公开(公告)号：US11140781B2

公开(公告)日：2021-10-05

申请号：US16659621

申请日：2019-10-22

Applicant: TDK CORPORATION

Inventor： Kosuke Yazawa ,  Norihisa Ando ,  Shinya Ito ,  Akihiro Masuda

IPC: H01G4/224 ,  H01G4/236 ,  H05K1/18 ,  H05K5/00 ,  H01G4/232 ,  H01G4/30 ,  H05K5/02

Abstract: An electronic device includes chip components, a terminal connection body, conductive terminals, and a support member. Each of the chip components has a pair of end surfaces on which terminal electrodes are formed. The terminal connection body connects the terminal electrodes on one side of the chip components arranged next to each other in a parallel direction to the end surfaces. Each of the conductive terminals includes a connection part and a mount part. The connection part is connected with the terminal electrode of either of the chip components located on both ends of the chip components connected in series via the terminal connection body. The mount part faces the connection part and is connected with a mount board. The support member is disposed between the connection parts and the mount parts. The chip components are arranged so that the end surfaces face the mount board.

公开(公告)号：US10943739B2

公开(公告)日：2021-03-09

申请号：US16430858

申请日：2019-06-04

Applicant: TDK CORPORATION

Inventor： Shinya Ito ,  Akitoshi Yoshii ,  Kenichi Inoue ,  Yoshiki Satou

IPC: H01G4/38 ,  H01G4/228 ,  H01G4/224 ,  H01G2/10 ,  H01G4/30

Abstract: A plurality of electronic elements 3 are arranged in a second direction D2 orthogonal to a first direction D1 which is a facing direction of external electrodes 3b and 3c forming a pair in the first electronic element group 5A and the second electronic element group 5B. The first electronic element group SA and the second electronic element group 5B are disposed side by side in the first direction D1. The first terminal 7 is disposed between the first electronic element group 5A and the second electronic element group 5B in the first direction D1. The second terminals 9 and 11 are disposed at positions with the first electronic element group 5A and the second electronic element group 5B respectively interposed between the second terminals and the first terminal 7 in the first direction D1.

公开(公告)号：US11984260B2

公开(公告)日：2024-05-14

申请号：US17133102

申请日：2020-12-23

Applicant: TDK CORPORATION

Inventor： Akihiro Masuda ,  Shinya Ito ,  Norihisa Ando ,  Kosuke Yazawa ,  Yoshiki Satou ,  Katsumi Kobayashi ,  Koji Utsui ,  Koji Kaneko

IPC: H01G4/224 ,  H01G2/06 ,  H01G4/228

CPC classification number: H01G2/065 ,  H01G4/224 ,  H01G4/228

Abstract: An electronic device includes a chip component, a conductive terminal, a case, and a fixation part. The chip component includes a terminal electrode on an end surface of the chip component. The conductive terminal is connected to the terminal electrode. The case includes an accommodation recess for accommodating the chip component. The fixation part fixes the case to an installation portion.

公开(公告)号：US11594379B2

公开(公告)日：2023-02-28

申请号：US17494538

申请日：2021-10-05

Applicant: TDK CORPORATION

Inventor： Akihiro Masuda ,  Shinya Ito ,  Norihisa Ando ,  Tomoyuki Sasaki ,  Shinya Onodera

IPC: H01G4/38 ,  H01G4/224 ,  H01G4/30 ,  H01G2/08 ,  H01G2/06 ,  H01G4/12

Abstract: An electronic device includes a plurality of chip components and an insulating case. The chip components are arranged in a first direction. The case includes a plate portion, a first protrusion portion, and a second protrusion portion. The plate portion faces first side surfaces of the chip components. The first protrusion portion is formed along a plate-portion first side of the plate portion and protrudes from the plate portion toward a downside perpendicular to the first direction. The second protrusion portion is formed to the first protrusion portion in a second direction and protrudes from the plate portion toward the downside. A protrusion length of the first protrusion portion and the second protrusion portion from the plate portion toward the downside is smaller than a protrusion length of the chip component included in the chip components from the plate portion toward the downside.

公开(公告)号：US11495405B2

公开(公告)日：2022-11-08

申请号：US16816856

申请日：2020-03-12

Applicant: TDK Corporation

Inventor： Akihiro Masuda ,  Norihisa Ando ,  Shinya Ito ,  Kosuke Yazawa ,  Yoshiki Satou ,  Katsumi Kobayashi

IPC: H01G2/06 ,  H01G4/005 ,  H01G4/12 ,  H01G4/228 ,  H01G4/30

Abstract: An electronic component has capacitor chips where terminal electrodes are formed on both end surfaces, individual metal terminals connected to the terminal electrodes, an insulation case accommodating the capacitor chips, and a connecting portion interconnecting a plurality of the insulation cases.

公开(公告)号：US11222752B2

公开(公告)日：2022-01-11

申请号：US17063106

申请日：2020-10-05

Applicant: TDK CORPORATION

Inventor： Akihiro Masuda ,  Norihisa Ando ,  Shinya Ito

IPC: H01G4/248 ,  H01G4/232

Abstract: A ceramic electronic device includes a ceramic element body, a terminal electrode, and a lead terminal. The ceramic element body has an end surface and a lateral surface. The terminal electrode is formed on from the end surface to a part of the lateral surface of the ceramic element body. The lead terminal is connected to the terminal electrode by a connection member. The lead terminal includes an electrode facing portion disposed correspondingly to an end-surface electrode of the terminal electrode, an extension portion extending downward from a lower end of the electrode facing portion, and a step surface located between the electrode facing portion and the extension portion. The electrode facing portion has a first recess facing the terminal electrode. A part of the first recess reaches the step surface. Another part of the first recess is open outside the lead terminal.