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公开(公告)号：US08236598B2
公开(公告)日：2012-08-07
申请号：US12298956
申请日：2008-08-29
IPC分类号： H01L21/00
CPC分类号： H01L31/022425 , C03C3/066 , C03C3/07 , C03C8/04 , C03C8/10 , C03C8/14 , C03C8/16 , C03C8/18 , Y02E10/50
摘要： Formulations and methods of making semiconductor devices and solar cell contacts are disclosed. The invention provides a method of making a semiconductor device or solar cell contact including ink-jet printing onto a silicon wafer an ink composition, typically including a high solids loading (20-80 wt %) of glass frit and preferably a conductive metal such as silver. The wafer is then fired such that the glass frit fuses to form a glass, thereby forming a contact layer to silicon.
摘要翻译： 公开了半导体器件和太阳能电池触点的制备和方法。 本发明提供一种制造半导体器件或太阳能电池接触的方法，其包括喷墨印刷到硅晶片上的油墨组合物，通常包括高固体含量（20-80重量％）的玻璃料，优选导电金属，例如 银。 然后烧制晶片，使得玻璃料熔化形成玻璃，从而形成与硅的接触层。
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12.发明授权Method of making multilayer structures using tapes on non-densifying substrates 有权使用非致密基材上的带制造多层结构的方法公开(公告)号：US08043721B2
公开(公告)日：2011-10-25
申请号：US12464980
申请日：2009-05-13
IPC分类号： B32B19/00
CPC分类号： C04B37/008 , C03C3/062 , C03C3/078 , C03C3/089 , C03C14/00 , C04B35/6264 , C04B35/632 , C04B37/028 , C04B2235/6567 , C04B2237/66 , C23C24/00 , C23C26/00 , H05K1/0306 , H05K1/053 , H05K3/4611 , H05K3/4629 , H05K2203/068 , Y10T428/2438 , Y10T428/31641
摘要： A method of applying a ceramic coating to a substrate comprises laminating one or more layers of a green ceramic tape to a rigid substrate using a tackifying resin to adhere the tape to the substrate. Upon firing, the tackifying resin ensures near zero shrinkage of the tape in the XY plane without usage of elevated pressures or temperatures during lamination of green tape to the substrate. The thermal degradation completion temperature of the tackifying resin is lower than that of the resin binder used in the green tape.
摘要翻译： 将陶瓷涂层施加到基底的方法包括使用增粘树脂将一层或多层生坯陶瓷带层压到刚性基底上以将带粘附到基底上。 在烧制时，增粘树脂确保胶带在XY平面内接近零收缩，而不会在将生胶带层压到基材中时使用升高的压力或温度。 增粘树脂的热降解完成温度低于生胶带中使用的树脂粘合剂的热降解完成温度。
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13.发明申请Method Of Making Multilayer Structures Using Tapes On Non-Densifying Substrates 有权使用胶带制作多层结构的方法在非增感底物上公开(公告)号：US20090220799A1
公开(公告)日：2009-09-03
申请号：US12464980
申请日：2009-05-13
CPC分类号： C04B37/008 , C03C3/062 , C03C3/078 , C03C3/089 , C03C14/00 , C04B35/6264 , C04B35/632 , C04B37/028 , C04B2235/6567 , C04B2237/66 , C23C24/00 , C23C26/00 , H05K1/0306 , H05K1/053 , H05K3/4611 , H05K3/4629 , H05K2203/068 , Y10T428/2438 , Y10T428/31641
摘要： A method of applying a ceramic coating to a substrate comprises laminating one or more layers of a green ceramic tape to a rigid substrate using a tackifying resin to adhere the tape to the substrate. Upon firing, the tackifying resin ensures near zero shrinkage of the tape in the XY plane without usage of elevated pressures or temperatures during lamination of green tape to the substrate. The thermal degradation completion temperature of the tackifying resin is lower than that of the resin binder used in the green tape.
摘要翻译： 将陶瓷涂层施加到基底的方法包括使用增粘树脂将一层或多层生坯陶瓷带层压到刚性基底上以将带粘附到基底上。 在烧制时，增粘树脂确保胶带在XY平面内接近零收缩，而不会在将生胶带层压到基材中时使用升高的压力或温度。 增粘树脂的热降解完成温度低于生胶带中使用的树脂粘合剂的热降解完成温度。
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14.发明授权Method of making multilayer structures using tapes on non-densifying substrates 有权使用非致密基材上的带制造多层结构的方法公开(公告)号：US07547369B2
公开(公告)日：2009-06-16
申请号：US11468798
申请日：2006-08-31
IPC分类号： C03B29/00
CPC分类号： C04B37/008 , C03C3/062 , C03C3/078 , C03C3/089 , C03C14/00 , C04B35/6264 , C04B35/632 , C04B37/028 , C04B2235/6567 , C04B2237/66 , C23C24/00 , C23C26/00 , H05K1/0306 , H05K1/053 , H05K3/4611 , H05K3/4629 , H05K2203/068 , Y10T428/2438 , Y10T428/31641
摘要： A method of applying a ceramic coating to a substrate comprises laminating one or more layers of a green ceramic tape to a rigid substrate using a tackifying resin to adhere the tape to the substrate. Upon firing, the tackifying resin ensures near zero shrinkage of the tape in the XY plane without usage of elevated pressures or temperatures during lamination of green tape to the substrate. The thermal degradation completion temperature of the tackifying resin is lower than that of the resin binder used in the green tape.
