公开(公告)号：US20070145541A1

公开(公告)日：2007-06-28

申请号：US11682583

申请日：2007-03-06

申请人： Seung Hee LEE ,  Doo Cheol PARK ,  Joo Hun PARK ,  Young Jin LEE ,  Sang Wook PARK ,  Nam Hyeong KIM

发明人： Seung Hee LEE ,  Doo Cheol PARK ,  Joo Hun PARK ,  Young Jin LEE ,  Sang Wook PARK ,  Nam Hyeong KIM

IPC分类号： H01L23/552

CPC分类号： H03H9/1085 ,  H01L24/97 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/3025 ,  H03H3/08 ,  H03H9/059 ,  H03H9/1078 ,  H01L2224/81 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： Disclosed herein is a stack type surface acoustic wave package. The surface acoustic wave package comprises a first bare chip having a plurality of electrodes formed thereon, a second bare chip having a plurality of electrodes and via-holes formed thereon, a connecting portion electrically connecting the first bare chip to an upper surface of the second bare chip such that the electrodes of the first bare chip face the electrodes of the second bare chip, and a sealing member provided on the first and second bare chips to form an air-tight space on an operating surface between the first and second bare chips. The surface acoustic wave package can prevent deformation due to thermal impact from the outside during a packaging process, enhancing reliability of the product, minimizing the size of the product, and reducing manufacturing costs by reducing the number of components and material costs.

摘要翻译： 这里公开了一种堆叠型表面声波封装。 表面声波封装包括具有形成在其上的多个电极的第一裸芯片，具有形成在其上的多个电极和通孔的第二裸芯片，将第一裸芯片电连接到第二裸芯片的上表面的连接部分 裸芯片，使得第一裸芯片的电极面对第二裸芯片的电极;以及密封构件，设置在第一裸芯片和第二裸芯片上，以在第一和第二裸芯片之间的操作表面上形成气密空间 。 表面声波封装可以防止在包装过程中由于外界的热冲击而引起的变形，提高产品的可靠性，最小化产品尺寸，并通过减少部件数量和材料成本降低制造成本。

公开(公告)号：US20130113111A1

公开(公告)日：2013-05-09

申请号：US13602101

申请日：2012-09-01

申请人： Young Jin LEE

发明人： Young Jin LEE

IPC分类号： H01L23/48 ,  H01L21/768

CPC分类号： H01L21/76883 ,  H01L21/76802 ,  H01L21/7682 ,  H01L21/76843 ,  H01L23/5222 ,  H01L23/5226 ,  H01L23/53295 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor device and methods directed toward preventing a leakage current between a contact plug and a line adjacent to the contact plug, and minimizing capacitance between adjacent lines.

摘要翻译： 一种半导体器件和方法，旨在防止接触插塞和与接触插塞相邻的线路之间的漏电流，并使相邻线路之间的电容最小化。

公开(公告)号：US20120056227A1

公开(公告)日：2012-03-08

申请号：US13224658

申请日：2011-09-02

申请人： Young Jin LEE ,  Hyung Kun Kim ,  Kyung Mi Moon ,  Gwang Bok Woo

发明人： Young Jin LEE ,  Hyung Kun Kim ,  Kyung Mi Moon ,  Gwang Bok Woo

IPC分类号： H01L33/62 ,  H01L33/58

CPC分类号： H01L33/642 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2933/0075 ,  H01L2924/00014

摘要： A light emitting diode (LED) package is disclosed. The LED package includes a lead frame comprising a thermal pad and at least two electrode pads disposed at a distance from the thermal pad; at least one LED mounted on the thermal pad and electrically connected with the at least two electrode pads through a wire; a package mold comprising a first cavity to receive the thermal pad and the at least two electrode pads and to partially expose the thermal pad and the at least two electrode pads through a first surface of the package mold, the first surface on which the at least one LED is mounted, and exposing the thermal pad and the at least two electrode pads through a surface coplanar with a second surface opposite to the first surface; and a molding unit disposed in the first cavity.

摘要翻译： 公开了一种发光二极管（LED）封装。 所述LED封装包括引线框架，所述引线框架包括散热焊盘和至少两个设置在距离所述散热焊盘一定距离的电极焊盘; 至少一个LED，其安装在所述散热垫上并通过导线与所述至少两个电极焊盘电连接; 封装模具，其包括用于接收所述热垫和所述至少两个电极焊盘的第一腔，并且通过所述封装模具的第一表面部分地暴露所述热垫和所述至少两个电极焊盘，所述第一表面至少在所述第一表面上， 安装一个LED，并且通过与第一表面相对的第二表面共面的表面暴露热衬垫和至少两个电极焊盘; 以及设置在所述第一腔中的模制单元。

公开(公告)号：US20120043896A1

公开(公告)日：2012-02-23

申请号：US13215619

申请日：2011-08-23

申请人： Young Jin LEE ,  Hyung Kun Kim ,  Kyung Mi Moon

发明人： Young Jin LEE ,  Hyung Kun Kim ,  Kyung Mi Moon

IPC分类号： H05B37/02

CPC分类号： H05B33/0821 ,  H05B33/0806

摘要： There is provided an alternating current (AC) driven light emitting device including a plurality of LED arrays connected in series, each having a structure in which a plurality of LEDs are electrically connected to form a two-terminal circuit and emit light by a bidirectional voltage when an AC voltage is applied to the two-terminal circuit; and a switching device connected to at least one of the plurality of LED arrays and controlling a total driving voltage with respect to the plurality of LED arrays. The AC driven light emitting device permits operation from a low driving voltage Vf while having a high driving voltage at a high voltage Vf, thereby achieving excellence in terms of power factor, THD, and energy efficiency.

