公开(公告)号：US11302473B2

公开(公告)日：2022-04-12

申请号：US16452042

申请日：2019-06-25

Applicant: TDK CORPORATION

Inventor： Norihisa Ando ,  Sunao Masuda ,  Masahiro Mori ,  Kayou Matsunaga ,  Kosuke Yazawa

IPC: H01G2/06 ,  H01G4/38 ,  H01G4/30 ,  H01G4/232 ,  H01G4/248 ,  H01G4/12

Abstract: An electronic device includes a chip component and a metal terminal. The chip component has an element body where internal electrodes are laminated inside and a terminal electrode formed outside the element body and connected with end parts of the internal electrodes. The metal terminal is connected with the terminal electrode of the chip component. The metal terminal includes an electrode face portion and a mount portion. The electrode face portion is arranged correspondingly with an end surface of the terminal electrode. The mount portion is mounted on a mount surface. The electrode face portion is provided with an opening portion so that a part of the terminal electrode corresponding with at least a part of the internal electrodes is exposed to the outside.

公开(公告)号：US10916375B2

公开(公告)日：2021-02-09

申请号：US16367937

申请日：2019-03-28

Applicant: TDK CORPORATION

Inventor： Norihisa Ando ,  Sunao Masuda ,  Masahiro Mori ,  Kayou Matsunaga ,  Kosuke Yazawa

IPC: H01G2/06 ,  H01G4/30 ,  H01G4/232 ,  H01G4/38 ,  H01G4/12

Abstract: An electronic device includes a chip component and a metal terminal. The chip component includes a terminal electrode formed on an element body. The metal terminal is connectable with the terminal electrode of the chip component. The metal terminal includes a terminal body and a pair of holding pieces. The terminal body faces an end surface of the terminal electrode of the chip component. The pair of holding pieces is formed on the terminal body and sandwiches the chip component. A width, a protrusion length, or a protrusion area of one of the pair of holding pieces is different from that of the other holding piece.

公开(公告)号：US10796854B2

公开(公告)日：2020-10-06

申请号：US16353747

申请日：2019-03-14

Applicant: TDK CORPORATION

Inventor： Norihisa Ando ,  Sunao Masuda ,  Masahiro Mori ,  Kayou Matsunaga ,  Kosuke Yazawa

IPC: H01G4/248 ,  H01G4/38 ,  H01G4/224 ,  H01G4/30 ,  H01G4/12

Abstract: An electronic device includes a chip component and a metal terminal. The chip component includes a terminal electrode formed on an element body. The metal terminal is connectable with the terminal electrode of the chip component. The metal terminal includes a terminal body and a pair of holding pieces. The terminal body faces an end surface of the terminal electrode of the chip component. The holding pieces are formed on the terminal body. A connection member configured to connect the terminal body and the end surface of the terminal body exists in a joint region between the terminal body and the end surface of the terminal electrode. A pair of reinforcement pieces is formed on the terminal body so as not to overlap with the joint region in a direction extending from one to the other of the pair of holding pieces.

公开(公告)号：US10559426B2

公开(公告)日：2020-02-11

申请号：US15938561

申请日：2018-03-28

Applicant: TDK CORPORATION

Inventor： Norihisa Ando ,  Sunao Masuda ,  Masahiro Mori ,  Kayou Matsunaga ,  Kosuke Yazawa

IPC: H01G4/232 ,  H01G4/30 ,  H01G2/06 ,  H01G4/12

Abstract: An electronic device includes a chip component and an external terminal. The chip component includes a terminal electrode formed on an end surface of a ceramic element body containing an internal electrode. The external terminal includes a first end electrically connected with the terminal electrode and a second end disposed opposite to the first end and connected with a mounting surface. The external terminal includes a first metal and a second metal different from the first metal. The first metal and the second metal are alternately exposed on a surface of the external terminal.

公开(公告)号：US11984260B2

公开(公告)日：2024-05-14

申请号：US17133102

申请日：2020-12-23

Applicant: TDK CORPORATION

Inventor： Akihiro Masuda ,  Shinya Ito ,  Norihisa Ando ,  Kosuke Yazawa ,  Yoshiki Satou ,  Katsumi Kobayashi ,  Koji Utsui ,  Koji Kaneko

IPC: H01G4/224 ,  H01G2/06 ,  H01G4/228

CPC classification number: H01G2/065 ,  H01G4/224 ,  H01G4/228

Abstract: An electronic device includes a chip component, a conductive terminal, a case, and a fixation part. The chip component includes a terminal electrode on an end surface of the chip component. The conductive terminal is connected to the terminal electrode. The case includes an accommodation recess for accommodating the chip component. The fixation part fixes the case to an installation portion.

