SCANNING ANTENNA
    12.
    发明申请

    公开(公告)号:US20230138258A1

    公开(公告)日:2023-05-04

    申请号:US17574344

    申请日:2022-01-12

    Abstract: A scanning antenna is provided in the present disclosure. The scanning antenna includes a first substrate and a second substrate which are arranged oppositely; a liquid crystal layer between the first substrate and the second substrate; and a feed signal access terminal and a plurality of phase shift units, where the plurality of phase shift units is connected with each other, each phase shift unit is connected to the feed signal access terminal, and electrical lengths between at least two phase shift units and the feed signal access terminal are different. The present disclosure not only realizes one-dimensional wave beam scanning, but also has desirable scanning effect. The bias voltage is not needed to be independently applied to each phase shift unit, which can greatly simplify the bias voltage line configuration and be beneficial for reducing production cost and wiring difficulty.

    ANTENNA
    13.
    发明申请
    ANTENNA 有权

    公开(公告)号:US20220102871A1

    公开(公告)日:2022-03-31

    申请号:US17547647

    申请日:2021-12-10

    Abstract: Provided is an antenna. The antenna includes a first metal electrode, a second metal electrode, and a dielectric functional layer. The first metal electrode and the second metal electrode are located on two opposite sides of the dielectric functional layer, respectively; and the first metal electrode includes a plurality of transmission electrodes. The antenna further includes a flexible coplanar waveguide and a feed network. The flexible coplanar waveguide is electrically connected to the feed network and configured to feed an electrical signal to the feed network.

    PHASE SHIFTER AND MANUFACTURING METHOD THEREOF, ANTENNA AND MANUFACTURING METHOD THEREOF

    公开(公告)号:US20210408680A1

    公开(公告)日:2021-12-30

    申请号:US16999781

    申请日:2020-08-21

    Abstract: A phase shifter and a manufacturing method thereof and an antenna and a manufacturing method thereof are provided. The phase shifter includes: first and second substrates opposite to each other; a first electrode provided on the first substrate and configured to receive a ground signal; a second electrode provided on a side of the second substrate facing towards the first substrate; liquid crystals encapsulated between the first substrate and the second substrate and driven by the first electrode and the second electrode to rotate; and a support structure provided between the first substrate and the second substrate and including a first spacer. The first spacer is located on a side of the second electrode facing away from the second substrate, and an orthographic projection of the first spacer on the second substrate is within an orthographic projection of the second electrode on the second substrate.

    LIQUID-CRYSTAL DISPLAY PANEL AND DISPLAY DEVICE THEREOF

    公开(公告)号:US20200073168A1

    公开(公告)日:2020-03-05

    申请号:US16208835

    申请日:2018-12-04

    Abstract: A liquid-crystal display panel and a liquid-crystal display device are provided. The display panel includes a display region and a non-display region surrounding the display region. The display panel also includes a first base including a first substrate, and a plurality of gate lines, a plurality of data lines, and a plurality of sub-pixels disposed in the display region. Moreover, the display panel includes a second base including a second substrate, and a liquid-crystal layer disposed between the first base and the second base. In addition, the display panel includes a heating power terminal disposed in the non-display region and including a first heating power terminal for outputting a high voltage and a second heating power terminal for outputting a low voltage. Further, the display panel includes at least one heating electrode disposed between the first substrate and the second substrate and used to heat the liquid-crystal layer.

    SHIFT REGISTER UNIT, SHIFT REGISTER, DRIVING METHOD, DISPLAY PANEL AND DISPLAY APPARATUS

    公开(公告)号:US20180090043A1

    公开(公告)日:2018-03-29

    申请号:US15826176

    申请日:2017-11-29

    Abstract: A gate shift register unit comprises an activation signal terminal, a deactivation signal terminal, a reset signal terminal, a first level signal terminal, a second level signal terminal, a first control terminal, a first clock signal terminal, a second clock signal terminal, an output terminal, a first node, a second node, a first node control unit, a second node control unit, a reset unit, and an output unit. The first node control unit is connected to the first control terminal, the activation signal terminal, the first level signal terminal, the second level signal terminal, the deactivation signal terminal, the first node, and the second node, and configured to transfer a signal at the first level signal terminal or the second level signal terminal to the first node under a control of potential signals at the activation signal terminal, the deactivation signal terminal, the first control terminal, and the second node.

    MICRO-FLUIDIC DETECTION DEVICE
    17.
    发明申请

    公开(公告)号:US20250085253A1

    公开(公告)日:2025-03-13

    申请号:US18613167

    申请日:2024-03-22

    Abstract: A micro-fluidic detection device includes a first base plate, a second base plate opposite to the first base plate, and a droplet travel layer located between the first and second base plates. The first base plate includes a first substrate, a drive array layer, a first electrode layer, and a first hydrophobic layer. The second base plate includes a second substrate, a second electrode layer, and a second hydrophobic layer. Drive electrodes of the first electrode layer are at first units. The first unit includes a micro-fluidic unit circuit. A second unit includes a detection unit circuit. The detection unit circuit includes inorganic transistors and organic transistors. A sensitive electrode is at the second unit. The sensitive electrode is on a side of a layer where the inorganic transistor is located away from the first substrate. A first hollow hole of the first base plate exposes the sensitive electrode.

    MICROFLUIDIC CHIP
    18.
    发明公开
    MICROFLUIDIC CHIP 审中-公开

    公开(公告)号:US20240165610A1

    公开(公告)日:2024-05-23

    申请号:US17758357

    申请日:2021-07-19

    CPC classification number: B01L3/502715 B01L2300/0645 B01L2400/0427

    Abstract: Provided is a microfluidic chip. The microfluidic chip includes a first substrate and a second substrate disposed opposite to each other, a microfluidic channel formed between the first substrate and the second substrate and configured to accommodate at least one droplet, drive electrodes arranged in an array and sensing electrodes disposed on a side of the first substrate. Each sensing electrode includes at least one first branch electrode and at least one second branch electrode. The first branch electrode extends along a first direction, and the second branch electrode extends along a second direction. Different drive voltage signals are applied to adjacent drive electrodes to drive the droplet to move. Detection signals are applied to the sensing electrodes, and a position of the droplet is determined according to a change in capacitance between one sensing electrode and an electrode corresponding thereto when the droplet flows by.

    SEMICONDUCTOR PACKAGE AND FORMATION METHOD THEREOF

    公开(公告)号:US20230137800A1

    公开(公告)日:2023-05-04

    申请号:US18090918

    申请日:2022-12-29

    Abstract: A semiconductor package includes a semiconductor element, a wiring structure, an encapsulation structure, and a solder ball. The semiconductor element includes a plurality of pins. A side of the wiring structure is electrically connected to the plurality of pins of the semiconductor element. The wiring structure includes at least two first wiring layers. A first insulating layer is disposed between adjacent two first wiring layers of the at least two first wiring layers. The first insulating layer includes a plurality of first through-holes. The adjacent two first wiring layers are electrically connected to each other through the plurality of first through-holes. The encapsulation structure at least partially surrounds the semiconductor element. The solder ball is located on a side of the wiring structure away from the semiconductor element. The solder ball is electrically connected to the at least two first wiring layers.

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