摘要翻译： 提供了一种包括串联连接的多个LED阵列的交流（AC）驱动的发光器件，每个LED阵列具有多个LED电连接以形成两端电路并通过双向电压发光的结构 当对两端电路施加交流电压时; 以及连接到所述多个LED阵列中的至少一个并且控制相对于所述多个LED阵列的总驱动电压的开关装置。 交流驱动发光器件允许从低驱动电压Vf进行操作，同时具有高电压Vf的高驱动电压，从而在功率因数，THD和能量效率方面实现卓越。

公开(公告)号：US20090322248A1

公开(公告)日：2009-12-31

申请号：US12262801

申请日：2008-10-31

申请人： Young Jin LEE ,  Joong Kon SON ,  Hyung Kun KIM ,  Jung Ja YANG ,  Grigory ONUSHKIN

发明人： Young Jin LEE ,  Joong Kon SON ,  Hyung Kun KIM ,  Jung Ja YANG ,  Grigory ONUSHKIN

IPC分类号： H05B41/36

CPC分类号： H05B33/0821

摘要： There is provided an LED driving circuit. The LED driving circuit according to an aspect of the invention may include: at least one ladder circuit including: (n−1) number (here, n is a positive integer satisfying n≧2) of first branches provided between first and second junction points, and connected in-line with each other by n number of first middle junction points, (n−1) number of second branches arranged in parallel with the first branches, and connected in-line with each other by n number of second middle junction points between the first and second junction points, and n number of middle branches connecting m-th first and second middle junction points to each other, wherein at least one LED device is disposed on each of the first, second, and middle branches. Here, the number of LED devices included in each of the first and second branches is greater than the number of LED devices included in each of the middle branches.

摘要翻译： 提供了LED驱动电路。 根据本发明的一个方面的LED驱动电路可以包括：至少一个梯形电路，包括：设置在第一和第二结之间的第一分支的（n-1）个数（这里，n是满足n> = 2的正整数） 点，并且通过n个第一中间连接点彼此并排连接，（n-1）个与第一分支平行布置的第二分支，并且彼此连接成n个第二中间 第一和第二接合点之间的接合点以及将第m个第一和第二中间接合点彼此连接的n个中间分支，其中至少一个LED器件设置在第一，第二和中间分支中的每一个上。 这里，包括在第一和第二分支中的每个中的LED装置的数量大于包括在每个中间分支中的LED装置的数量。

公开(公告)号：US20090017619A1

公开(公告)日：2009-01-15

申请号：US12169790

申请日：2008-07-09

申请人： Young Jin LEE ,  Baek Mann KIM ,  Soo Hyun KIM ,  Dong Ha JUNG ,  Jeong Tae KIM ,  Hyeong Tag JEON ,  Keun Woo LEE ,  Keun Jun KIM ,  Tae Yong PARK

发明人： Young Jin LEE ,  Baek Mann KIM ,  Soo Hyun KIM ,  Dong Ha JUNG ,  Jeong Tae KIM ,  Hyeong Tag JEON ,  Keun Woo LEE ,  Keun Jun KIM ,  Tae Yong PARK

IPC分类号： H01L21/44

CPC分类号： H01L21/28518 ,  H01L21/28556 ,  H01L21/76843 ,  H01L21/76855

摘要： A metal suicide layer is fabricated in a semiconductor device. A first metal layer is deposited on a silicon substrate formed with an S interlayer dielectric having a contact hole through PVD. A second metal layer is deposited on the first metal layer through any one of CVD and ALD. Annealing is performed on the silicon substrate which is formed with the first and second metal layers to form the metal silicide. The portions of the second metal layer and the first metal layer which have not reacted during annealing are removed.

摘要翻译： 在半导体器件中制造金属硅化物层。 第一金属层沉积在由具有通过PVD的接触孔的S层间电介质形成的硅衬底上。 通过CVD和ALD中的任一种将第二金属层沉积在第一金属层上。 在由第一和第二金属层形成的硅衬底上进行退火以形成金属硅化物。 去除在退火过程中没有反应的第二金属层和第一金属层的部分。

公开(公告)号：US20080157367A1

公开(公告)日：2008-07-03

申请号：US11755390

申请日：2007-05-30

申请人： Soo Hyun KIM ,  Baek Mann KIM ,  Young Jin LEE ,  Dong Ha JUNG ,  Jeong Tae KIM

发明人： Soo Hyun KIM ,  Baek Mann KIM ,  Young Jin LEE ,  Dong Ha JUNG ,  Jeong Tae KIM

IPC分类号： H01L23/52 ,  H01L21/4763

CPC分类号： H01L21/76843 ,  H01L21/28556 ,  H01L21/28562 ,  H01L21/76846 ,  H01L21/76856 ,  H01L23/53223 ,  H01L23/53238 ,  H01L2924/0002 ,  H01L2924/00

摘要： A multi-layer metal wiring of a semiconductor device and a method for forming the same are disclosed. The multi-layer metal wiring of the semiconductor device includes a lower Cu wiring, and an upper Al wiring formed to be contacted with the lower Cu wiring, and a diffusion barrier layer interposed between the lower Cu wiring and the upper Al wiring. The diffusion barrier layer is formed of a W-based layer.

