公开(公告)号：US20080112640A1

公开(公告)日：2008-05-15

申请号：US11923750

申请日：2007-10-25

申请人： Sang Wook PARK ,  Chang Joon PARK ,  In Ho LEE

发明人： Sang Wook PARK ,  Chang Joon PARK ,  In Ho LEE

IPC分类号： G06K9/40

CPC分类号： G06T5/003 ,  G06T5/20 ,  G06T2207/20192

摘要： Provided is an apparatus for sharpening a blurred enlarged image, including a digital image output unit for outputting a digital image input through a digital image input unit. The apparatus includes a digital image processing unit for calculating a primary edge direction of the digital image input through the digital image unit to perform enlarging and edge sharpening on the input digital image. Accordingly, blurring is removed from the enlarged image without ringing or an artifact using an adaptive edge sharpening method, so that the enlarged image can be sharpened.

摘要翻译： 提供了一种用于锐化模糊放大图像的装置，包括用于输出通过数字图像输入单元输入的数字图像的数字图像输出单元。 该装置包括：数字图像处理单元，用于计算通过数字图像单元输入的数字图像的主边缘方向，以对输入的数字图像进行放大和边缘锐化。 因此，使用自适应边缘锐化方法从放大图像中去除模糊而不发生振动或伪像，从而可以削减放大图像。

公开(公告)号：US20070145541A1

公开(公告)日：2007-06-28

申请号：US11682583

申请日：2007-03-06

申请人： Seung Hee LEE ,  Doo Cheol PARK ,  Joo Hun PARK ,  Young Jin LEE ,  Sang Wook PARK ,  Nam Hyeong KIM

发明人： Seung Hee LEE ,  Doo Cheol PARK ,  Joo Hun PARK ,  Young Jin LEE ,  Sang Wook PARK ,  Nam Hyeong KIM

IPC分类号： H01L23/552

CPC分类号： H03H9/1085 ,  H01L24/97 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/3025 ,  H03H3/08 ,  H03H9/059 ,  H03H9/1078 ,  H01L2224/81 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： Disclosed herein is a stack type surface acoustic wave package. The surface acoustic wave package comprises a first bare chip having a plurality of electrodes formed thereon, a second bare chip having a plurality of electrodes and via-holes formed thereon, a connecting portion electrically connecting the first bare chip to an upper surface of the second bare chip such that the electrodes of the first bare chip face the electrodes of the second bare chip, and a sealing member provided on the first and second bare chips to form an air-tight space on an operating surface between the first and second bare chips. The surface acoustic wave package can prevent deformation due to thermal impact from the outside during a packaging process, enhancing reliability of the product, minimizing the size of the product, and reducing manufacturing costs by reducing the number of components and material costs.

摘要翻译： 这里公开了一种堆叠型表面声波封装。 表面声波封装包括具有形成在其上的多个电极的第一裸芯片，具有形成在其上的多个电极和通孔的第二裸芯片，将第一裸芯片电连接到第二裸芯片的上表面的连接部分 裸芯片，使得第一裸芯片的电极面对第二裸芯片的电极;以及密封构件，设置在第一裸芯片和第二裸芯片上，以在第一和第二裸芯片之间的操作表面上形成气密空间 。 表面声波封装可以防止在包装过程中由于外界的热冲击而引起的变形，提高产品的可靠性，最小化产品尺寸，并通过减少部件数量和材料成本降低制造成本。