公开(公告)号：US10943739B2

公开(公告)日：2021-03-09

申请号：US16430858

申请日：2019-06-04

Applicant: TDK CORPORATION

Inventor： Shinya Ito ,  Akitoshi Yoshii ,  Kenichi Inoue ,  Yoshiki Satou

IPC: H01G4/38 ,  H01G4/228 ,  H01G4/224 ,  H01G2/10 ,  H01G4/30

Abstract: A plurality of electronic elements 3 are arranged in a second direction D2 orthogonal to a first direction D1 which is a facing direction of external electrodes 3b and 3c forming a pair in the first electronic element group 5A and the second electronic element group 5B. The first electronic element group SA and the second electronic element group 5B are disposed side by side in the first direction D1. The first terminal 7 is disposed between the first electronic element group 5A and the second electronic element group 5B in the first direction D1. The second terminals 9 and 11 are disposed at positions with the first electronic element group 5A and the second electronic element group 5B respectively interposed between the second terminals and the first terminal 7 in the first direction D1.

公开(公告)号：US10984950B2

公开(公告)日：2021-04-20

申请号：US16987930

申请日：2020-08-07

Applicant: TDK CORPORATION

Inventor： Norihisa Ando ,  Kenichi Inoue ,  Sunao Masuda ,  Masahiro Mori ,  Kayou Matsunaga ,  Kosuke Yazawa

IPC: H01G2/06 ,  H01G4/248 ,  H01G4/01 ,  H01G4/232 ,  H01G4/30 ,  H01G4/38 ,  H05K3/34 ,  H01G4/12

Abstract: A method of manufacturing an electronic device includes preparing a chip component with a terminal electrode. A terminal plate is prepared. A connection member is placed between an end surface of the terminal electrode and an inner surface of the terminal plate. The terminal plate and the terminal electrode are joined using the connection member by bringing a press head into contact with an outer surface of the terminal plate and pressing and heating the terminal plate against the terminal electrode.

公开(公告)号：US10777353B2

公开(公告)日：2020-09-15

申请号：US16121719

申请日：2018-09-05

Applicant: TDK CORPORATION

Inventor： Norihisa Ando ,  Kenichi Inoue ,  Sunao Masuda ,  Masahiro Mori ,  Kayou Matsunaga ,  Kosuke Yazawa

IPC: H01G2/06 ,  H01G4/232 ,  H01G4/01 ,  H01G4/30 ,  H01G4/38 ,  H05K3/34 ,  H01G4/248 ,  H01G4/12

Abstract: A method of manufacturing an electronic device includes preparing a chip component with a terminal electrode. A terminal plate is prepared. A connection member is placed between an end surface of the terminal electrode and an inner surface of the terminal plate. The terminal plate and the terminal electrode are joined using the connection member by bringing a press head into contact with an outer surface of the terminal plate and pressing and heating the terminal plate against the terminal electrode.