公开(公告)号：US11282793B2

公开(公告)日：2022-03-22

申请号：US16046399

申请日：2018-07-26

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Shih Ting Lin ,  Szu-Wei Lu ,  Jing-Cheng Lin ,  Chen-Hua Yu

IPC: H01L23/538 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/532

Abstract: A method of forming a package assembly includes forming a first dielectric layer over a carrier substrate; forming a conductive through-via over the first dielectric layer; treating the conductive through-via with a first chemical, thereby roughening surfaces of the conductive through-via; and molding a device die and the conductive through-via in a molding material.

公开(公告)号：US20170352626A1

公开(公告)日：2017-12-07

申请号：US15175696

申请日：2016-06-07

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Shih Ting Lin ,  Szu-Wei Lu ,  Jing-Cheng Lin ,  Chen-Hua Yu

IPC: H01L23/538 ,  H01L23/31 ,  H01L21/56 ,  H01L23/532 ,  H01L21/48

CPC classification number: H01L23/5389 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/565 ,  H01L21/568 ,  H01L23/3114 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/53228 ,  H01L23/5384 ,  H01L23/5386 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/19 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/15311 ,  H01L2924/00014

Abstract: A method of forming a package assembly includes forming a first dielectric layer over a carrier substrate; forming a conductive through-via over the first dielectric layer; treating the conductive through-via with a first chemical, thereby roughening surfaces of the conductive through-via; and molding a device die and the conductive through-via in a molding material.