公开(公告)号：US11114319B2

公开(公告)日：2021-09-07

申请号：US16690712

申请日：2019-11-21

Applicant: Tokyo Electron Limited

Inventor： Tatsuya Yamaguchi ,  Yasuaki Kikuchi ,  Koji Yoshii ,  Wataru Nakajima ,  Norio Baba

IPC: H01L21/67 ,  H01L21/263 ,  H01L21/66

Abstract: A heat treatment apparatus includes a heating unit provided around a processing container accommodating a substrate; a plurality of blowing units configured to blow a cooling medium into a space between the processing container and the heating unit; and a shutter configured to simultaneously opens/closes at least two of the plurality of blowing units and including a slit formed corresponding to each of the blowing units.

公开(公告)号：US20160273836A1

公开(公告)日：2016-09-22

申请号：US15070123

申请日：2016-03-15

Applicant: Tokyo Electron Limited

Inventor： Mitsuru Obara ,  Hisashi Inoue ,  Keishi Shionaga ,  Masahiro Kobayashi ,  Norio Baba ,  Hiroshi Kikuchi

IPC: F27B5/04 ,  F16B2/02 ,  H01L21/67 ,  H01L21/673 ,  H01L21/677

CPC classification number: F27B5/04 ,  F16B2/02 ,  F27B17/0016 ,  F27B17/0025 ,  F27D3/0084 ,  F27D2003/0012 ,  F27D2003/0046 ,  H01L21/67109 ,  H01L21/67379 ,  H01L21/67389 ,  H01L21/6773 ,  H01L21/67742 ,  H01L21/67772 ,  H01L21/67775

Abstract: The clamp apparatus of the present disclosure includes a clamp member configured to contact a substrate accommodating container from an upper side and fix the substrate accommodating container to a predetermined position when a cover provided on a front surface of the substrate accommodating container is opened/closed, a driving mechanism configured to drive the clamp member; a casing configured to cover the driving mechanism, a suction port configured to communicate with the casing, an exhaust chamber provided near the casing, and a fan provided inside the exhaust chamber.

Abstract translation: 本公开的夹紧装置包括夹持构件，其构造成当设置在基板容纳容器的前表面上的盖被打开/关闭时，从上侧接触基板容纳容器并将基板容纳容器固定到预定位置， 构造成驱动所述夹紧构件的驱动机构; 被构造成覆盖驱动机构的壳体，构造成与壳体连通的吸入口，设置在壳体附近的排气室和设置在排气室内的风扇。

公开(公告)号：US20150214080A1

公开(公告)日：2015-07-30

申请号：US14601663

申请日：2015-01-21

Applicant: Tokyo Electron Limited

Inventor： Katsuhiko Oyama ,  Hirofumi Kaneko ,  Hiroshi Kikuchi ,  Norio Baba

IPC: H01L21/677 ,  H01L21/67 ,  B25J11/00

CPC classification number: H01L21/6773 ,  H01L21/67769 ,  Y10T29/49826

Abstract: Disclosed is a substrate heat treatment apparatus. The apparatus includes: a conveyance storage unit which includes a first storage section and a second storage section each of which stores a plurality of conveyance containers, and a conveyance mechanism configured to convey the conveyance containers, each of the conveyance containers accommodating a plurality of wafers; and a heat treatment unit including a heat treatment furnace which accommodates a holder configured to hold the plurality of wafers in multiple stages, and performs the heat treatment on the wafers. A mounting stage of a transfer section is provided below the first storage section in the conveyance storage unit. On the mounting stage, the conveyance containers are mounted so that the wafers within the conveyance containers are transferred to the holder in the heat treatment unit.

公开(公告)号：US20200168486A1

公开(公告)日：2020-05-28

申请号：US16690712

申请日：2019-11-21

Applicant: Tokyo Electron Limited

Inventor： Tatsuya Yamaguchi ,  Yasuaki Kikuchi ,  Koji Yoshii ,  Wataru Nakajima ,  Norio Baba

IPC: H01L21/67 ,  H01L21/66 ,  H01L21/263

Abstract: A heat treatment apparatus includes a heating unit provided around a processing container accommodating a substrate; a plurality of blowing units configured to blow a cooling medium into a space between the processing container and the heating unit; and a shutter configured to simultaneously opens/closes at least two of the plurality of blowing units and including a slit formed corresponding to each of the blowing units.

公开(公告)号：US09857124B2

公开(公告)日：2018-01-02

申请号：US15070123

申请日：2016-03-15

Applicant: Tokyo Electron Limited

Inventor： Mitsuru Obara ,  Hisashi Inoue ,  Keishi Shionaga ,  Masahiro Kobayashi ,  Norio Baba ,  Hiroshi Kikuchi

IPC: F26B5/04 ,  F27B5/04 ,  H01L21/673 ,  H01L21/677 ,  H01L21/67 ,  F16B2/02 ,  F27B17/00 ,  F27D3/00

CPC classification number: F27B5/04 ,  F16B2/02 ,  F27B17/0016 ,  F27B17/0025 ,  F27D3/0084 ,  F27D2003/0012 ,  F27D2003/0046 ,  H01L21/67109 ,  H01L21/67379 ,  H01L21/67389 ,  H01L21/6773 ,  H01L21/67742 ,  H01L21/67772 ,  H01L21/67775

Abstract: The clamp apparatus of the present disclosure includes a clamp member configured to contact a substrate accommodating container from an upper side and fix the substrate accommodating container to a predetermined position when a cover provided on a front surface of the substrate accommodating container is opened/closed, a driving mechanism configured to drive the clamp member; a casing configured to cover the driving mechanism, a suction port configured to communicate with the casing, an exhaust chamber provided near the casing, and a fan provided inside the exhaust chamber.