公开(公告)号：US11594379B2

公开(公告)日：2023-02-28

申请号：US17494538

申请日：2021-10-05

Applicant: TDK CORPORATION

Inventor： Akihiro Masuda ,  Shinya Ito ,  Norihisa Ando ,  Tomoyuki Sasaki ,  Shinya Onodera

IPC: H01G4/38 ,  H01G4/224 ,  H01G4/30 ,  H01G2/08 ,  H01G2/06 ,  H01G4/12

Abstract: An electronic device includes a plurality of chip components and an insulating case. The chip components are arranged in a first direction. The case includes a plate portion, a first protrusion portion, and a second protrusion portion. The plate portion faces first side surfaces of the chip components. The first protrusion portion is formed along a plate-portion first side of the plate portion and protrudes from the plate portion toward a downside perpendicular to the first direction. The second protrusion portion is formed to the first protrusion portion in a second direction and protrudes from the plate portion toward the downside. A protrusion length of the first protrusion portion and the second protrusion portion from the plate portion toward the downside is smaller than a protrusion length of the chip component included in the chip components from the plate portion toward the downside.

公开(公告)号：US11495405B2

公开(公告)日：2022-11-08

申请号：US16816856

申请日：2020-03-12

Applicant: TDK Corporation

Inventor： Akihiro Masuda ,  Norihisa Ando ,  Shinya Ito ,  Kosuke Yazawa ,  Yoshiki Satou ,  Katsumi Kobayashi

IPC: H01G2/06 ,  H01G4/005 ,  H01G4/12 ,  H01G4/228 ,  H01G4/30

Abstract: An electronic component has capacitor chips where terminal electrodes are formed on both end surfaces, individual metal terminals connected to the terminal electrodes, an insulation case accommodating the capacitor chips, and a connecting portion interconnecting a plurality of the insulation cases.

公开(公告)号：US11222752B2

公开(公告)日：2022-01-11

申请号：US17063106

申请日：2020-10-05

Applicant: TDK CORPORATION

Inventor： Akihiro Masuda ,  Norihisa Ando ,  Shinya Ito

IPC: H01G4/248 ,  H01G4/232

Abstract: A ceramic electronic device includes a ceramic element body, a terminal electrode, and a lead terminal. The ceramic element body has an end surface and a lateral surface. The terminal electrode is formed on from the end surface to a part of the lateral surface of the ceramic element body. The lead terminal is connected to the terminal electrode by a connection member. The lead terminal includes an electrode facing portion disposed correspondingly to an end-surface electrode of the terminal electrode, an extension portion extending downward from a lower end of the electrode facing portion, and a step surface located between the electrode facing portion and the extension portion. The electrode facing portion has a first recess facing the terminal electrode. A part of the first recess reaches the step surface. Another part of the first recess is open outside the lead terminal.

公开(公告)号：US10804035B2

公开(公告)日：2020-10-13

申请号：US15819804

申请日：2017-11-21

Applicant: TDK CORPORATION

Inventor： Norihisa Ando ,  Katsumi Kobayashi ,  Sunao Masuda ,  Masahiro Mori ,  Kayou Matsunaga ,  Kosuke Yazawa

IPC: H01G4/30 ,  H01G4/38 ,  H01G4/232 ,  H01G4/228 ,  H01G4/248 ,  H01G2/06 ,  H01G4/008 ,  H01G4/12

Abstract: A ceramic electronic device includes multiple chip components and a pair of metal terminal portions. The chip components consist of a pair of chip end surfaces and four chip side surfaces. Terminal electrodes are formed on the pair of chip end surfaces. The pair of metal terminal portions is arranged correspondingly with the pair of chip end surfaces. Each of the pair of metal terminal portions includes an electrode face portion, multiple pairs of engagement arm portions, and a mount portion. The electrode face portion faces the chip end surface. The multiple pairs of engagement arm portions extend from the electrode face portion toward the chip side surface and sandwich and hold the chip components. The mount portion extends from one of terminal second sides toward the chip components and is partially substantially vertical to the electrode face portion.

公开(公告)号：US10566139B2

公开(公告)日：2020-02-18

申请号：US16162580

申请日：2018-10-17

Applicant: TDK CORPORATION

Inventor： Norihisa Ando ,  Sunao Masuda ,  Masahiro Mori ,  Kayou Matsunaga ,  Kosuke Yazawa

IPC: H01G4/232 ,  H01G4/12 ,  H01G4/008 ,  H01G4/30

Abstract: A ceramic electronic device includes a chip component, a metal terminal, and a conductive connection member. The component includes a terminal electrode surface on which a terminal electrode is formed. The metal terminal includes an opposing surface to the electrode surface. The connection member contains at least Sn and Sb and connects the terminal electrode surface and the opposing surface. The connection member includes a first part and a second part. In the first part, a distance between the terminal electrode surface and the opposing surface is a first distance, and Sb/Sn is a first value. In the second part, a distance between the terminal electrode surface and the opposing surface is a second distance being smaller than the first distance, and Sb/Sn is a second value being larger than the first value.