公开(公告)号：US20230365471A1

公开(公告)日：2023-11-16

申请号：US18246082

申请日：2021-09-28

申请人： Denka Company Limited

发明人： Yusuke WAKUDA ,  Yoshitaka MINAKATA ,  Shinya SAKAGUCHI ,  Tomoya YAMAGUCHI ,  Koki IKARASHI ,  Koji NISHIMURA

IPC分类号： C04B37/02 ,  B32B9/04 ,  B32B9/00 ,  B32B37/18 ,  B32B15/20 ,  C04B35/583 ,  C04B38/00 ,  C04B41/83 ,  C04B41/48 ,  C04B41/00 ,  H01L23/373

CPC分类号： C04B37/028 ,  B32B9/041 ,  B32B9/005 ,  B32B37/18 ,  B32B15/20 ,  C04B35/583 ,  C04B38/0054 ,  C04B41/83 ,  C04B41/4853 ,  C04B41/0072 ,  H01L23/3735 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2307/748 ,  B32B2307/306 ,  B32B2315/02 ,  B32B2311/12 ,  B32B2250/02 ,  B32B2305/07 ,  B32B2305/026 ,  C04B2235/3856 ,  C04B2235/386 ,  C04B2237/407 ,  C04B2237/361 ,  C04B2237/61

摘要： One aspect of the present disclosure provides a composite sheet including a porous sintered ceramic component having a thickness of less than 2 mm and a resin filled into pores of the sintered ceramic component, wherein the curing rate of the resin is 10 to 70%.

公开(公告)号：US11780781B2

公开(公告)日：2023-10-10

申请号：US17123616

申请日：2020-12-16

申请人： The Boeing Company

发明人： Tab Hunter Crooks ,  MaryAnn S. Muench

IPC分类号： C04B37/00 ,  C04B35/636 ,  C04B35/638 ,  C04B37/02 ,  C04B37/04 ,  B32B7/027 ,  B32B7/12 ,  B32B18/00 ,  C09J1/00

CPC分类号： C04B37/005 ,  B32B7/027 ,  B32B7/12 ,  B32B18/00 ,  C04B35/638 ,  C04B35/6365 ,  C04B37/008 ,  C04B37/025 ,  C04B37/028 ,  C04B37/04 ,  C09J1/00 ,  B32B2307/30 ,  C04B2235/5436 ,  C04B2235/656 ,  C04B2235/9607 ,  C04B2237/06 ,  C04B2237/10 ,  C04B2237/343 ,  C04B2237/38 ,  C04B2237/385 ,  C04B2237/401 ,  C04B2237/52 ,  C04B2237/58 ,  C04B2237/60 ,  C04B2237/708 ,  C04B2237/72

摘要： Adhesive compositions and methods for bonding materials with different thermal expansion coefficients is provided. The adhesive is formulated using a flux material, a low flux material, and a filler material, where the filler material comprises particulate from at least one of the two components being bonded together. A thickening agent can also be used as part of the adhesive composition to aid in applying the adhesive and establishing a desired bond thickness. The method of forming a high strength bond using the disclosed adhesive does not require the use of intermediary layer or the use of high cure temperatures that could damage one or both of the components being bonded together.

公开(公告)号：US10058958B2

公开(公告)日：2018-08-28

申请号：US13816463

申请日：2011-08-31

申请人： Xiaoru Li

发明人： Xiaoru Li

IPC分类号： B02C17/22 ,  B23P6/00 ,  C04B35/634 ,  C04B37/02

CPC分类号： B23P6/00 ,  B02C17/22 ,  C04B35/63452 ,  C04B37/025 ,  C04B37/028 ,  C04B2237/062 ,  C04B2237/343 ,  C04B2237/406 ,  C04B2237/84 ,  C04B2237/86 ,  Y02P40/20 ,  Y02P40/63 ,  Y10T29/49732

摘要： A manufacture method of a lining plate structure for use with a tube mill for the cement industry. The manufacture method has the following three technical solutions: 1) metal lining plate, 2) ceramic lining plate, and 3) combined lining plate. The manufacture method includes: lining the concave-convex space, formed in the combination of metal lining plate and tube body, with corundum ceramic lining plate; then installing the combined lining plate on the steel plate of the tube body through inlaying, sticking and local welding. Under the same reference conditions of the present method, the weight of lining plate is reduced 50%, saving the steel material consumption by more than 50%; and the service life of the lining plate for use with the tube mill of cement industry is doubled, up to 15000-20000 hours.

