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公开(公告)号：US20110239671A1
公开(公告)日：2011-10-06
申请号：US13058576
申请日：2011-02-01
CPC分类号： H05K7/2079
摘要： A method of providing cooling by a cooling system to a computer data center. The method includes providing a plurality of air-and-water radiators and one or more chillers, the chillers each having a first side in fluid communication with a chilled water loop and a second side in communication with a condenser water loop. The method also includes circulating a first portion of return water coming from the computer data center to a first subset of the air-and-water radiators and through the condenser water loop, circulating a second portion of the return water from the computer data center to a second subset of the air-and-water radiators and through the chilled water loop, and circulating the first portion and the second portion of the return water to the computer data center as cooled supply water.
摘要翻译： 一种通过冷却系统向计算机数据中心提供冷却的方法。 该方法包括提供多个空气 - 水分散器和一个或多个冷却器，所述冷却器各自具有与冷水循环流体连通的第一侧和与冷凝器水回路连通的第二侧。 该方法还包括将来自计算机数据中心的回流水的第一部分循环到空气和水 - 水散热器的第一子集，并通过冷凝器水循环，将第二部分回水从计算机数据中心循环到 空气和水分散热器的第二子集，并通过冷水循环，并将回水的第一部分和第二部分循环到计算机数据中心作为冷却的供水。
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公开(公告)号：US20080104430A1
公开(公告)日：2008-05-01
申请号：US11590320
申请日：2006-10-31
IPC分类号： G06F1/00
CPC分类号： G06F1/3203
摘要： A server manages power and performance. The server comprises a plurality of processor and associated storage and input/output interface components, arranged into a plurality of independent compute cells. One or more performance metrics descriptive of performance of the independent compute cell plurality are selected and an optimization evaluation of the one or more performance metrics is performed. The independent compute cell plurality is tuned based on the optimization evaluation.
摘要翻译： 服务器管理电源和性能。 服务器包括多个处理器和相关联的存储和输入/输出接口组件，被布置成多个独立的计算单元。 选择描述独立计算单元多个的性能的一个或多个性能指标，并执行一个或多个性能度量的优化评估。 基于优化评估来调整独立的计算单元多个。
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公开(公告)号：US07342786B2
公开(公告)日：2008-03-11
申请号：US11258849
申请日：2005-10-25
IPC分类号： H05K7/20
CPC分类号： H05K7/20727
摘要： A cooling apparatus comprises a printed circuit board and an air duct positioned adjacent the printed circuit board spanning space and forming an air-guiding channel from at least one system fan to at least one heat sink. The air-guiding channel is bounded on one side by the printed circuit board and on remaining sides by the air duct that compresses against the printed circuit board in a substantially airtight seal.
摘要翻译： 冷却装置包括印刷电路板和邻近印刷电路板跨越空间定位的空气通道，并且形成从至少一个系统风扇到至少一个散热器的空气引导通道。 空气引导通道在一侧由印刷电路板限定，并且其余侧面被空气管道封闭，空气管道以基本上气密的密封件压靠印刷电路板。
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公开(公告)号：US07140422B2
公开(公告)日：2006-11-28
申请号：US10246299
申请日：2002-09-17
IPC分类号： F28D15/00
CPC分类号： H01L23/427 , F28D15/0275 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： A heat sink includes a heat pipe and a base adapted to allow the heat pipe to directly contact a component. By directly contacting the component, thermal efficiency is increased. Furthermore, increasing the surface area of the heat pipe that is in direct contact with the component also increases thermal efficiency.
摘要翻译： 散热器包括热管和适于允许热管直接接触部件的底座。 通过直接接触组件，热效率提高。 此外，增加与部件直接接触的热管的表面积也提高了热效率。
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公开(公告)号：US06989990B2
公开(公告)日：2006-01-24
申请号：US10835961
申请日：2004-04-29
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , G06F2200/201
摘要： A cylindrical tubing hinge extends around and couples two segments of rigid or semi-rigid tubing and enables rotational motion of one segment relative to the other.
摘要翻译： 圆柱形管铰链围绕并连接两段刚性或半刚性管道并且使一个段相对于另一段能够旋转运动。
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16.发明授权公开(公告)号：US06927976B1
公开(公告)日：2005-08-09
申请号：US10759846
申请日：2004-01-15
IPC分类号： H05K7/20
CPC分类号： H05K7/20727
摘要： An airflow management apparatus is used in an electronic system and includes a flexible air baffle that mounts on a chassis of an electronic device in an arrangement and obstructs air flow between an air inlet vent and an air exhaust vent of the electronic device. The flexible air baffle has a thickness that extends across a gap to contact an adjacent vertically-stacked electronic device.
摘要翻译： 气流管理装置用于电子系统中，并且包括柔性空气挡板，其安装在电子装置的底盘上并且阻碍电子装置的进气口和排气口之间的空气流动。 柔性空气挡板具有穿过间隙延伸以接触相邻的垂直堆叠的电子设备的厚度。
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公开(公告)号：US06894900B2
公开(公告)日：2005-05-17
申请号：US10246322
申请日：2002-09-17
IPC分类号： F28D15/02 , F28F1/32 , F28F3/02 , H01L23/427 , H05K7/20
CPC分类号： F21V29/51 , F21V29/74 , F28D15/0275 , F28F1/32 , F28F3/02 , H01L23/427 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： A heat sink includes at least one heat pipe attached to a base having a substantially flat region for interfacing with an electronic component. Additionally, the heat sink comprises fins attached to the base and at least one heat pipe. The fins and the base may be integral with or attached to each other. Such a heat sink can dissipate heat from one or more electronic components more efficiently as the heat pipe coupled with the fins attached to the base provide alternate heat transfer paths for heat generated by electronic components.