摘要翻译： 将陶瓷涂层施加到基底的方法包括使用增粘树脂将一层或多层生坯陶瓷带层压到刚性基底上以将带粘附到基底上。 在烧制时，增粘树脂确保胶带在XY平面内接近零收缩，而不会在将生胶带层压到基材中时使用升高的压力或温度。 增粘树脂的热降解完成温度低于生胶带中使用的树脂粘合剂的热降解完成温度。
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公开(公告)号：US09680036B2
公开(公告)日：2017-06-13
申请号：US13342231
申请日：2012-01-03
申请人： Nazarali Merchant , Aziz S. Shaikh , Chandrashekhar S. Khadilkar , Srinivasan Sridharan , Hong Jiang
发明人： Nazarali Merchant , Aziz S. Shaikh , Chandrashekhar S. Khadilkar , Srinivasan Sridharan , Hong Jiang
IPC分类号： H01L31/18 , H01L31/0224
CPC分类号： H01L31/022425 , H01L31/18 , Y02E10/50
摘要： A method of reducing bow and/or improving the electrical performance of an aluminum back contacted silicon solar cell includes applying to a silicon wafer substrate a paste including aluminum and an organometallic compound, and firing the substrate. The organometallic compound is a C1 to C30 organometallic compound of a metal selected from the group consisting of Ag, Al, Ba, Bi, Ca, Co, Cr, Cu, Fe, K, Li, Mg, Mn, Mo, Na, Nd, Ni, Sb, Si, Sn, Sr, Ta, V, Zn, Zr. A paste is formed having an exothermic reaction peak at a temperature of at least 300° C. to less than 660° C.
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16.发明授权Vanadium, cobalt and strontium additives for use in aluminum back solar cell contacts 有权用于铝背太阳能电池触点的钒，钴和锶添加剂公开(公告)号：US08709862B2
公开(公告)日：2014-04-29
申请号：US13342334
申请日：2012-01-03
申请人： Hong Jiang , Chandrashekhar S. Khadilkar , Nazarali Merchant , Srinivasan Sridharan , Aziz S. Shaikh
发明人： Hong Jiang , Chandrashekhar S. Khadilkar , Nazarali Merchant , Srinivasan Sridharan , Aziz S. Shaikh
IPC分类号： H01L21/00
摘要： Al pastes with additives of Co, Sr, V, compounds thereof and combinations thereof improve both the physical integrity of a back contact of a silicon solar cell as well as the electrical performance of a cell with such a contact.
摘要翻译： 具有Co，Sr，V，其化合物和其组合的添加剂的Al糊料提高了硅太阳能电池的背接触的物理完整性以及具有这种接触的电池的电性能。
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公开(公告)号：US20120270366A1
公开(公告)日：2012-10-25
申请号：US13542710
申请日：2012-07-06
IPC分类号： H01L31/18
CPC分类号： H01L31/022425 , C03C3/066 , C03C3/07 , C03C8/04 , C03C8/10 , C03C8/14 , C03C8/16 , C03C8/18 , Y02E10/50
摘要： Formulations and methods of making semiconductor devices and solar cell contacts are disclosed. The invention provides a method of making a semiconductor device or solar cell contact including ink jet printing onto a silicon wafer an ink composition, typically including a high solids loading (20-80 wt %) of glass frit and preferably a conductive metal such as silver. The wafer is then fired such that the glass frit fuses to form a glass, thereby forming a contact layer to silicon.
摘要翻译： 公开了半导体器件和太阳能电池触点的制备和方法。 本发明提供一种制造半导体器件或太阳能电池接触的方法，其包括将油墨组合物喷墨印刷到硅晶片上，所述油墨组合物通常包括高固体含量（20-80重量％）的玻璃料，优选导电金属如银 。 然后烧制晶片，使得玻璃料熔化形成玻璃，从而形成与硅的接触层。
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18.发明申请Method Of Making Multilayer Structures Using Tapes On Non-Densifying Substrates 有权使用胶带制作多层结构的方法在非增感底物上公开(公告)号：US20080053592A1
公开(公告)日：2008-03-06
申请号：US11468798
申请日：2006-08-31
IPC分类号： C03B29/00
CPC分类号： C04B37/008 , C03C3/062 , C03C3/078 , C03C3/089 , C03C14/00 , C04B35/6264 , C04B35/632 , C04B37/028 , C04B2235/6567 , C04B2237/66 , C23C24/00 , C23C26/00 , H05K1/0306 , H05K1/053 , H05K3/4611 , H05K3/4629 , H05K2203/068 , Y10T428/2438 , Y10T428/31641
摘要： A method of applying a ceramic coating to a substrate comprises laminating one or more layers of a green ceramic tape to a rigid substrate using a tackifying resin to adhere the tape to the substrate. Upon firing, the tackifying resin ensures near zero shrinkage of the tape in the XY plane without usage of elevated pressures or temperatures during lamination of green tape to the substrate. The thermal degradation completion temperature of the tackifying resin is lower than that of the resin binder used in the green tape.
