a second passivation layer covering at least a portion of the first passivation layer and having an opening exposing a lower surface of the through via. The semiconductor package further includes a conductive pillar extending from the opening of the second passivation layer; and a conductive bump disposed between the conductive pillar and the base substrate. The opening of the second passivation layer has inclined side surfaces such that a width of the opening decreases towards the first passivation layer, and side surfaces of the conductive pillar are positioned to overlap the inclined side surfaces of the second passivation layer in a vertical direction.

    IMAGE COMPRESSION METHOD USING SATURATED PIXEL, ENCODER, AND ELECTRONIC DEVICE
    18.
    发明申请
    IMAGE COMPRESSION METHOD USING SATURATED PIXEL, ENCODER, AND ELECTRONIC DEVICE 有权

    公开(公告)号：US20220020180A1

    公开(公告)日：2022-01-20

    申请号：US17350058

    申请日：2021-06-17

    Applicant: Samsung Electronics Co., LTD.

    Inventor： Wonseok LEE ,  Suhyun JO ,  Yunseok CHOI

    IPC: G06T9/00 ,  G06T3/40 ,  H04N19/105 ,  H04N19/46 ,  H04N19/186 ,  H04N19/182

    Abstract: Provided is an image compression method for compressing image data generated by an image sensor, the image compression method including detecting a saturated pixel among a plurality of pixels included in a pixel group included in the image data, the saturated pixel having a pixel value exceeding a threshold value, and the plurality of pixels being adjacent to each other and having a same color as each other, generating a saturation flag indicating a position of the saturated pixel, compressing the image data by comparing a reference pixel with at least one non-saturated pixel among the plurality of pixels included in the pixel group, and outputting a bitstream including the saturation flag, a compression result, and a compression method.

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