公开(公告)号：US20210233829A1

公开(公告)日：2021-07-29

申请号：US17227790

申请日：2021-04-12

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hao-Jan Pei ,  Wei-Yu Chen ,  Chia-Shen Cheng ,  Chih-Chiang Tsao ,  Cheng-Ting Chen ,  Chia-Lun Chang ,  Chih-Wei Lin ,  Hsiu-Jen Lin ,  Ching-Hua Hsieh ,  Chung-Shi Liu

IPC: H01L23/373 ,  H01L23/50 ,  H01L23/00 ,  H01L21/56 ,  H01L21/48 ,  H01L23/31 ,  H01L25/10 ,  H01L23/367 ,  H01L23/538

Abstract: A semiconductor structure includes a die embedded in a molding material, the die having die connectors on a first side; a first redistribution structure at the first side of the die, the first redistribution structure being electrically coupled to the die through the die connectors; a second redistribution structure at a second side of the die opposing the first side; and a thermally conductive material in the second redistribution structure, the die being interposed between the thermally conductive material and the first redistribution structure, the thermally conductive material extending through the second redistribution structure, and the thermally conductive material being electrically isolated.

公开(公告)号：US20200152616A1

公开(公告)日：2020-05-14

申请号：US16740463

申请日：2020-01-12

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hsuan-Ting Kuo ,  Ching-Hua Hsieh ,  Cheng-Ting Chen ,  Hsiu-Jen Lin ,  Hao-Jan Pei ,  Yu-Peng Tsai ,  Chia-Lun Chang ,  Chih-Chiang Tsao ,  Philip Yu-Shuan Chung

IPC: H01L25/00 ,  H01L23/522 ,  H01L27/06 ,  H01L23/00 ,  H01L23/31 ,  H01L21/768 ,  H01L21/683 ,  H01L21/56

Abstract: A manufacturing method of a package-on-package structure includes at least the following steps. A plurality of conductive bumps of a first package is attached to a tape carrier. A second package is coupled to the first package opposite to the plurality of conductive bumps. When coupling the second package, the plurality of conductive bumps are deformed to form a plurality of deformed conductive bumps, and a contact area between the tape carrier and the respective deformed conductive bump increases.