公开(公告)号：US20210055889A1

公开(公告)日：2021-02-25

申请号：US17088571

申请日：2020-11-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Fred WORLEY ,  Harry ROGERS ,  Gunneswara MARRIPUDI ,  Zhan PING ,  Vikas SINHA

IPC: G06F3/06 ,  G06F13/40 ,  G06F13/42

Abstract: Embodiments of the inventive concept include solid state drive (SSD) multi-card adapters that can include multiple solid state drive cards, which can be incorporated into existing enterprise servers without major architectural changes, thereby enabling the server industry ecosystem to easily integrate evolving solid state drive technologies into servers. The SSD multi-card adapters can include an interface section between various solid state drive cards and drive connector types. The interface section can perform protocol translation, packet switching and routing, data encryption, data compression, management information aggregation, virtualization, and other functions.

公开(公告)号：US20180129553A1

公开(公告)日：2018-05-10

申请号：US15865250

申请日：2018-01-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chaohong HU ,  Hongzhong ZHENG ,  Uksong KANG ,  Zhan PING

IPC: G06F11/10

Abstract: An embodiment includes a memory module, comprising: a module error interface; and a plurality of memory devices, each memory device coupled to the module error interface, including a data interface and an device error interface, and configured to communicate error information through the device error interface and the module error interface.

公开(公告)号：US20160255740A1

公开(公告)日：2016-09-01

申请号：US14918554

申请日：2015-10-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Zhan PING ,  Harry ROGERS

IPC: H05K7/14 ,  G06F13/42 ,  G06F13/362 ,  G06F13/40 ,  G11C16/04 ,  G06F3/06

CPC classification number: G06F3/0647 ,  G06F1/183 ,  G06F1/185 ,  G06F13/362 ,  G06F13/4022 ,  G06F13/4068 ,  G06F13/4282

Abstract: Embodiments of the inventive concept include Open Cloud Server (OCS)-compliant and other enterprise servers having high-density modular non-volatile flash memory blades and associated multi-card modules. A modular non-volatile flash memory blade can be seated within a 1U tray. The flash memory blade can include a server motherboard and multiple non-volatile flash memory blade multi-card modules. Each of the multi-card modules can include a printed circuit board, a switch coupled to the printed circuit board, a module power port, an input/output port, and riser card slots to receive solid state drive riser cards. The solid state drive riser cards can be seated within a corresponding riser card slot of the multi-card modules, and can each include multiple solid state drive chips. The server motherboard can communicate with the solid state drive chips via the cable connector riser cards and associated cables. The switch can expand each upstream port to multiple downstream ports associate with the solid state drive chips.

Abstract translation: 本发明构思的实施例包括具有高密度模块化非易失性闪速存储器刀片和相关联的多卡模块的Open Cloud Server（OCS）兼容性和其他企业级服务器。 模块化非易失性闪存刀片可以安装在1U托盘内。 闪存刀片可以包括服务器主板和多个非易失性闪存刀片多卡模块。 每个多卡模块可以包括印刷电路板，耦合到印刷电路板的开关，模块电源端口，输入/输出端口和转接卡插槽以接收固态驱动器转接卡。 固态驱动器提升卡可以位于多卡模块的对应的转接卡插槽内，并且可以分别包括多个固态驱动芯片。 服务器主板可以通过电缆连接器提升卡和相关电缆与固态驱动器芯片通信。 交换机可以将每个上游端口扩展到与固态驱动器芯片相关联的多个下游端口。

公开(公告)号：US20150115868A1

公开(公告)日：2015-04-30

申请号：US14194656

申请日：2014-02-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Zhan PING

IPC: H02J7/34 ,  H01L35/02

CPC classification number: H02J7/34 ,  H01L35/00 ,  H01L35/02

Abstract: An embodiment includes a system, comprising: a circuit; an energy harvesting device configured to convert energy from the circuit to electrical energy; an energy storage device configured to store the electrical energy; and a power supply configured to supply power from the energy storage device, and multi-sensor module including such a system.

Abstract translation: 一个实施例包括一个系统，包括：电路; 能量收集装置，被配置为将来自所述电路的能量转换成电能; 配置为存储电能的能量存储装置; 以及被配置为从能量存储装置提供电力的电源以及包括这种系统的多传感器模块。