公开(公告)号：US09716021B2

公开(公告)日：2017-07-25

申请号：US14601733

申请日：2015-01-21

Applicant: Tokyo Electron Limited

Inventor： Hiroshi Kikuchi

IPC: H01L21/677 ,  H01L21/67 ,  B65G1/04

CPC classification number: H01L21/67109 ,  B65G1/04 ,  H01L21/6773 ,  H01L21/67769 ,  Y10T29/49826

Abstract: Disclosed is a substrate heat treatment apparatus. The apparatus includes: a conveyance storage unit which includes a first storage section and a second storage section each of which stores a plurality of conveyance containers, and a conveyance mechanism configured to convey the conveyance containers, each of the conveyance containers accommodating a plurality of wafers; and a heat treatment unit including a heat treatment furnace which accommodates a holder configured to hold the plurality of wafers in multiple stages, and performs the heat treatment on the wafers. A mounting stage of a transfer section is provided below the first storage section in the conveyance storage unit. On the mounting stage, the conveyance containers are mounted so that the wafers within the conveyance containers are transferred to the holder in the heat treatment unit.

公开(公告)号：US20150253082A1

公开(公告)日：2015-09-10

申请号：US14633367

申请日：2015-02-27

Applicant: Tokyo Electron Limited

Inventor： Hiroshi Kikuchi ,  Tsutomu Wakamori

IPC: F27D1/18 ,  F27D3/00

CPC classification number: F27B17/0025 ,  F27D3/0084 ,  F27D2003/0065 ,  F27D2003/0086 ,  H01L21/67757

Abstract: Disclosed is a vertical heat treatment apparatus. The apparatus includes: a heat treatment furnace provided with a furnace inlet at a lower end thereof; a cover unit disposed on the furnace inlet of the heat treatment furnace; a cover unit opening/closing mechanism configured to support the cover unit in a cantilever manner from a bottom side of the cover unit; and an auxiliary mechanism configured to press the cover unit from the bottom side of the cover unit when the cover unit is disposed on the furnace inlet. The auxiliary mechanism is provided with a toggle mechanism.

Abstract translation: 公开了一种立式热处理装置。 该设备包括：热处理炉，其下端具有炉入口; 设置在所述热处理炉的炉入口上的盖单元; 盖单元打开/关闭机构，被配置为从所述盖单元的底侧以悬臂方式支撑所述盖单元; 以及辅助机构，其构造成当所述盖单元设置在所述炉入口上时，从所述盖单元的底侧按压所述盖单元。 辅助机构设置有肘节机构。

公开(公告)号：US09803924B2

公开(公告)日：2017-10-31

申请号：US14633367

申请日：2015-02-27

Applicant: Tokyo Electron Limited

Inventor： Hiroshi Kikuchi ,  Tsutomu Wakamori

IPC: H01L21/22 ,  H01L21/31 ,  F27B17/00 ,  F27D3/00 ,  H01L21/677

CPC classification number: F27B17/0025 ,  F27D3/0084 ,  F27D2003/0065 ,  F27D2003/0086 ,  H01L21/67757

Abstract: Disclosed is a vertical heat treatment apparatus. The apparatus includes: a heat treatment furnace provided with a furnace inlet at a lower end thereof; a cover unit disposed on the furnace inlet of the heat treatment furnace; a cover unit opening/closing mechanism configured to support the cover unit in a cantilever manner from a bottom side of the cover unit; and an auxiliary mechanism configured to press the cover unit from the bottom side of the cover unit when the cover unit is disposed on the furnace inlet. The auxiliary mechanism is provided with a toggle mechanism.

公开(公告)号：US20150214081A1

公开(公告)日：2015-07-30

申请号：US14601733

申请日：2015-01-21

Applicant: Tokyo Electron Limited

Inventor： Hiroshi Kikuchi

IPC: H01L21/677 ,  H01L21/67 ,  B25J11/00

CPC classification number: H01L21/67109 ,  B65G1/04 ,  H01L21/6773 ,  H01L21/67769 ,  Y10T29/49826

Abstract: Disclosed is a substrate heat treatment apparatus. The apparatus includes: a conveyance storage unit which includes a first storage section and a second storage section each of which stores a plurality of conveyance containers, and a conveyance mechanism configured to convey the conveyance containers, each of the conveyance containers accommodating a plurality of wafers; and a heat treatment unit including a heat treatment furnace which accommodates a holder configured to hold the plurality of wafers in multiple stages, and performs the heat treatment on the wafers. A mounting stage of a transfer section is provided below the first storage section in the conveyance storage unit. On the mounting stage, the conveyance containers are mounted so that the wafers within the conveyance containers are transferred to the holder in the heat treatment unit.

Abstract translation: 公开了一种基板热处理装置。 该装置包括：输送存储单元，包括第一存储部分和第二存储部分，每个存储部分存储多个输送容器;以及输送机构，其构造成输送输送容器，每个输送容器容纳多个晶片 ; 以及热处理单元，其包括热处理炉，所述热处理炉容纳构造成多级保持所述多个晶片的保持器，并对所述晶片进行热处理。 传送部的安装台设置在搬送存储部的第一收纳部的下方。 在安装台上，输送容器被安装成使得输送容器内的晶片转移到热处理单元中的保持器。

公开(公告)号：US20150214080A1

公开(公告)日：2015-07-30

申请号：US14601663

申请日：2015-01-21

Applicant: Tokyo Electron Limited

Inventor： Katsuhiko Oyama ,  Hirofumi Kaneko ,  Hiroshi Kikuchi ,  Norio Baba

IPC: H01L21/677 ,  H01L21/67 ,  B25J11/00

CPC classification number: H01L21/6773 ,  H01L21/67769 ,  Y10T29/49826

Abstract: Disclosed is a substrate heat treatment apparatus. The apparatus includes: a conveyance storage unit which includes a first storage section and a second storage section each of which stores a plurality of conveyance containers, and a conveyance mechanism configured to convey the conveyance containers, each of the conveyance containers accommodating a plurality of wafers; and a heat treatment unit including a heat treatment furnace which accommodates a holder configured to hold the plurality of wafers in multiple stages, and performs the heat treatment on the wafers. A mounting stage of a transfer section is provided below the first storage section in the conveyance storage unit. On the mounting stage, the conveyance containers are mounted so that the wafers within the conveyance containers are transferred to the holder in the heat treatment unit.