公开(公告)号：US12014938B2

公开(公告)日：2024-06-18

申请号：US17955206

申请日：2022-09-28

Applicant: SEMES CO., LTD.

Inventor： Yong Hee Lee ,  Young Hun Lee ,  Jinwoo Jung ,  Eui Sang Lim

IPC: H01L21/67 ,  H01L21/02 ,  H01L21/687

CPC classification number: H01L21/67051 ,  H01L21/02057 ,  H01L21/02101 ,  H01L21/67028 ,  H01L21/67034 ,  H01L21/6715 ,  H01L21/68707 ,  H01L21/68764 ,  H01L21/6719

Abstract: Disclosed is a method for processing a substrate, comprising a liquid processing step of performing liquid processing on the substrate by supplying a processing liquid onto the substrate in a liquid processing chamber, a transfer step of transferring the substrate from the liquid processing chamber to a drying chamber, and a drying step of drying the substrate in the drying chamber. In the drying step, the substrate is dried while an edge region of the substrate other than a central region of the substrate is supported by a support unit, and in the liquid processing step, the liquid processing is performed on the substrate such that a height of the processing liquid remaining on the edge region of the substrate is greater than a height of the processing liquid remaining on the central region of the substrate when the liquid processing is completed in the liquid processing chamber.

公开(公告)号：US11842903B2

公开(公告)日：2023-12-12

申请号：US17061622

申请日：2020-10-02

Applicant: Semes Co., Ltd

Inventor： Miso Park ,  Yong Hee Lee

IPC: H01L21/67 ,  B08B7/00

CPC classification number: H01L21/67051 ,  B08B7/0021

Abstract: An apparatus for treating a substrate is provided. The apparatus for treating the substrate includes a high pressure chamber to provide a treatment space to perform a process of treating the substrate using a process fluid, a fluid supply source to provide the process fluid to the high pressure chamber, a fluid supply unit to supply the process fluid to the treatment space of the high pressure chamber, an exhaust unit to exhaust the process fluid in the high pressure chamber, and a pre-vent unit to vent a process fluid remaining inside a supply line.

公开(公告)号：US20140060575A1

公开(公告)日：2014-03-06

申请号：US14012523

申请日：2013-08-28

Applicant: SEMES CO. LTD

Inventor： Kang Suk Lee ,  Jae Myoung Lee ,  Bok Kyu Lee ,  Yong Hee Lee ,  Jin Bok Lee

IPC: H01L21/02

CPC classification number: H01L21/02057 ,  H01L21/67028 ,  H01L21/6715

Abstract: Provided is a substrate treating method. The substrate treating method may include treating a substrate by using a chemical solution; rinsing the substrate by using pure water after treating the substrate by using the chemical solution; and treating the substrate by using an organic solvent, wherein the substrate treating method further includes coating the substrate with a hydrophobic membrane between the treating of the chemical solution and the treating of the organic solvent.

Abstract translation: 提供了一种基板处理方法。 基板处理方法可以包括使用化学溶液处理基板; 通过使用化学溶液处理基材后，使用纯水冲洗基材; 以及使用有机溶剂处理所述基材，其中所述基材处理方法还包括在所述化学溶液的处理和所述有机溶剂的处理之间用疏水膜涂覆所述基材。