公开(公告)号：US09642247B2

公开(公告)日：2017-05-02

申请号：US14428839

申请日：2013-09-16

申请人： CURAMIK ELECTRONICS GMBH

发明人： Karsten Schmidt ,  Andreas Meyer ,  Alexander Legath ,  Martina Schmirler

IPC分类号： C04B37/02 ,  C04B35/119 ,  H05K1/03 ,  H05K1/09 ,  C04B35/111

CPC分类号： H05K1/0306 ,  C04B35/111 ,  C04B35/119 ,  C04B37/021 ,  C04B37/023 ,  C04B37/026 ,  C04B37/028 ,  C04B2235/3225 ,  C04B2235/3244 ,  C04B2235/5248 ,  C04B2235/5436 ,  C04B2235/786 ,  C04B2235/96 ,  C04B2235/9607 ,  C04B2237/343 ,  C04B2237/402 ,  C04B2237/407 ,  C04B2237/62 ,  C04B2237/704 ,  C04B2237/706 ,  C04B2237/86 ,  H05K1/09 ,  H05K2201/0175 ,  H05K2201/032 ,  H05K2201/062 ,  Y10T156/10 ,  Y10T428/26 ,  Y10T428/266

摘要： The invention relates to a metal-ceramic substrate and to a method for the production thereof, the substrate including at least one ceramic layer having first and second surface sides, at least one of the surface sides of which is provided with a metallization, wherein the ceramic material forming the ceramic layer contains aluminum oxide, zirconium dioxide and yttrium oxide. The ceramic layer contains aluminum oxide, zirconium dioxide and yttrium oxide in the following proportions, in each case in relation to the total weight thereof: zirconium dioxide between 2 and 15 percent by weight; yttrium oxide between 0.01 and 1 percent by weight; and aluminum oxide between 84 and 97 percent by weight, wherein the average grain size of the aluminum oxide used is between 2 and 8 micrometers and the ratio of the length of the grain boundaries of the aluminum oxide grains to the total length of all the grain boundaries is greater than 0.6.

公开(公告)号：US09597734B2

公开(公告)日：2017-03-21

申请号：US14534574

申请日：2014-11-06

申请人： Applied Materials, Inc.

发明人： Jennifer Sun ,  Sumanth Banda ,  Ren-Guan Duan

IPC分类号： B23B31/28 ,  B23Q3/00 ,  B05B1/14 ,  B23B31/02 ,  B32B15/08 ,  C04B35/626 ,  C04B35/634 ,  C04B37/00 ,  C04B37/02 ,  H01L21/683

CPC分类号： B23B31/28 ,  B05B1/14 ,  B23B31/02 ,  B23Q3/00 ,  B32B15/08 ,  C04B35/6269 ,  C04B35/63424 ,  C04B37/005 ,  C04B37/006 ,  C04B37/008 ,  C04B37/025 ,  C04B37/026 ,  C04B37/028 ,  C04B2235/604 ,  C04B2237/064 ,  C04B2237/08 ,  C04B2237/12 ,  C04B2237/34 ,  C04B2237/343 ,  C04B2237/365 ,  C04B2237/366 ,  C04B2237/402 ,  C04B2237/55 ,  C04B2237/62 ,  H01L21/6831 ,  Y10T156/10 ,  Y10T279/23

摘要： Embodiments of the present disclosure generally provide chamber components with enhanced thermal properties and methods of enhancing thermal properties of chamber components including bonding materials. One embodiment of the present disclosure provides a method for fabricating a composite structure. The method includes applying a bonding material to a first component, and converting the bonding material applied to the first component to an enhanced bonding layer by heating the bonding material to outgas volatile species from the bonding material. The outgassed volatile species accumulates to at least 0.05% in mass of the bonding material. The method further includes contacting a second component and the enhanced bonding layer to join the first and second components.

公开(公告)号：US20160264478A1

公开(公告)日：2016-09-15

申请号：US14585410

申请日：2014-12-30

申请人： The Boeing Company

发明人： Tab Hunter Crooks ,  MaryAnn S. Muench

IPC分类号： C04B37/00 ,  C09J1/00 ,  B32B7/02 ,  B32B7/12 ,  B32B18/00

CPC分类号： C04B37/005 ,  B32B7/02 ,  B32B7/12 ,  B32B18/00 ,  B32B2307/30 ,  C04B35/6365 ,  C04B35/638 ,  C04B37/008 ,  C04B37/025 ,  C04B37/028 ,  C04B37/04 ,  C04B2235/5436 ,  C04B2235/656 ,  C04B2235/9607 ,  C04B2237/06 ,  C04B2237/10 ,  C04B2237/343 ,  C04B2237/38 ,  C04B2237/385 ,  C04B2237/401 ,  C04B2237/52 ,  C04B2237/58 ,  C04B2237/60 ,  C04B2237/708 ,  C04B2237/72 ,  C09J1/00

摘要： Adhesive compositions and methods for bonding materials with different thermal expansion coefficients is provided. The adhesive is formulated using a flux material, a low flux material, and a filler material, where the filler material comprises particulate from at least one of the two components being bonded together. A thickening agent can also be used as part of the adhesive composition to aid in applying the adhesive and establishing a desired bond thickness. The method of forming a high strength bond using the disclosed adhesive does not require the use of intermediary layer or the use of high cure temperatures that could damage one or both of the components being bonded together.

