公开(公告)号：US20210327829A1

公开(公告)日：2021-10-21

申请号：US16850620

申请日：2020-04-16

Applicant: Texas Instruments Incorporated

Inventor： Vivek Swaminathan Sridharan ,  Yiqi Tang ,  Christopher Daniel Manack ,  Rajen Manicon Murugan ,  Liang Wan ,  Hiep Xuan Nguyen

IPC: H01L23/60 ,  H01L23/495 ,  H01L33/62 ,  H01L23/00 ,  H01L33/00

Abstract: A system in a package (SIP) includes carrier layer regions that have a dielectric material with a metal post therethrough, where adjacent carrier layer regions define a gap. A driver IC die is positioned in the gap having nodes connected to bond pads exposed by openings in a top side of a first passivation layer, with the bond pads facing up. A dielectric layer is on the first passivation layer and carrier layer region that includes filled through vias coupled to the bond pads and to the metal post. A light blocking layer is on sidewalls and a bottom of the substrate. A first device includes a light emitter that has first bondable features. The light blocking layer can block at least 90% of incident light. The first bondable features are flipchip mounted to a first portion of the bond pads.

公开(公告)号：US20190157110A1

公开(公告)日：2019-05-23

申请号：US16254059

申请日：2019-01-22

Applicant: Texas Instruments Incorporated

Inventor： Hiep Xuan Nguyen

IPC: H01L21/56 ,  H01L23/00

CPC classification number: H01L21/561 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/3121 ,  H01L23/49537 ,  H01L24/48 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85005 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3511 ,  H01L2224/85

Abstract: An integrated circuit (“IC”) package mold includes an upper mold platen that defines an upper mold cavity for receiving an upper substrate having a die attach side with a plurality of dies mounted thereon and a non-attach side with no dies mounted thereon. The die attach side of the upper substrate faces upwardly. A lower mold platen defines a lower mold cavity for receiving a lower substrate having a die attach side with a plurality dies mounted thereon and a non-attach side with no dies mounted thereon. The die attach side of the lower substrate faces downwardly.