公开(公告)号：US20240090178A1

公开(公告)日：2024-03-14

申请号：US18511206

申请日：2023-11-16

Applicant: Munters Corporation

Inventor： Michael Boucher ,  Rafael Neuwald ,  Bryan Keith Dunnavant ,  John Roberts ,  Paul A. Dinnage ,  Wei Fang

IPC: H05K7/20 ,  F25B25/00 ,  F25B41/31 ,  F25B41/40 ,  F28D15/02 ,  F28D15/06

CPC classification number: H05K7/208 ,  F25B25/005 ,  F25B41/31 ,  F25B41/40 ,  F28D15/0266 ,  F28D15/0275 ,  F28D15/06 ,  H05K7/20309 ,  H05K7/20318

Abstract: A cooling assembly includes an evaporator containing a primary cooling medium, a passive condenser, and a heat exchanger. When a secondary cooling medium is provided to the heat exchanger, the primary cooling medium in the gas phase switches from being received by the passive condenser to the heat exchanger without operating any valves located between the evaporator and the passive condenser and between the evaporator and the heat exchanger. The primary cooling medium circulates between the evaporator and the passive condenser and between the evaporator and the heat exchanger by natural circulation and gravity without a pump in the flow path of the primary cooling medium between the heat exchanger and the evaporator and between the passive condenser and the evaporator to circulate the primary cooling medium.

公开(公告)号：US20190198954A1

公开(公告)日：2019-06-27

申请号：US16293844

申请日：2019-03-06

Applicant: DENSO CORPORATION

Inventor： Koji MIURA ,  Yasumitsu OMI ,  Masayuki TAKEUCHI ,  Takeshi YOSHINORI ,  Takashi YAMANAKA ,  Yoshiki KATO

IPC: H01M10/6569 ,  B60K11/02 ,  F28D15/06 ,  H01M10/613 ,  H01M10/615 ,  H01M10/625 ,  H01M10/6556 ,  H01M10/6571 ,  H01M10/663

CPC classification number: H01M10/6569 ,  B60K11/02 ,  F28D15/02 ,  F28D15/06 ,  H01M10/613 ,  H01M10/615 ,  H01M10/625 ,  H01M10/633 ,  H01M10/643 ,  H01M10/647 ,  H01M10/6556 ,  H01M10/6571 ,  H01M10/663 ,  H01M10/667 ,  H01M2220/20

Abstract: A device temperature regulator is provided with a device heat exchanger that functions as an evaporator at the time of cooling a temperature regulation target device and that functions as a heat radiator at the time of warming up the temperature regulation target device, and a condenser that condenses a gaseous working fluid. The device temperature regulator is provided with a heater that heats the working fluid collecting in a device fluid circuit, and a liquid amount regulator that regulates a liquid amount of the working fluid collecting in the device heat exchanger. The device heat exchanger includes a heat exchange portion that exchanges heat with the temperature regulation target device. The liquid amount regulator regulates the liquid amount of the liquid working fluid collecting in the device heat exchanger.

公开(公告)号：US20190186842A1

公开(公告)日：2019-06-20

申请号：US16215648

申请日：2018-12-11

Applicant: ASIA VITAL COMPONENTS CO., LTD.

Inventor： Kuei-Feng Chiang

IPC: F28D15/06 ,  F28F21/04 ,  F28D15/04

CPC classification number: F28D15/043 ,  B81B1/00 ,  C23C24/08 ,  C25D5/00 ,  F28D15/0233 ,  F28D15/0266 ,  F28D15/06 ,  F28F21/04 ,  F28F21/083 ,  F28F21/084 ,  F28F21/085 ,  F28F21/086 ,  F28F21/087 ,  H01L23/3731 ,  H01L23/3736 ,  H01L23/3737 ,  H01L23/427 ,  H05K7/20336

Abstract: A method for manufacturing a heat dissipation device is disclosed. The heat dissipation device includes a first basic structural body having a wick structure formed on one side surface thereof; and the first basic structural body and the wick structure are structural bodies formed layer by layer. Two pieces of first basic structural bodies can be correspondingly closed together to construct a heat dissipation device internally defining an airtight chamber. In this manner, the heat dissipation device can be designed and manufactured in a more flexible manner.

公开(公告)号：US20190186840A1

公开(公告)日：2019-06-20

申请号：US16215645

申请日：2018-12-11

Applicant: ASIA VITAL COMPONENTS CO.,LTD.

