公开(公告)号：US20220359374A1

公开(公告)日：2022-11-10

申请号：US17465137

申请日：2021-09-02

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Ho-Chuan Lin ,  Chia-Chu Lai ,  Min-Han Chuang

IPC: H01L23/522 ,  H01L23/31 ,  H01L49/02

Abstract: An electronic module is provided, in which a first metal layer, an insulating layer and a second metal layer are sequentially formed on side faces and a non-active face of an electronic component to serve as a capacitor structure, where the capacitor structure is exposed from an active face of the electronic component so that by directly forming the capacitor structure on the electronic component, a distance between the capacitor structure and the electronic component is minimized, such that the effect of suppressing impedance can be optimized.

公开(公告)号：US20220359324A1

公开(公告)日：2022-11-10

申请号：US17368475

申请日：2021-07-06

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Ho-Chuan Lin ,  Min-Han Chuang ,  Chia-Chu Lai

IPC: H01L23/31 ,  H01L23/528 ,  H01L23/00 ,  H01L21/56

Abstract: An electronic package is provided, in which an electronic component with a conductive layer on an outer surface thereof is embedded in an encapsulant, where at least one electrode pad is disposed on an active surface of the electronic component, and at least one wire electrically connected to the electrode pad is arranged inside the electronic component, so that the conductive layer is electrically connected to the wire, such that the electrode pad, the wire and the conductive layer are used as a power transmission structure which serves as a current path to reduce DC resistance and improve an impedance issue associated with the supply of power.

公开(公告)号：US20140124950A1

公开(公告)日：2014-05-08

申请号：US13753882

申请日：2013-01-30

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Bo-Shiang Fang ,  Ho-Chuan Lin ,  Chia-Chu Lai ,  Min-Han Chuang ,  Li-Fang Lin

IPC: H01L23/498 ,  H01L21/768

CPC classification number: H01L23/49827 ,  H01L21/76898 ,  H01L23/13 ,  H01L23/147 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49894 ,  H01L2224/11 ,  H01L2924/0002 ,  H01L2924/19011 ,  H01L2924/00

Abstract: A semiconductor substrate is disclosed. The semiconductor substrate includes a substrate body having at least an opening formed on a surface thereof, wherein the surface of the substrate body and a wall of the opening are made of an insulating material; and a circuit layer formed on the surface of the substrate body, wherein the circuit layer covers an end of the opening and is electrically insulated from the opening. The opening facilitates to increase the thickness of the insulating structure between the circuit layer and the substrate body of a silicon material to prevent signal degradation when high frequency signals are applied to the circuit layer.

Abstract translation: 公开了一种半导体衬底。 半导体衬底包括：至少在其表面上形成有开口的衬底本体，其中衬底主体的表面和开口的壁由绝缘材料制成; 以及形成在所述基板主体的表面上的电路层，其中所述电路层覆盖所述开口的端部并且与所述开口电绝缘。 该开口有助于增加硅材料的电路层和衬底主体之间的绝缘结构的厚度，以防止当高频信号施加到电路层时的信号劣化。

公开(公告)号：US12293952B2

公开(公告)日：2025-05-06

申请号：US18659692

申请日：2024-05-09

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Ho-Chuan Lin ,  Min-Han Chuang ,  Chia-Chu Lai

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01L23/528

Abstract: An electronic package is provided, in which an electronic component with a conductive layer on an outer surface thereof is embedded in an encapsulant, where at least one electrode pad is disposed on an active surface of the electronic component, and at least one wire electrically connected to the electrode pad is arranged inside the electronic component, so that the conductive layer is electrically connected to the wire, such that the electrode pad, the wire and the conductive layer are used as a power transmission structure which serves as a current path to reduce DC resistance and improve an impedance issue associated with the supply of power.

公开(公告)号：US12100648B2

公开(公告)日：2024-09-24

申请号：US18234695

申请日：2023-08-16

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Ho-Chuan Lin ,  Chia-Chu Lai ,  Min-Han Chuang

IPC: H01L23/522 ,  H01L23/31 ,  H01L49/02

CPC classification number: H01L23/5223 ,  H01L23/31 ,  H01L23/5226 ,  H01L28/40

Abstract: An electronic module is provided, in which a first metal layer, an insulating layer and a second metal layer are sequentially formed on side faces and a non-active face of an electronic component to serve as a capacitor structure, where the capacitor structure is exposed from an active face of the electronic component so that by directly forming the capacitor structure on the electronic component, a distance between the capacitor structure and the electronic component is minimized, such that the effect of suppressing impedance can be optimized.

公开(公告)号：US20230343664A1

公开(公告)日：2023-10-26

申请号：US18215107

申请日：2023-06-27

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Ho-Chuan Lin ,  Min-Han Chuang ,  Chia-Chu Lai

IPC: H01L23/00 ,  H01L21/56 ,  H01L23/528 ,  H01L23/31

CPC classification number: H01L23/3107 ,  H01L21/56 ,  H01L23/5286 ,  H01L24/11 ,  H01L24/14 ,  H01L24/43 ,  H01L24/45

Abstract: An electronic package is provided, in which an electronic component with a conductive layer on an outer surface thereof is embedded in an encapsulant, where at least one electrode pad is disposed on an active surface of the electronic component, and at least one wire electrically connected to the electrode pad is arranged inside the electronic component, so that the conductive layer is electrically connected to the wire, such that the electrode pad, the wire and the conductive layer are used as a power transmission structure which serves as a current path to reduce DC resistance and improve an impedance issue associated with the supply of power.