摘要翻译： 将陶瓷涂层施加到基底的方法包括使用增粘树脂将一层或多层生坯陶瓷带层压到刚性基底上以将带粘附到基底上。 在烧制时，增粘树脂确保胶带在XY平面内接近零收缩，而不会在将生胶带层压到基材中时使用升高的压力或温度。 增粘树脂的热降解完成温度低于生胶带中使用的树脂粘合剂的热降解完成温度。
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19.发明申请Solar Cell Contacts Containing Aluminum And At Least One Of Boron, Titanium, Nickel, Tin, Silver, Gallium, Zinc, Indium And Copper 有权包含铝和至少一种硼，钛，镍，锡，银，镓，锌，铟和铜的太阳能电池触点公开(公告)号：US20090101190A1
公开(公告)日：2009-04-23
申请号：US11774632
申请日：2007-07-09
IPC分类号： H01L31/042 , H01L31/00 , H01L31/18
CPC分类号： H01L31/022425 , C03C3/062 , C03C3/064 , C03C8/02 , C03C8/18 , C22C21/00 , C22C32/001 , C22C32/0036 , H01B1/16 , H01L31/1804 , Y02E10/547 , Y02P70/521
摘要： Formulations and methods of making solar cell contacts and cells therewith are disclosed. In general, the invention provides a solar cell comprising a contact made from a mixture wherein, prior to firing, the mixture comprises at least one aluminum source, at least one source of a metal including one or more of boron, titanium, nickel, tin, gallium zinc, indium, and copper, and about 0.1 to about 10 wt % of a glass component. Within the mixture, the overall content of aluminum is about 50 wt % to about 85 wt % of the mixture, and the overall combined content of boron, nickel, tin, silver, gallium, zinc, indium, copper, is about 0.05 to about 40 wt % of the mixture.
摘要翻译： 公开了制造太阳能电池触点和电池的方法和方法。 通常，本发明提供一种太阳能电池，其包括由混合物制成的触点，其中在烧制之前，所述混合物包含至少一种铝源，至少一种金属源，包括硼，钛，镍，锡中的一种或多种 ，镓锌，铟和铜以及约0.1至约10重量％的玻璃组分。 在混合物中，铝的总含量为混合物的约50重量％至约85重量％，硼，镍，锡，银，镓，锌，铟，铜的总体组合含量为约0.05至约 40重量％的混合物。
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20.发明授权Solar cell contacts containing aluminum and at least one of boron, titanium, nickel, tin, silver, gallium, zinc, indium and copper 有权包含铝和硼，钛，镍，锡，银，镓，锌，铟和铜中的至少一种的太阳能电池触点公开(公告)号：US08575474B2
公开(公告)日：2013-11-05
申请号：US11774632
申请日：2007-07-09
IPC分类号： H01L31/042 , H01L31/00 , H01L31/18
CPC分类号： H01L31/022425 , C03C3/062 , C03C3/064 , C03C8/02 , C03C8/18 , C22C21/00 , C22C32/001 , C22C32/0036 , H01B1/16 , H01L31/1804 , Y02E10/547 , Y02P70/521
摘要： Formulations and methods of making solar cell contacts and cells therewith are disclosed. In general, the invention provides a solar cell comprising a contact made from a mixture wherein, prior to firing, the mixture comprises at least one aluminum source, at least one source of a metal including one or more of boron, titanium, nickel, tin, gallium zinc, indium, and copper, and about 0.1 to about 10 wt % of a glass component. Within the mixture, the overall content of aluminum is about 50 wt % to about 85 wt % of the mixture, and the overall combined content of boron, nickel, tin, silver, gallium, zinc, indium, copper, is about 0.05 to about 40 wt % of the mixture.
摘要翻译： 公开了制造太阳能电池触点和电池的方法和方法。 通常，本发明提供一种太阳能电池，其包括由混合物制成的触点，其中在烧制之前，所述混合物包含至少一种铝源，至少一种金属源，包括硼，钛，镍，锡中的一种或多种 ，镓锌，铟和铜以及约0.1至约10重量％的玻璃组分。 在混合物中，铝的总含量为混合物的约50重量％至约85重量％，硼，镍，锡，银，镓，锌，铟，铜的总体组合含量为约0.05至约 40重量％的混合物。
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