-
公开(公告)号：US12105118B2
公开(公告)日：2024-10-01
申请号：US17783452
申请日：2020-12-18
Applicant: TECHNOPROBE S.P.A.
Inventor： Roberto Crippa
IPC: G01R1/073
CPC classification number: G01R1/073
Abstract: A testing head for testing the functionality of an electronic device is disclosed having a plurality of contact probes including a probe body extended between respective end portions adapted to contact respective contact pads, a lower guide provided with guide holes for housing the contact probes, and a conductive portion in the lower guide. The conductive portion includes a group of the guide holes and is adapted to contact and short-circuit a corresponding group of contact probes housed in the group of holes. The contact probes housed in the group of holes include a deformable portion adapted to be partially inserted into the guide holes of the group. The deformable portion, when housed in the guide holes, is in a configuration in which it is deformed by the contact with a wall of the guide holes and exerts on the wall a reaction force ensuring a sliding contact during testing of the electronic device.
-
公开(公告)号：US12085588B2
公开(公告)日：2024-09-10
申请号：US17308636
申请日：2021-05-05
Applicant: Technoprobe S.p.A.
Inventor： Stefano Felici
IPC: G01R1/073
CPC classification number: G01R1/07342
Abstract: A probe head for testing a device under test includes an upper guide and a lower guide parallel to each other and spaced apart. Each of the guides is provided with a respective plurality of guide holes, a plurality of contact probes housed in the guide holes and provided each with a first end and with a second end, the first end being adapted to contact pads of a device under test. At least one additional guide is associated with one of the guides. The additional guide includes first guide holes, housing a first group of the contact probes, and second guide holes, housing a second group of the contact probes. The first and second guide holes are shifted with respect to the guide holes of the guide which said additional guide is associated with, and the shift of the first guide holes is in a direction opposite the shift of the second guide holes.
-
公开(公告)号：US12019111B2
公开(公告)日：2024-06-25
申请号：US16677581
申请日：2019-11-07
Applicant: TECHNOPROBE S.p.A.
Inventor： Roberto Crippa , Flavio Maggioni , Raffaele Vallauri
CPC classification number: G01R3/00 , G01R1/07342 , H05K3/0029 , H05K3/4061 , H05K3/4679
Abstract: A method of manufacturing a multi-layer for a probe card comprises providing first contact pads on an exposed face of a first dielectric layer and second contact pads on an exposed face of a last dielectric layer. Each dielectric layer is laser ablated to realize pass-through structures and the pass-through structures are conductively filled to realize conductive structures. The dielectric layers are superimposed in a way that each conductive structure contacts a corresponding conductive structure of a contiguous dielectric layer in the multi-layer and forms conductive paths electrically connected the first and second contact pads. The second contact pads having a greater distance between its symmetry centers than the first contact pads, the multi-layer thus performing a spatial transformation between the first and second contact pads connected through the connective paths.
-
公开(公告)号：US20240151744A1
公开(公告)日：2024-05-09
申请号：US18416771
申请日：2024-01-18
Applicant: TECHNOPROBE S.P.A.
Inventor： Flavio MAGGIONI
CPC classification number: G01R1/07378 , G01R1/06772 , G01R1/07328 , G01R1/07357 , G01R1/07371
Abstract: A testing head apt to verify the operation of a device under test integrated on a semiconductor wafer includes a plurality of contact elements, each including a body that extends between a first end portion and a second end portion, and a guide provided with a plurality of guide holes apt to house the contact elements. The guide includes a conductive portion that includes and electrically connects the holes of a group of guide holes to each other and is apt to contact a corresponding group of contact elements apt to carry a same type of signal.
-
公开(公告)号：US11808788B2
公开(公告)日：2023-11-07
申请号：US17325783
申请日：2021-05-20
Applicant: TECHNOPROBE S.P.A.
Inventor： Flavio Maggioni
CPC classification number: G01R1/07378 , G01R1/06772 , G01R1/07328 , G01R1/07357 , G01R1/07371
Abstract: A testing head apt to verify the operation of a device under test integrated on a semiconductor wafer includes a plurality of contact elements, each including a body that extends between a first end portion and a second end portion, and a guide provided with a plurality of guide holes apt to house the contact elements. The guide includes a conductive portion that includes and electrically connects the holes of a group of guide holes to each other and is apt to contact a corresponding group of contact elements apt to carry a same type of signal.