摘要翻译： 提供粘合剂组合物和用于粘合具有不同热膨胀系数的材料的方法。 粘合剂使用助焊剂材料，低通量材料和填充材料配制，其中填充材料包含粘合在一起的两种组分中的至少一种的颗粒。 增粘剂也可以用作粘合剂组合物的一部分，以有助于施加粘合剂并建立所需的粘结厚度。 使用所公开的粘合剂形成高强度粘合剂的方法不需要使用中间层或使用可能损坏结合在一起的一种或两种组分的高固化温度。

公开(公告)号：US20160196999A1

公开(公告)日：2016-07-07

申请号：US15068936

申请日：2016-03-14

申请人： NGK INSULATORS, LTD.

发明人： Takuya YANOH ,  Kazuma OHBA ,  Tetsuya KAWAJIRI ,  Hideyoshi TSURUTA

IPC分类号： H01L21/683 ,  B29C43/20

CPC分类号： H01L21/6833 ,  B29C43/18 ,  B29C43/206 ,  B29C2043/3644 ,  B29K2033/08 ,  B29K2033/12 ,  B29K2063/00 ,  B29L2031/7502 ,  C04B37/008 ,  C04B37/028 ,  C04B2235/96 ,  C04B2237/366 ,  C04B2237/402 ,  C04B2237/708 ,  C04B2237/72 ,  H01L21/67103 ,  H01L21/6831 ,  H01L21/68757 ,  H01L21/68785

摘要： A wafer holder 10 includes a resin adhesive layer 16 between a ceramic electrostatic chuck 12 and a metal cooling plate 14. The adhesive layer 16 includes a first layer 16a in contact with the electrostatic chuck 12, a second layer 16b in contact with the cooling plate 14, and an intermediate layer 16c located between the first layer 16a and the second layer 16b. Heat resistance of each of the first layer 16a and the intermediate layer 16c is higher than heat resistance of the second layer 16b, flexibility of the second layer 16b is higher than flexibility of each of the first layer 16a and the intermediate layer 16c, and the layers are in hermetic contact with each other.

摘要翻译： 晶片保持器10包括在陶瓷静电卡盘12和金属冷却板14之间的树脂粘合剂层16.粘合剂层16包括与静电卡盘12接触的第一层16a，与冷却板接触的第二层16b 14以及位于第一层16a和第二层16b之间的中间层16c。 第一层16a和中间层16c中的每一个的耐热性高于第二层16b的耐热性，第二层16b的柔性高于第一层16a和中间层16c中的每一个的柔性，并且 层彼此密封接触。

公开(公告)号：US08916021B2

公开(公告)日：2014-12-23

申请号：US13276524

申请日：2011-10-19

申请人： Jennifer Sun ,  Sumanth Banda ,  Ren-Guan Duan

发明人： Jennifer Sun ,  Sumanth Banda ,  Ren-Guan Duan

IPC分类号： B23B31/02 ,  B32B15/08 ,  H01L21/683 ,  C04B35/626 ,  C04B35/634 ,  C04B37/00 ,  C04B37/02

CPC分类号： B23B31/28 ,  B05B1/14 ,  B23B31/02 ,  B23Q3/00 ,  B32B15/08 ,  C04B35/6269 ,  C04B35/63424 ,  C04B37/005 ,  C04B37/006 ,  C04B37/008 ,  C04B37/025 ,  C04B37/026 ,  C04B37/028 ,  C04B2235/604 ,  C04B2237/064 ,  C04B2237/08 ,  C04B2237/12 ,  C04B2237/34 ,  C04B2237/343 ,  C04B2237/365 ,  C04B2237/366 ,  C04B2237/402 ,  C04B2237/55 ,  C04B2237/62 ,  H01L21/6831 ,  Y10T156/10 ,  Y10T279/23

摘要： Embodiments of the present invention generally provide chamber components with enhanced thermal properties and methods of enhancing thermal properties of chamber components including bonding materials. One embodiment of the present invention provides a method for fabricating a composite structure. The method includes applying a bonding material to a first component, and converting the bonding material applied to the first component to an enhanced bonding layer by heating the bonding material to outgas volatile species from the bonding material. The outgassed volatile species accumulates to at least 0.05% in mass of the bonding material. The method further includes contacting a second component and the enhanced bonding layer to join the first and second components.

