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11.发明授权Micro-electro mechanical system (MEMS) structures and methods of forming the same 有权微机电系统（MEMS）结构及其形成方法公开(公告)号：US09266714B2
公开(公告)日：2016-02-23
申请号：US14253224
申请日：2014-04-15
发明人： Chia-Pao Shu , Chia-Ming Hung , Wen-Chuan Tai , Hung-Sen Wang , Hsiang-Fu Chen , Alex Kalnitsky
CPC分类号： B81B7/0032 , B81B7/0038 , B81C1/00261 , H01L2924/0002 , H01L2924/00
摘要： A device includes a first substrate bonded with a second substrate structure. The second substrate structure includes an outgasing prevention structure. At least one micro-electro mechanical system (MEMS) device is disposed over the outgasing prevention structure.
摘要翻译： 一种器件包括与第二衬底结构接合的第一衬底。 第二基板结构包括防止结构。 至少一个微机电系统（MEMS）装置设置在防止外壳结构上。
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12.发明公开公开(公告)号：US20230406695A1
公开(公告)日：2023-12-21
申请号：US18365449
申请日：2023-08-04
发明人： Hsiang-Fu Chen , Chia-Ming Hung , I-Hsuan Chiu
CPC分类号： B81B7/02 , B81C1/00341 , B81B2201/0271 , B81B2203/0127 , B81B2203/0315 , B81B2207/07 , B81C2203/036
摘要： Various embodiments of the present disclosure are directed towards a semiconductor device. The semiconductor device includes an interconnect structure disposed over a semiconductor substrate. A dielectric structure is disposed over the interconnect structure. A first cavity and a second cavity are disposed in the dielectric structure. A microelectromechanical system (MEMS) substrate is disposed over the dielectric structure, where the MEMS substrate comprises a first movable membrane overlying the first cavity and a second movable membrane overlying the second cavity. A first functional structure overlies the first movable membrane, where the first functional structure comprises a first material having a first chemical composition. A second functional structure overlies the second movable membrane, where the second functional structure is laterally spaced from the first functional structure, and where the second functional structure comprises a second material having a second chemical composition different than the first chemical composition.
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13.发明申请公开(公告)号：US20220362804A1
公开(公告)日：2022-11-17
申请号：US17872686
申请日：2022-07-25
发明人： I-Hsuan Chiu , Chia-Ming Hung , Li-Chun Peng , Hsiang-Fu Chen
摘要： Various embodiments of the present disclosure are directed towards a semiconductor device. The semiconductor device includes an interconnect structure disposed over a semiconductor substrate. A dielectric structure is disposed over the interconnect structure. A plurality of cavities are disposed in the dielectric structure. A microelectromechanical system (MEMS) substrate is disposed over the dielectric structure, where the MEMS substrate comprises a plurality of movable membranes, and where the movable membranes overlie the cavities, respectively. A plurality of fluid communication channels are disposed in the dielectric structure, where each of the fluid communication channels extend laterally between two neighboring cavities of the cavities, such that each of the cavities are in fluid communication with one another.
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公开(公告)号：US20220306452A1
公开(公告)日：2022-09-29
申请号：US17840892
申请日：2022-06-15
发明人： Fan Hu , Chun-Ren Cheng , Hsiang-Fu Chen , Wen-Chuan Tai
摘要： Various embodiments of the present disclosure are directed towards a microelectromechanical system (MEMS) device. The MEMS device includes a first dielectric structure disposed over a first semiconductor substrate, where the first dielectric structure at least partially defines a cavity. A second semiconductor substrate is disposed over the first dielectric structure and includes a movable mass, where opposite sidewalls of the movable mass are disposed between opposite sidewall of the cavity. A first piezoelectric anti-stiction structure is disposed between the movable mass and the first dielectric structure, wherein the first piezoelectric anti-stiction structure includes a first piezoelectric structure and a first electrode disposed between the first piezoelectric structure and the first dielectric structure
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