COMPOUND SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
    12.
    发明申请
    COMPOUND SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME 有权
    化合物半导体器件及其制造方法

    公开(公告)号:US20120139008A1

    公开(公告)日:2012-06-07

    申请号:US13396899

    申请日:2012-02-15

    IPC分类号: H01L29/778 H01L21/338

    摘要: An i-GaN layer (electron transit layer), an n-GaN layer (compound semiconductor layer) formed over the i-GaN layer (electron transit layer), and a source electrode, a drain electrode and a gate electrode formed over the n-GaN layer (compound semiconductor layer) are provided. A recess portion is formed inside an area between the source electrode and the drain electrode of the n-GaN layer (compound semiconductor layer) and at a portion separating from the gate electrode.

    摘要翻译: 在i-GaN层(电子传输层)上形成的i-GaN层(电子迁移层),n-GaN层(化合物半导体层)以及形成在n-GaN层上的源电极,漏电极和栅电极 -GaN层(化合物半导体层)。 在n-GaN层(化合物半导体层)的源电极和漏电极之间的区域内以及与栅电极分离的部分的内部形成有凹部。