公开(公告)号：US4953287A

公开(公告)日：1990-09-04

申请号：US68874

申请日：1987-07-01

申请人： William J. West ,  Howard H. Taub ,  Robert J. Miller

发明人： William J. West ,  Howard H. Taub ,  Robert J. Miller

IPC分类号： B32B37/10 ,  B29C65/00 ,  B29C65/30 ,  B29C65/50 ,  B29C65/78 ,  B32B43/00 ,  B41J2/05 ,  B41J2/16

CPC分类号： B41J2/1631 ,  B29C65/18 ,  B29C65/30 ,  B29C65/4835 ,  B29C65/5042 ,  B29C65/7847 ,  B29C66/001 ,  B29C66/1122 ,  B29C66/53461 ,  B29C66/81 ,  B29C66/81455 ,  B29C66/8163 ,  B29C66/8322 ,  B41J2/1603 ,  B41J2/1623 ,  B41J2/1626 ,  B29C65/4845 ,  B29C66/24244 ,  B29L2031/3425 ,  Y10T29/49083 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/5313 ,  Y10T29/53191 ,  Y10T29/53552

摘要： An orifice plate is thermally bonded to a thick film photopolymer spacer fabricated on a print head substrate using heat and compression. The compression is applied by pressurized gas to a pliable sheet covering the orifice plate and substrate assembly. Heat can be supplied through a vacuum chuck on which the assembly is mounted or from a heating element embedded in the pliable sheet. An apparatus comprising an air actuated ram with a flange having an o-ring seated within is used to seal the pliable sheet against the vacuum chuck circumferentially about the assembly. The ram includes a chamber with an open end which is sealed against the pliable sheet when in an engaged position. By filling the chamber with gas under sufficient pressure while heating the spacer forms a bond between the orifice plate and the assembly. After thermal bonding, curing of the photopolymer spacer can be completed in an oven.

摘要翻译： 孔板热粘合到使用热和压缩制造在打印头基底上的厚膜光聚合物隔片。 压缩通过加压气体施加到覆盖孔板和基底组件的柔韧片材上。 可以通过安装组件的真空卡盘或嵌入柔性片材中的​​加热元件来提供热量。 包括具有位于其内的具有O形环的凸缘的空气致动的冲头的装置用于将柔性片材围绕组件周向地密封在真空吸盘上。 压头包括具有开口端的室，当处于接合位置时，该室与柔韧片密封。 通过在足够的压力下用气体填充室，同时加热间隔件在孔板和组件之间形成结合。 在热粘合之后，光聚合物隔片的固化可以在烘箱中完成。

公开(公告)号：US4794410A

公开(公告)日：1988-12-27

申请号：US57573

申请日：1987-06-02

申请人： Howard H. Taub ,  Gordon D. Denler

发明人： Howard H. Taub ,  Gordon D. Denler

IPC分类号： B41J2/05 ,  B41J2/14 ,  B41J2/20 ,  G01D15/18

CPC分类号： B41J2/1404 ,  B41J2/20 ,  B41J2002/14467

摘要： A three-sided barrier structure (22), comprising three walls (24a-c), is provided in conjunction with a resistor (10) used in a thermal ink-jet printhead. Placement of the structure less than about 25 .mu.m from the resistor results in longer resistor life and an improvement in the static bubble purging ability of the printhead.

公开(公告)号：US20090144520A1

公开(公告)日：2009-06-04

申请号：US12256566

申请日：2008-10-23

申请人： Howard H. Taub ,  Helen Balinsky

发明人： Howard H. Taub ,  Helen Balinsky

IPC分类号： G06F12/02

CPC分类号： A63F9/0468 ,  H04L9/3236 ,  H04L9/3271 ,  H04L2209/60

摘要： A method of selecting a data item from a memory within a first device, the method comprising the steps of evaluating within the first device a function of an input argument so as to form an output value, using the output value to select a data item from the memory and transmitting the selected data item to a second device.

摘要翻译： 一种从第一装置内的存储器中选择数据项的方法，所述方法包括以下步骤：在第一装置内评估输入参数的函数以形成输出值，使用输出值从 存储器并将选择的数据项发送到第二设备。

公开(公告)号：US4931813A

公开(公告)日：1990-06-05

申请号：US317106

申请日：1989-02-28

申请人： Alfred I. Pan ,  Howard H. Taub ,  Harold W. Levie

发明人： Alfred I. Pan ,  Howard H. Taub ,  Harold W. Levie

IPC分类号： B41J2/14

CPC分类号： B41J2/14129 ,  B41J2002/14387 ,  B41J2202/03

摘要： A thermal ink jet head incorporates bubble-generating resistors, each with a relatively thick layer of unpassivated resistive material, such as TaAl. The thermal ink jet head includes an ink source, ink channels, respective orifices, and circuitry for providing the electrical energy which the resistors convert to heat to form bubbles which expel ink through respective orifices. A range between 3,000 .ANG. and 5,000 .ANG. is preferred for the resistive material to minimize failure rate while avoiding thermal, electrical and manufacturing limitations of passivated resistors.

摘要翻译： 热喷墨头包括发泡电阻器，每个电阻器具有相对较厚的未钝化电阻材料层，例如TaAl。 热喷墨头包括墨水源，墨水通道，相应的孔和用于提供电能的电路，电阻转换成热，以形成通过相应的孔喷射墨水的气泡。 对于电阻材料，优选3000安格姆和5,000安格姆之间的范围，以最大限度地减少故障率，同时避免钝化电阻的热，电和制造限制。

公开(公告)号：US4312008A

公开(公告)日：1982-01-19

申请号：US90552

申请日：1979-11-02

申请人： Howard H. Taub ,  Peter H. Wolf

发明人： Howard H. Taub ,  Peter H. Wolf

IPC分类号： B41J2/16 ,  G01D15/18

CPC分类号： B41J2/1626 ,  B41J2/161 ,  B41J2/1623 ,  B41J2002/14379

摘要： An improved impulse jet head structure utilizing etched silicon as the body of the structure. A silicon substrate is etched so as to form a nozzle groove, cavity, and ink supply groove. A layer of glass or other material is bonded to the top of the substrate so as to enclose the cavity and define, along with the grooves, and ink supply conduit and a nozzle conduit. A second layer of glass or other material is bonded to the bottom of the substrate and comprises the bottom surface of the cavity. A piezoelectric crystal driver is bonded to the bottom layer in a position corresponding to the location of the reservoir. An ink supply tube is bonded to the upper layer in a location above the supply groove and delivers ink to the head structure. The etching process may be utilized to form either single or multiple orifice head structures.

摘要翻译： 利用蚀刻硅作为结构体的改进的脉冲喷射头结构。 蚀刻硅衬底以形成喷嘴槽，空腔和供墨槽。 一层玻璃或其他材料结合到基板的顶部，以便包围空腔并与凹槽一起限定供墨导管和喷嘴导管。 玻璃或其他材料的第二层结合到基底的底部并且包括空腔的底表面。 压电晶体驱动器在与储存器的位置对应的位置中结合到底层。 供墨管在供给槽上方的位置上结合到上层，并将油墨输送到头部结构。 蚀刻工艺可用于形成单孔或多孔孔结构。