Inventor： Kuei-Feng Chiang

IPC: F28D15/04 ,  H05K7/20

CPC classification number: F28D15/043 ,  B81B1/00 ,  C23C24/08 ,  C25D5/00 ,  F28D15/0233 ,  F28D15/0266 ,  F28D15/06 ,  F28F21/04 ,  F28F21/083 ,  F28F21/084 ,  F28F21/085 ,  F28F21/086 ,  F28F21/087 ,  H01L23/3731 ,  H01L23/3736 ,  H01L23/3737 ,  H01L23/427 ,  H05K7/20336

Abstract: A basic structural body for constructing heat dissipation device and a heat dissipation device are disclosed. The heat dissipation device includes a first basic structural body having a wick structure formed on one side surface thereof; and the first basic structural body and the wick structure are structural bodies formed layer by layer. Two pieces of first basic structural bodies can be correspondingly closed together to construct a heat dissipation device internally defining an airtight chamber. In this manner, the heat dissipation device can be designed in a more flexible manner.

公开(公告)号：US10060681B2

公开(公告)日：2018-08-28

申请号：US15271777

申请日：2016-09-21

Applicant: University of Louisville Research Foundation, Inc.

Inventor： M. Keith Sharp ,  Brian S. Robinson

IPC: F28D15/02 ,  F28D15/06 ,  F24S60/30 ,  F24S20/66

CPC classification number: F28D15/02 ,  F24S10/90 ,  F24S20/66 ,  F24S60/30 ,  F28D15/06 ,  Y02B10/20 ,  Y02E10/44

Abstract: A heat pipe augmented passive solar space heating system modulates the temperature inside a building structure, particular during heating seasons when the ambient temperature is below levels customarily associated with adequate room comfort, and in some embodiments comprises a solar absorber, a heat pipe surrounding wholly or partially by insulation, the heat pipe having three main sections which are an evaporator at one end proximal to the solar absorber, a condenser at the other end proximal to an interior room being heated, and a rubber adiabatic section between those. Additional aspects such as a mechanical valve in the adiabatic section are disclosed to limit unwanted thermal gains when cooling is needed because the ambient temperatures already exceed room comfort.

公开(公告)号：US20180231327A1

公开(公告)日：2018-08-16

申请号：US15429754

申请日：2017-02-10

Applicant: HAMILTON SUNDSTRAND CORPORATION

Inventor： Wei-Lin Cho ,  Gary A. Adamson

IPC: F28D15/06 ,  F28D15/02 ,  F28D15/04 ,  F28F27/02

CPC classification number: F28D15/06 ,  F28D15/025 ,  F28D15/0258 ,  F28D15/0266 ,  F28D15/04 ,  F28D15/043 ,  F28F27/02

Abstract: A system may include a pump, an evaporator, a condenser, an accumulator, a pump bypass line, a first valve, and a second valve. The system may operate in a powered-pump mode, in which the pump drives fluid circulation, the first valve prevents fluid circulation through the pump bypass line, the pump pumps liquid from the accumulator to the evaporator, gas exiting the evaporator flows to the condenser, liquid exiting the evaporator flows through the second valve to the accumulator, and liquid exiting the condenser flows to the accumulator. The system may operate in a passive-capillary mode, in which capillary pressure in the evaporator drives fluid circulation, the first valve prevents fluid circulation through the pump, liquid flows from the accumulator, through the pump bypass line, and to the evaporator, gas exiting the evaporator flows to the condenser, the second valve is closed, and liquid exiting the condenser flows the accumulator.

公开(公告)号：US20180199016A1

公开(公告)日：2018-07-12

申请号：US15854482

申请日：2017-12-26

Applicant: SEIKO EPSON CORPORATION

Inventor： Katsuya SHIMIZU

IPC: H04N9/31 ,  F28D15/04 ,  F28D15/02 ,  F28D15/06

CPC classification number: H04N9/3144 ,  F28D15/0266 ,  F28D15/043 ,  F28D15/06 ,  G02F1/133385 ,  G03B21/16 ,  H01L23/427 ,  H04N9/3155 ,  H04N9/3194

Abstract: A heat transport device includes a loop heat pipe configured in the form of a loop, and a control unit configured to control an amount of heat generated by a heat generating part when the loop heat pipe starts up. The loop heat pipe includes an evaporating unit configured to receive heat of a heat generating part as a cooling target and evaporate a hydraulic fluid, a condensing unit configured to radiate heat and condense vapor obtained by evaporation of the hydraulic fluid, a vapor pipe which connects the evaporating unit and the condensing unit to each other, and a liquid pipe which connects the condensing unit and the evaporating unit to each other.

