公开(公告)号：US12019111B2

公开(公告)日：2024-06-25

申请号：US16677581

申请日：2019-11-07

Applicant: TECHNOPROBE S.p.A.

Inventor： Roberto Crippa ,  Flavio Maggioni ,  Raffaele Vallauri

IPC: G01R31/00 ,  G01R1/073 ,  G01R3/00 ,  H05K3/00 ,  H05K3/40 ,  H05K3/46

CPC classification number: G01R3/00 ,  G01R1/07342 ,  H05K3/0029 ,  H05K3/4061 ,  H05K3/4679

Abstract: A method of manufacturing a multi-layer for a probe card comprises providing first contact pads on an exposed face of a first dielectric layer and second contact pads on an exposed face of a last dielectric layer. Each dielectric layer is laser ablated to realize pass-through structures and the pass-through structures are conductively filled to realize conductive structures. The dielectric layers are superimposed in a way that each conductive structure contacts a corresponding conductive structure of a contiguous dielectric layer in the multi-layer and forms conductive paths electrically connected the first and second contact pads. The second contact pads having a greater distance between its symmetry centers than the first contact pads, the multi-layer thus performing a spatial transformation between the first and second contact pads connected through the connective paths.

公开(公告)号：US11808788B2

公开(公告)日：2023-11-07

申请号：US17325783

申请日：2021-05-20

Applicant: TECHNOPROBE S.P.A.

Inventor： Flavio Maggioni

IPC: G01R1/073 ,  G01R1/067

CPC classification number: G01R1/07378 ,  G01R1/06772 ,  G01R1/07328 ,  G01R1/07357 ,  G01R1/07371

Abstract: A testing head apt to verify the operation of a device under test integrated on a semiconductor wafer includes a plurality of contact elements, each including a body that extends between a first end portion and a second end portion, and a guide provided with a plurality of guide holes apt to house the contact elements. The guide includes a conductive portion that includes and electrically connects the holes of a group of guide holes to each other and is apt to contact a corresponding group of contact elements apt to carry a same type of signal.

公开(公告)号：US20180024167A1

公开(公告)日：2018-01-25

申请号：US15718561

申请日：2017-09-28

Applicant: TECHNOPROBE S.p.A.

Inventor： Flavio Maggioni

IPC: G01R1/073

CPC classification number: G01R1/07378 ,  G01R1/06766 ,  G01R1/07342 ,  G01R31/2889 ,  H05K1/0231

Abstract: A probe card for a testing apparatus of electronic devices comprises at least one testing head housing a plurality of contact probes, each contact probe having at least one contact tip abutting onto contact pads of a device under test, as well as at least one space transformer realizing a spatial transformation of the distances between contact pads made on its opposite sides and connected by means of suitable conductive tracks or planes, as well as a plurality of filtering capacitors provided between the space transformer and a PCB, which comprises direct conductive tracks or planes contacting conductive portions of the filtering capacitors.