摘要翻译： 公开了一种半导体器件的多层金属布线及其形成方法。 半导体器件的多层金属布线包括下Cu布线和形成为与下Cu布线接触的上Al布线，以及介于下Cu布线和上Al布线之间的扩散阻挡层。 扩散阻挡层由W基层形成。

公开(公告)号：US20190066394A1

公开(公告)日：2019-02-28

申请号：US16079799

申请日：2017-02-15

申请人： Young Jin LEE

发明人： Young Jin LEE

IPC分类号： G07B17/00 ,  B42D15/00 ,  G06Q20/36

摘要： In an exemplary embodiment of the present invention, the stamp issuing method using a stamp card comprises these steps: offer a sales procedure by stamp card type and issue stamp cards through the procedure; receive purchase request signals from a user terminal, offer a procedure to select mail options and decide a payment method according to the information and service type chosen by the user through the procedure; offer a payment procedure depending on whether pre-payment or post-payment or a procedure to print a postal registration certificate; and offer a procedure to issue a stamp or print out an FDC after the postage is payed through the procedure.

公开(公告)号：US20160128451A1

公开(公告)日：2016-05-12

申请号：US14893967

申请日：2014-05-29

申请人： Young Jin LEE

发明人： Young Jin LEE

IPC分类号： A45D44/02 ,  F16M11/22

CPC分类号： A45D44/02 ,  A45D44/14 ,  F16M11/22 ,  G09B19/003 ,  G09B19/0076

摘要： The present invention provides a hair cutter, which comprises: supports; horizontal stages; and an upper stage, which are fastened and fixed to one another. According to the hair cutter of the present invention, a user can operate a cut operation by spreading and fanning out all of the hair so that the user can operate a cut design as planned using a hair pincette member. Thus, not one part of, but the whole spread diagram can be expressed at once with real hair, and even a user with little experience can complete the style as designed in the spread diagram without a mistake if the user completes the configuration in accordance with the spread diagram and then cuts the hair.

摘要翻译： 本发明提供一种吹风机，其包括：支架; 水平阶段 和上部固定在一起的上段。 根据本发明的剪发机，用户可以通过展开和扇出所有毛发来操作切割操作，使得用户可以使用发夹组件来计划使用切割设计。 因此，不是一部分，而是整个展示图可以用真实的头发一次性表达，甚至一个没有经验的用户也可以按照扩展图中的设计来完成风格，而不会出错，如果用户根据 展开图然后剪头发。

公开(公告)号：US20160074992A1

公开(公告)日：2016-03-17

申请号：US14785243

申请日：2014-04-15

申请人： Young Jin LEE ,  Byung Geun CHOI

发明人： Byung Geun CHOI ,  Young Jin LEE ,  Dong Seon LEE ,  Man Soo KIM ,  Seong Bin KIM

IPC分类号： B24B41/06 ,  B24B55/06 ,  B24B19/26 ,  B24B11/00 ,  B24B19/08

CPC分类号： B24B41/067 ,  B24B11/00 ,  B24B19/08 ,  B24B19/26 ,  B24B55/06

摘要： The present invention provides an apparatus for treating the surface of a radome, comprising: a rotary driving unit; a vacuum suction unit; a vertical driving unit; and a surface treatment unit. The rotary driving unit comprises: a rotary shaft; and a driving motor, installed at a predetermined portion spaced apart from the rotary shaft. The vacuum suction unit comprises: a plurality of first hydraulic cylinders positioned on the rotary shaft in the circumferential direction; and a suction plate equipped at an end of a piston rod of each of the first hydraulic cylinders. The vertical driving unit comprises: a mounting plate having a hole formed in the central portion thereof. The surface treatment unit comprises: a support column vertically installed on a predetermined portion spaced apart from the mounting plate; and a support arm.

摘要翻译： 本发明提供了一种用于处理天线罩表面的设备，包括：旋转驱动单元; 真空抽吸单元; 垂直驱动单元; 和表面处理单元。 旋转驱动单元包括：旋转轴; 以及安装在与旋转轴间隔开的预定部分的驱动电动机。 真空抽吸单元包括：沿圆周方向定位在旋转轴上的多个第一液压缸; 以及设置在每个第一液压缸的活塞杆端部的吸盘。 垂直驱动单元包括：安装板，其中心部分形成有孔。 所述表面处理单元包括：垂直地安装在与所述安装板间隔开的预定部分上的支撑柱; 和支撑臂。