摘要翻译： 本发明的实施例通常提供具有增强的热性质的腔室部件和增强包括接合材料在内的腔室部件的热性能的方法。 本发明的一个实施例提供一种制造复合结构的方法。 该方法包括：向第一部件施加接合材料，并且通过加热接合材料将从第一部件施加的接合材料转化为增强的接合层，从而从接合材料排出挥发性物质。 脱气的挥发性物质在接合材料的质量上累积至少0.05％。 该方法还包括使第二组分和增强的结合层接触以连接第一和第二组分。

公开(公告)号：US08747590B2

公开(公告)日：2014-06-10

申请号：US13848259

申请日：2013-03-21

申请人： Maruwa Co., Ltd.

发明人： Ikuo Nishi ,  Sei Kanbe

IPC分类号： C03B29/00 ,  B29C65/00

CPC分类号： B32B38/0004 ,  B28B11/14 ,  B28D1/222 ,  B32B18/00 ,  C04B35/04 ,  C04B35/10 ,  C04B35/14 ,  C04B35/185 ,  C04B35/195 ,  C04B35/26 ,  C04B35/46 ,  C04B35/48 ,  C04B35/565 ,  C04B35/581 ,  C04B35/584 ,  C04B35/62218 ,  C04B35/63424 ,  C04B35/63452 ,  C04B35/645 ,  C04B37/008 ,  C04B37/028 ,  C04B2235/483 ,  C04B2235/604 ,  C04B2235/94 ,  C04B2235/9638 ,  C04B2237/34 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/346 ,  C04B2237/348 ,  C04B2237/365 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/40 ,  C04B2237/402 ,  C04B2237/407 ,  C04B2237/70 ,  C04B2237/704 ,  C04B2237/76

摘要： A method of manufacturing a cut-out sintered ceramic sheet including forming a ceramic green sheet, sintering the formed ceramic green sheet, adhering a plastic resin film onto which adhesive is applied on at least one surface of the sintered ceramic sheet, and shearing the sintered ceramic sheet.

摘要翻译： 一种制造切割烧结陶瓷片的方法，包括形成陶瓷生片，烧结形成的陶瓷生片，将施加有粘合剂的塑料树脂膜粘附在烧结陶瓷片的至少一个表面上，并将烧结的 陶瓷片。

公开(公告)号：US20130093146A1

公开(公告)日：2013-04-18

申请号：US13706762

申请日：2012-12-06

申请人： NGK INSULATORS, LTD.

发明人： Yasufumi AIHARA ,  Hiroya SUGIMOTO ,  Shunsuke TANAKA ,  Kazuma OHBA ,  Jyunya WAKI

IPC分类号： H01L21/683 ,  B32B15/04

CPC分类号： H01L21/6833 ,  B32B15/04 ,  C04B35/6269 ,  C04B35/63424 ,  C04B37/028 ,  C04B2235/656 ,  C04B2235/6562 ,  C04B2235/6565 ,  C04B2235/6567 ,  C04B2235/6581 ,  C04B2237/343 ,  C04B2237/346 ,  C04B2237/365 ,  C04B2237/366 ,  C04B2237/402 ,  C04B2237/525 ,  H01L21/67109 ,  H01L21/6831 ,  Y10T279/23 ,  Y10T428/31678

摘要： To form an electrostatic chuck, a bonding sheet is applied onto the upper surface of a cooling plate and then the cooling plate is placed in a vacuum dryer at a pressure of 2,000 Pa or less for a pre-bake treatment at 120° C. to 130° C. for 15 to 40 hours, followed by natural cooling. A plate is then stacked on the bonding sheet so that the lower surface of the plate is aligned with the upper surface of the bonding sheet, which is applied onto the cooling plate. The resulting stacked body is placed in a heat-resistant resin bag, and is then placed in an autoclave and treated together for several hours under pressure and heat.

摘要翻译： 为了形成静电卡盘，将粘合片施加到冷却板的上表面上，然后将冷却板放置在2000Pa以下的真空干燥器中，以进行120℃的预烘烤处理，至 130℃15〜40小时，然后自然冷却。 然后在接合片上堆叠板，使得板的下表面与施加到冷却板上的接合片的上表面对准。 将所得到的层叠体放置在耐热树脂袋中，然后置于高压釜中并在加压和加热下一起处理数小时。