公开(公告)号：US10001327B2

公开(公告)日：2018-06-19

申请号：US15327055

申请日：2015-09-23

Applicant: DENSO CORPORATION

Inventor： Takuya Fuse ,  Yasushi Kouno ,  Shinya Kasamatsu

IPC: F28D15/00 ,  F28D20/02 ,  C09K5/02 ,  B60H1/00 ,  C01G31/02 ,  C09K5/04 ,  F01P3/20 ,  F28D20/00 ,  F28D21/00

CPC classification number: F28D20/02 ,  B60H1/00314 ,  B60H1/00492 ,  B60H1/04 ,  C01G31/02 ,  C01P2006/36 ,  C09K5/02 ,  C09K5/048 ,  F01P3/20 ,  F28D15/0266 ,  F28D15/06 ,  F28D20/0056 ,  F28D2020/0013 ,  F28D2021/008 ,  F28D2021/0094 ,  Y02E60/142 ,  Y02E60/145

Abstract: A heat storing system includes: a heat source that emits heat to a first thermal medium; and a heat storing unit. The heat storing unit includes a heat storing body container housing a heat storing body, and a thermal medium container housing a liquid phase thermal medium. The heat storing body stores or emits heat in accordance with phase change of the heat storing body. The heat storing unit is configured to conduct a cold heat emission mode in which the liquid phase thermal medium and a cooling medium exchange heat in the thermal medium container to evaporate the thermal medium such that cold heat is emitted to the cooling medium.

公开(公告)号：US09897391B2

公开(公告)日：2018-02-20

申请号：US14222554

申请日：2014-03-21

Applicant: BEIJING TERASOLAR ENERGY TECHNOLOGIES CO., LTD.

Inventor： Yang Liu

IPC: F28D15/04 ,  F24J2/07 ,  F24J2/04 ,  F28D15/06 ,  F28D15/02 ,  F24J2/18 ,  F24J2/10 ,  F24J2/32 ,  C09K5/04

CPC classification number: F28D15/04 ,  C09K5/04 ,  F24S10/25 ,  F24S10/90 ,  F24S20/20 ,  F24S23/79 ,  F24S2023/872 ,  F28D15/0266 ,  F28D15/043 ,  F28D15/046 ,  F28D15/06 ,  F28F2260/00 ,  Y02E10/41 ,  Y02E10/44

Abstract: The invention provides a phase transformation heat exchange device. The device includes an inner tube, an outer tube, and a heat exchange medium; the space between the inner tube and the outer tube forms a whole or a part of a liquid phase region; a whole or a part of space inside the inner tube forms a vaporization region; the heat exchange medium with a relatively high pressure inside the liquid phase region enters the vaporization region with a relatively low pressure while being heated in vortex flow, and flows out of the device after being vapored, so as to complete heat exchange. The device can be applied to DSG systems of the solar energy photothermal field, and can also be applied to an input-output system of a heat storage system, or the field of boiler heating. It is achieved with safe operation, low cost, and good application range.

公开(公告)号：US20180031328A1

公开(公告)日：2018-02-01

申请号：US15482042

申请日：2017-04-07

Applicant: Acer Incorporated

Inventor： Cheng-Yu Cheng ,  Wen-Neng Liao ,  Cheng-Wen Hsieh ,  Jau-Han Ke ,  Yung-Chih Wang

IPC: F28D15/02

CPC classification number: F28D15/025 ,  F28D15/0266 ,  F28D15/06 ,  F28F9/026 ,  F28F2270/00 ,  H01L23/427

Abstract: A heat dissipation apparatus suited for dissipating heat of a heat source. The heat dissipation apparatus includes a tank, a heat-insulation unit and a pipe. The tank has an outlet end, an inlet end and an accommodating space, wherein the tank receives heat of the heat source from above. The heat-insulation unit is disposed in the accommodating space of the tank, and the heat-insulation unit includes a heat-insulation nozzle. The heat-insulation nozzle has a first opening, a second opening and a neck portion, wherein the first opening communicates with the inlet end, the second opening communicates with the accommodating space and the neck portion is near the second opening. The pipe communicates the outlet end and the inlet end and forms a closed circulating loop with the tank.