Sputtering apparatus
    14.
    发明授权
    Sputtering apparatus 有权
    溅射装置

    公开(公告)号:US07708866B2

    公开(公告)日:2010-05-04

    申请号:US11471782

    申请日:2006-06-21

    IPC分类号: C23C14/35

    摘要: A sputtering apparatus comprises a substrate unit that includes a substrate on which a target material is deposited in a chamber and a target unit on which a plurality of target sections formed of the target material are arranged. The sputtering apparatus further comprises a cathode plate that supplies electric power to surfaces of the plurality of target sections and a plurality of gas supply ports provided on regions between the plurality of target sections.

    摘要翻译: 溅射装置包括:基板单元,其包括其中在其中沉积靶材料的基板和其上布置有由目标材料形成的多个目标部分的目标单元。 溅射装置还包括向多个目标部分的表面提供电力的阴极板和设置在多个目标部分之间的区域上的多个气体供应端口。