摘要翻译： 散热器包括附接到基座的至少一个热管，其具有用于与电子部件接口的基本上平坦的区域。 此外，散热器包括附接到基座和至少一个热管的翅片。 翅片和基座可以彼此成一体或相互连接。 这样的散热器可以更有效地散发来自一个或多个电子部件的热量，因为与连接到基座的散热片耦合的热管为电子部件所产生的热量提供了交替的传热路径。
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公开(公告)号：US06817196B2
公开(公告)日：2004-11-16
申请号：US10384456
申请日：2003-03-07
IPC分类号： F28D300
CPC分类号： G06F1/20 , F25D19/00 , F28D15/06 , G06F2200/201 , H01L23/4735 , H01L2924/0002 , H01L2924/00
摘要： A cooling system for cooling one or more components that produce heat. The cooling system includes sprayers configured to spray cooling fluid toward the components. A detection system includes a radiation source and a radiation sensor that pass radiant energy in the vicinity of the component such that the radiant energy is affected by passing through the vaporizing spray coolant. A controller controls the flow rates of the sprayers in response to levels of radiant energy detected by the radiation sensor, allowing the controller to more accurately control the wall temperature and cooling regime achieved by the spray cooling. The source and sensor are aimable or otherwise configured for gathering information for different thermal zones of the component, providing the controller with information that is helpful in separately controlling the wall temperature and/or cooling regime in each zone.
摘要翻译： 用于冷却产生热量的一个或多个部件的冷却系统。 冷却系统包括喷雾器，其构造成朝向部件喷射冷却流体。 检测系统包括辐射源和辐射传感器，辐射源和辐射传感器在组件附近传递辐射能，使得辐射能量通过蒸发的喷射冷却剂而受到影响。 控制器响应于由辐射传感器检测到的辐射能量的水平来控制喷雾器的流量，从而允许控制器更精确地控制通过喷雾冷却实现的壁温和冷却状态。 源和传感器是可瞄准的或以其他方式配置用于收集组件的不同热区的信息，为控制器提供有助于单独控制每个区域中的壁温和/或冷却状态的信息。
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公开(公告)号：US09003821B2
公开(公告)日：2015-04-14
申请号：US13058576
申请日：2011-02-01
CPC分类号： H05K7/2079
摘要： A method of providing cooling by a cooling system to a computer data center. The method includes providing a plurality of air-and-water radiators and one or more chillers, the chillers each having a first side in fluid communication with a chilled water loop and a second side in communication with a condenser water loop. The method also includes circulating a first portion of return water coming from the computer data center to a first subset of the air-and-water radiators and through the condenser water loop, circulating a second portion of the return water from the computer data center to a second subset of the air-and-water radiators and through the chilled water loop, and circulating the first portion and the second portion of the return water to the computer data center as cooled supply water.
摘要翻译： 一种通过冷却系统向计算机数据中心提供冷却的方法。 该方法包括提供多个空气 - 水分散器和一个或多个冷却器，所述冷却器各自具有与冷水循环流体连通的第一侧和与冷凝器水回路连通的第二侧。 该方法还包括将来自计算机数据中心的回流水的第一部分循环到空气和水 - 水散热器的第一子集，并通过冷凝器水循环，将第二部分回水从计算机数据中心循环到 空气和水分散热器的第二子集，并通过冷水循环，并将回水的第一部分和第二部分循环到计算机数据中心作为冷却的供水。
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20.发明授权Method of a supporting a CGA integrated package on a circuit board with improved shock and vibration isolation 失效在电路板上支持CGA集成封装的方法，具有改进的冲击和振动隔离公开(公告)号：US07185423B2
公开(公告)日：2007-03-06
申请号：US10929168
申请日：2004-08-30
IPC分类号： H05K3/30
CPC分类号： H05K3/301 , H05K3/3436 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , Y10T29/49169 , Y10T29/53174 , Y10T29/53178 , Y10T29/53265 , Y10T428/233 , Y10T428/238
摘要： A method of improving shock and vibration isolation of a CGA integrated package which utilizes solder column grid arrays and that includes a substrate and a package lid, includes providing a support frame attached at an attachment point to the substrate or the package lid and at a second attachment point to the circuit board. Isolation material is provided at the attachment point of the support frame to the substrate or package lid, or at the second attachment point of the support frame to the circuit board.
摘要翻译： 一种改进CGA集成封装的冲击和振动隔离的方法，其利用焊料柱网格阵列并且包括衬底和封装盖，包括提供在附接点处附接到衬底或封装盖的支撑框架，并且在第二 连接点到电路板。 隔离材料在支撑框架的附接点处设置到基板或封装盖，或者在支撑框架的第二附接点处设置到电路板。
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