-
Patent Agency Ranking
公开(公告)号：US20230288447A1
公开(公告)日：2023-09-14
申请号：US18005880
申请日：2021-07-08
Applicant: TECHNOPROBE S.P.A.
Inventor： Stefano FELICI , Fabio MORGANA , Roberto CRIPPA
CPC classification number: G01R1/06738 , G01R1/06761 , H01R13/2492
Abstract: A contact probe for a probe head for test equipment of electronic devices is provided. The contact probe includes a first end portion and a second end portion configured to realize a contact with suitable contact structures, and a body portion extended along a longitudinal development axis between respective the first and second end portions. The first end portion includes a base portion, a peripherally protruding element protruding from the base portion, and a hollow part having a base at a surface of the base portion and being surrounded by the peripherally protruding element. In addition, the peripherally protruding element is configured to penetrate into the contact structures.
-
公开(公告)号：US11415600B2
公开(公告)日：2022-08-16
申请号：US17139782
申请日：2020-12-31
Applicant: Technoprobe S.p.A.
Inventor： Riccardo Vettori
Abstract: A probe card for testing a device under test having a plurality of contact pads includes a support plate having first contact pads thereon. A flexible membrane has a first face and a peripheral portion including second contact pads thereon. A plurality of contact probes are associated with a first face of the flexible membrane and are configured to abut onto the plurality of contact pads of the device under test. A sliding contact area includes: the first contact pads formed on the support plate; the second contact pads formed on the peripheral portion of the flexible membrane, the peripheral portion of the flexible membrane configured to come in pressing contact onto the support plate at the sliding contact area. A pressing element contacts the peripheral portion of the flexible membrane at the sliding contact area, and the pressing element puts the second contact pads into pressing contact with the first contact pads.
-
公开(公告)号：US20210318355A1
公开(公告)日：2021-10-14
申请号：US17357833
申请日：2021-06-24
Applicant: Technoprobe S.p.A.
Inventor： Stefano FELICI
IPC: G01R1/073
Abstract: A probe head for testing a device under test integrated on a semiconductor wafer includes a plurality of contact probes, each having a first end and a second end, and at least one first lower guide and one second lower guide at the first end. The guides are parallel to each other and have a respective plurality of first and second guide holes for slidingly housing the contact probes. At least one third lower guide is substantially parallel to the first lower guide and to the second lower guide and includes a plurality of third guide holes for slidingly housing the contact probes. The guide holes are disposed in a shifted arrangement to eliminate a scrub movement of the first ends of each contact probe of the probe head.
-
公开(公告)号：US20210063478A1
公开(公告)日：2021-03-04
申请号：US17098179
申请日：2020-11-13
Applicant: Technoprobe S.p.A.
Inventor： Riccardo VETTORI
Abstract: A probe card for a test equipment of electronic devices includes a flexible membrane configured to carry high frequency signals between a device under test and a support plate. The flexible membrane is connected to the support plate through a peripheral zone, and a damping structure is arranged between the support plate and the flexible membrane. A plurality of micro contact probes include a body extending between a first end and a second end, and the second end is configured to abut onto contact pads of the device under test, and the damping structure and the first ends of the micro contact probes are in contact with opposite faces of a same contact zone of the flexible membrane. The flexible membrane includes at least one weakening zone arranged between the contact zone and the peripheral zone.
-
公开(公告)号：US10782319B2
公开(公告)日：2020-09-22
申请号：US16219783
申请日：2018-12-13
Applicant: TECHNOPROBE S.P.A.
Inventor： Roberto Crippa , Stefano Felici
Abstract: A probe card for testing of electronic devices comprises a testing head with plural contact probes inserted into guide holes of an upper guide and a lower guide, and a space transformer, each of the contact probes having a first terminal portion projecting from the lower guide with a first length and ending with a contact tip adapted to abut onto a respective contact pad of a device to be tested, and a second terminal portion projecting from the upper guide with a second length and ending with a contact head adapted to abut onto a contact pad of the space transformer. The probe card comprises a spacer element interposed between the space transformer and the upper guide and removable to adjust the first length of the first terminal portion by changing the second length of the second terminal portion and approaching the upper guide and the space transformer.
-
-
-
-
-
-
-
-
-
Search Results
103
records
(took 0.021 seconds)
