公开(公告)号：US10465986B2

公开(公告)日：2019-11-05

申请号：US15670389

申请日：2017-08-07

Applicant: TOKYO ELECTRON LIMITED

Inventor： Hirofumi Kaneko

IPC: F27D1/00 ,  F27D7/02 ,  F27B17/00 ,  C23C16/54 ,  H01L21/67 ,  C23C16/44

Abstract: A heat treatment apparatus includes: a reaction tube processing a plurality of substrates; a support member supporting the reaction tube; a flange protruding outwardly from a lower end of the reaction tube: a concave portion formed in an outer periphery of the flange; and a rotatable roller installed in a top surface of the support member. The rotatable roller engages the concave portion and positions the reaction tube in a circumferential direction.

公开(公告)号：US09845991B2

公开(公告)日：2017-12-19

申请号：US14067318

申请日：2013-10-30

Applicant: TOKYO ELECTRON LIMITED

Inventor： Hirofumi Kaneko

IPC: F27B17/00 ,  H01L21/67

CPC classification number: F27B17/0025 ,  H01L21/67109 ,  H01L21/67126

Abstract: Provided is a heat treatment apparatus, which includes: a cylindrical quartz reaction tube having a furnace opening and a bottom flange at a lower portion thereof; a flange holding part configured to hold the bottom flange of the reaction tube; and a lid including a metal lid and a quartz lid supported by the metal lid, the quartz lid being configured to close the furnace opening of the reaction tube. The quartz lid is fixed onto the metal lid by a support ring. The support ring is brought into contact with a bottom surface of the flange holding part so that a gap is defined between the quartz lid and the bottom flange. A sealing member is arranged outward from the gap in a radial direction.

公开(公告)号：US10281214B2

公开(公告)日：2019-05-07

申请号：US14020190

申请日：2013-09-06

Applicant: TOKYO ELECTRON LIMITED

Inventor： Hirofumi Kaneko ,  Kenichi Chiba

IPC: F27D7/02 ,  F27D7/06 ,  F27B17/00 ,  H01L21/67 ,  H01L21/687

Abstract: A heat treatment apparatus is provided with a reaction tube having a furnace opening formed at a lower end thereof, a lid body configured to hermetically seal the furnace opening of the reaction tube, a heat treatment boat supported on the lid body through a leg, and a rotating shaft extending through the lid body. The rotating shaft is connected to a lower end of the leg and configured to rotate the leg. The lid body is provided with a surrounding ring protruding upward to surround the lower end of the leg. An inert gas is supplied from an inert gas supply unit to a space between the lid body and the rotating shaft and discharged from a space between the lower end of the leg and the surrounding ring into the reaction tube.

公开(公告)号：US11302542B2

公开(公告)日：2022-04-12

申请号：US16737512

申请日：2020-01-08

Applicant: TOKYO ELECTRON LIMITED

Inventor： Masato Kadobe ,  Shinya Nasukawa ,  Hiromi Nitadori ,  Kazuyuki Kikuchi ,  Hirofumi Kaneko

IPC: H01L21/67 ,  H01L21/677 ,  F27D5/00 ,  F27D7/06 ,  F27D9/00 ,  F27D3/00

Abstract: A processing apparatus includes: a plurality of process modules concatenated with one another; and a loader module configured to receive a carrier accommodating a plurality of substrates to be processed by the plurality of process modules, wherein each of the plurality of process modules includes: a heat treatment unit including a processing container configured to accommodate the plurality of substrates and perform a heat treatment on the plurality of substrates; and a gas supply unit disposed on one side surface of the heat treatment unit and configured to supply a gas into the processing container.

公开(公告)号：US09759489B2

公开(公告)日：2017-09-12

申请号：US14023093

申请日：2013-09-10

Applicant: TOKYO ELECTRON LIMITED

Inventor： Hirofumi Kaneko

IPC: F27D1/00 ,  F27D7/02 ,  F27B17/00 ,  H01L21/67 ,  C23C16/44 ,  C23C16/54

CPC classification number: F27D1/0023 ,  C23C16/4409 ,  C23C16/54 ,  F27B17/0025 ,  F27D7/02 ,  H01L21/67109 ,  H01L21/6719

Abstract: A heat treatment apparatus includes: a reaction tube processing a plurality of substrates; a support member supporting the reaction tube; a flange protruding outwardly from a lower end of the reaction tube: a concave portion formed in an outer periphery of the flange; and a rotatable roller installed in a top surface of the support member. The rotatable roller engages the concave portion and positions the reaction tube in a circumferential direction.

公开(公告)号：US20150214080A1

公开(公告)日：2015-07-30

申请号：US14601663

申请日：2015-01-21

Applicant: Tokyo Electron Limited

Inventor： Katsuhiko Oyama ,  Hirofumi Kaneko ,  Hiroshi Kikuchi ,  Norio Baba

IPC: H01L21/677 ,  H01L21/67 ,  B25J11/00

CPC classification number: H01L21/6773 ,  H01L21/67769 ,  Y10T29/49826

Abstract: Disclosed is a substrate heat treatment apparatus. The apparatus includes: a conveyance storage unit which includes a first storage section and a second storage section each of which stores a plurality of conveyance containers, and a conveyance mechanism configured to convey the conveyance containers, each of the conveyance containers accommodating a plurality of wafers; and a heat treatment unit including a heat treatment furnace which accommodates a holder configured to hold the plurality of wafers in multiple stages, and performs the heat treatment on the wafers. A mounting stage of a transfer section is provided below the first storage section in the conveyance storage unit. On the mounting stage, the conveyance containers are mounted so that the wafers within the conveyance containers are transferred to the holder in the heat treatment unit.