公开(公告)号：US20220020180A1

公开(公告)日：2022-01-20

申请号：US17350058

申请日：2021-06-17

Applicant: Samsung Electronics Co., LTD.

Inventor： Wonseok LEE ,  Suhyun JO ,  Yunseok CHOI

IPC: G06T9/00 ,  G06T3/40 ,  H04N19/105 ,  H04N19/46 ,  H04N19/186 ,  H04N19/182

Abstract: Provided is an image compression method for compressing image data generated by an image sensor, the image compression method including detecting a saturated pixel among a plurality of pixels included in a pixel group included in the image data, the saturated pixel having a pixel value exceeding a threshold value, and the plurality of pixels being adjacent to each other and having a same color as each other, generating a saturation flag indicating a position of the saturated pixel, compressing the image data by comparing a reference pixel with at least one non-saturated pixel among the plurality of pixels included in the pixel group, and outputting a bitstream including the saturation flag, a compression result, and a compression method.

公开(公告)号：US20230282631A1

公开(公告)日：2023-09-07

申请号：US18094512

申请日：2023-01-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Juyeon JEONG ,  Jongin YANG ,  Jinsub LEE ,  Suhyun JO

IPC: H01L25/18 ,  H01L27/15 ,  H01L23/00

CPC classification number: H01L25/18 ,  H01L24/13 ,  H01L24/16 ,  H01L27/156 ,  H01L24/05 ,  H01L2224/05573 ,  H01L2224/13021 ,  H01L2224/13147 ,  H01L2224/13181 ,  H01L2224/16145

Abstract: A display apparatus includes a circuit board having a driving circuit, and a pixel array on the circuit board, and including pixel units including a plurality of sub-pixels. The pixel array further includes a semiconductor stack including a first semiconductor region on the circuit board and divided into a plurality of LED cells, and a second semiconductor region on the first semiconductor region and having a partition structure defining a plurality of sub-pixel spaces, a plurality of wavelength converters respectively disposed in the plurality of sub-pixel spaces, a partition reflective layer having a first portion on an upper surface of the partition structure, and a second portion on sidewalls of the partition structure, the first portion having a thickness greater than a thickness of the second portion, and a first electrode and a second electrode electrically connecting each of the plurality of LED cells to the driving circuit.

公开(公告)号：US20210159365A1

公开(公告)日：2021-05-27

申请号：US16935356

申请日：2020-07-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jongin YANG ,  Yongil KIM ,  Juhyun KIM ,  Tan SAKONG ,  Jonguk SEO ,  Suhyun JO

IPC: H01L33/38 ,  H01L33/62

Abstract: Semiconductor light emitting devices and methods of fabricating the same are provided. The semiconductor light emitting device includes a light emitting structure, a first electrode, a first dielectric layer, a second electrode, and a vertical conductive pattern. The light emitting structure includes a first semiconductor layer, an active layer, and a second semiconductor layer that are sequentially stacked, and includes a first opening that penetrates the second semiconductor layer and the active layer, the first opening exposing the first semiconductor layer. The first electrode fills at least a portion of the first opening. The first dielectric layer is on the first electrode. The second electrode is on the light emitting structure and covers the first dielectric layer, the second electrode being electrically connected to the second semiconductor layer. The vertical conductive pattern surrounds outer lateral surfaces of the light emitting structure and is electrically connected to the first electrode.

公开(公告)号：US20240073548A1

公开(公告)日：2024-02-29

申请号：US18125872

申请日：2023-03-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sung-Ho CHA ,  Daeil YU ,  Kundong KIM ,  Suhyun JO

IPC: H04N25/13 ,  H04N25/62 ,  H04N25/767

CPC classification number: H04N25/135 ,  H04N25/62 ,  H04N25/767

Abstract: Disclosed is a camera module which includes an image sensor including pixels outputting raw image data based on light incident from at least one of a display or the exterior, and control logic receiving the raw image data and generating image data. In a first operation mode, the control logic turns off calibration of the image sensor, receives first raw image data, which are based on the light incident from the display, from the image sensor, and generates crosstalk calibration data based on first output values included in the first raw image data. In a second operation mode, the control logic turns on the calibration of the image sensor, receives second raw image data, which are based on light incident from the display and the exterior, from the image sensor, and generates the image data based on second output values included in the second raw image data.