公开(公告)号：US20170271251A1

公开(公告)日：2017-09-21

申请号：US15612390

申请日：2017-06-02

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Bo-Shiang Fang ,  Ho-Chuan Lin ,  Chia-Chu Lai ,  Min-Han Chuang ,  Li-Fang Lin

IPC: H01L23/498 ,  H01L23/14 ,  H01L21/768 ,  H01L23/13

Abstract: A semiconductor substrate is disclosed. The semiconductor substrate includes a substrate body having at least an opening formed on a surface thereof, wherein the surface of the substrate body and a wall of the opening are made of an insulating material; and a circuit layer formed on the surface of the substrate body, wherein the circuit layer covers an end of the opening and is electrically insulated from the opening. The opening facilitates to increase the thickness of the insulating structure between the circuit layer and the substrate body of a silicon material to prevent signal degradation when high frequency signals are applied to the circuit layer.

公开(公告)号：US09503043B2

公开(公告)日：2016-11-22

申请号：US13875550

申请日：2013-05-02

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Min-Han Chuang ,  Chia-Chu Lai ,  Bo-Shiang Fang ,  Ho-Chuan Lin ,  Yen-Yu Chen

IPC: H03H7/46 ,  H03H7/09 ,  H03H7/01 ,  H03H1/00

CPC classification number: H03H7/463 ,  H03H7/09 ,  H03H7/1775 ,  H03H7/1783 ,  H03H2001/0064 ,  H03H2001/0078

Abstract: A duplexer is provided, which includes a first, a second and a third signal ports; a first filter and a second filter. The first filter has first, second, and third resonant circuits that have first, second and third inductors, respectively. The first, second and third inductors are mutually inductive. The first and third resonant circuits are electrically connected to the first and second signal ports, respectively. The second filter has fourth, fifth and sixth resonant circuits that have fourth, fifth and sixth inductors, respectively. The fourth resonant circuit is connected in series with the first resonant circuit. The fifth inductor and the fourth inductor are mutually inductive. The sixth resonant circuit is electrically connected to the third signal port. The second filter further has a main capacitor connected in series with the fifth and sixth resonant circuits respectively and located therebetween.

Abstract translation: 提供了一种双工器，其包括第一，第二和第三信号端口; 第一过滤器和第二过滤器。 第一滤波器具有分别具有第一，第二和第三电感器的第一，第二和第三谐振电路。 第一，第二和第三电感器是互感的。 第一和第三谐振电路分别电连接到第一和第二信号端口。 第二滤波器具有分别具有第四，第五和第六电感器的第四，第五和第六谐振电路。 第四谐振电路与第一谐振电路串联连接。 第五电感器和第四电感器是互感的。 第六谐振电路与第三信号端口电连接。 第二滤波器还具有分别与第五和第六谐振电路串联连接的主电容器，并位于它们之间。

公开(公告)号：US12068211B2

公开(公告)日：2024-08-20

申请号：US18215107

申请日：2023-06-27

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Ho-Chuan Lin ,  Min-Han Chuang ,  Chia-Chu Lai

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01L23/528

CPC classification number: H01L23/3107 ,  H01L21/56 ,  H01L23/5286 ,  H01L24/11 ,  H01L24/14 ,  H01L24/43 ,  H01L24/45

Abstract: An electronic package is provided, in which an electronic component with a conductive layer on an outer surface thereof is embedded in an encapsulant, where at least one electrode pad is disposed on an active surface of the electronic component, and at least one wire electrically connected to the electrode pad is arranged inside the electronic component, so that the conductive layer is electrically connected to the wire, such that the electrode pad, the wire and the conductive layer are used as a power transmission structure which serves as a current path to reduce DC resistance and improve an impedance issue associated with the supply of power.

公开(公告)号：US11728234B2

公开(公告)日：2023-08-15

申请号：US17368475

申请日：2021-07-06

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Ho-Chuan Lin ,  Min-Han Chuang ,  Chia-Chu Lai

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/528 ,  H01L23/00

CPC classification number: H01L23/3107 ,  H01L21/56 ,  H01L23/5286 ,  H01L24/11 ,  H01L24/14 ,  H01L24/43 ,  H01L24/45

Abstract: An electronic package is provided, in which an electronic component with a conductive layer on an outer surface thereof is embedded in an encapsulant, where at least one electrode pad is disposed on an active surface of the electronic component, and at least one wire electrically connected to the electrode pad is arranged inside the electronic component, so that the conductive layer is electrically connected to the wire, such that the electrode pad, the wire and the conductive layer are used as a power transmission structure which serves as a current path to reduce DC resistance and improve an impedance issue associated with the supply of power.