公开(公告)号：US20210126045A1

公开(公告)日：2021-04-29

申请号：US16901451

申请日：2020-06-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jihye YEON ,  Hanul YOO ,  Jihoon YUN ,  Suhyun JO

IPC: H01L27/15 ,  H01L33/00 ,  H01L33/50 ,  H01L33/32 ,  H01L33/38 ,  H01L33/46 ,  H01L33/62 ,  H01L25/18 ,  H01L27/12 ,  H01L23/00

Abstract: An LED module includes light emission windows; LED cells corresponding to the light emission windows, the LED cells each including a lower and upper light emitting structure, the lower light emitting structure having an upper surface with first and second regions and having a first conductivity-type semiconductor layer, the upper light emitting structure being on the first region of the lower light emitting structure and having a second conductivity-type semiconductor layer, the LED cells including an active layer between the first and second conductivity-type semiconductor layers; a protective insulating film on a side surface of the lower light emitting structure and on the second region; a light blocking film on the protective insulating film, between the LED cells; a gap-fill insulating film on the protective insulating film between the LED cells and contacting a side surface of the upper light emitting structure; a first electrode; and a second electrode.

公开(公告)号：US20240282795A1

公开(公告)日：2024-08-22

申请号：US18442612

申请日：2024-02-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungho CHA ,  Kundong KIM ,  Yongkoo PARK ,  Suhyun JO ,  Jaehyuk HUR

IPC: H01L27/146 ,  G02B3/00

CPC classification number: H01L27/14627 ,  G02B3/0043 ,  G02B2207/101

Abstract: An image sensor including a pixel array in which a plurality of pixels are arranged, and a nano-condensing lens array including a plurality of condensing areas respectively corresponding to the plurality of pixels. Each of the plurality of condensing areas includes at least one nanostructure that condenses light on a corresponding pixel among the plurality of pixels, and the at least one nanostructure is arranged in each of the plurality of condensing areas such that a condensing capability of the at least one nanostructure included in each of the plurality of condensing areas varies according to a distance from a center of the nano-condensing lens array to each of the plurality of condensing areas.

公开(公告)号：US20240021661A1

公开(公告)日：2024-01-18

申请号：US18218664

申请日：2023-07-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jihye YEON ,  Hankyu SEONG ,  Suhyun JO ,  Sammook KANG ,  Mihyun KIM ,  Kyungwook HWANG ,  Junsik HWANG

IPC: H01L27/15 ,  H01L33/38 ,  H01L33/50

CPC classification number: H01L27/156 ,  H01L33/382 ,  H01L33/502

Abstract: A display apparatus, including a circuit substrate including driver circuits and first bonding electrodes, and a pixel array on the circuit substrate and including a plurality of pixels each including first to third sub-pixels, and second bonding electrodes bonded to the first bonding electrodes, the pixel array further including, a plurality of first LED cells corresponding to the first and third sub-pixels, respectively, and each including a first conductivity-type semiconductor layer, a first active layer, and a second conductivity-type semiconductor layer, a plurality of second LED cells corresponding to the second sub-pixels, respectively, and each including the first conductivity-type semiconductor layer, a second active layer, and the second conductivity-type semiconductor layer, a first electrode extending to cover upper surfaces of the plurality of first and second LED cells and connected to the first conductivity-type semiconductor layers in common.

公开(公告)号：US20220231082A1

公开(公告)日：2022-07-21

申请号：US17716492

申请日：2022-04-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jihye YEON ,  Hanul YOO ,  Jihoon YUN ,  Suhyun JO

IPC: H01L27/15 ,  H01L33/50 ,  H01L33/32 ,  H01L33/38 ,  H01L33/46 ,  H01L33/62 ,  H01L25/18 ,  H01L27/12 ,  H01L23/00 ,  H01L33/00

Abstract: An LED module includes light emission windows; LED cells corresponding to the light emission windows, the LED cells each including a lower and upper light emitting structure, the lower light emitting structure having an upper surface with first and second regions and having a first conductivity-type semiconductor layer, the upper light emitting structure being on the first region of the lower light emitting structure and having a second conductivity-type semiconductor layer, the LED cells including an active layer between the first and second conductivity-type semiconductor layers; a protective insulating film on a side surface of the lower light emitting structure and on the second region; a light blocking film on the protective insulating film, between the LED cells; a gap-fill insulating film on the protective insulating film between the LED cells and contacting a side surface of the upper light emitting structure; a first electrode; and a second electrode.