公开(公告)号：US20170170606A1

公开(公告)日：2017-06-15

申请号：US14967605

申请日：2015-12-14

Applicant: TYCO ELECTRONICS CORPORATION

Inventor： Michael John Phillips ,  Thomas Taake de Boer ,  Bruce Allen Champion ,  John Joseph Consoli ,  Sandeep Patel ,  Linda Ellen Shields

IPC: H01R13/6471 ,  H01R12/70 ,  H01R13/6585

CPC classification number: H01R13/6471 ,  H01R12/7005 ,  H01R12/721 ,  H01R12/725 ,  H01R12/735 ,  H01R13/405 ,  H01R13/6585

Abstract: An electrical connector includes a housing having a first end and a second end with a mating slot formed between the first and second ends configured to receive a mating connector having contact pads. A leadframe assembly is disposed in the housing. The leadframe assembly has a contact array including ground contacts and signal contacts interspersed between corresponding ground contacts. The leadframe assembly has an overmold body supporting the ground and signal contacts. The overmold body has lossy ground absorbers coupled to corresponding ground contacts. The lossy ground absorbers are manufactured from lossy material absorbing electrical resonance propagating through the leadframe assembly.

公开(公告)号：US20160336691A1

公开(公告)日：2016-11-17

申请号：US14709806

申请日：2015-05-12

Applicant: Tyco Electronics Corporation

Inventor： Thomas Taake de Boer

IPC: H01R13/6471 ,  H01R13/6585

CPC classification number: H01R13/6471 ,  H01R12/721 ,  H01R12/724 ,  H01R13/6585

Abstract: An electrical connector includes a housing having a terminating side and a front side that is configured to mate with a mating connector. The electrical connector also includes signal and ground conductors extending through the housing. The signal and ground conductors are configured to engage the mating connector. The signal conductors form a plurality of signal pairs configured to carry differential signals. The ground conductors are interleaved between the signal pairs. The electrical connector further has at least one resonance-control ground bus that includes a ground frame and a support body. The support body at least partially covers the ground frame. The support body comprises a lossy material. The ground frame includes multiple arms that each engage and electrically connect to a respective one of the ground conductors in order to electrically common the ground conductors that are engaged by the arms.

Abstract translation: 电连接器包括具有端接侧和配置成与配合连接器配合的前侧的壳体。 电连接器还包括延伸穿过壳体的信号和接地导体。 信号和接地导体被配置为接合配合连接器。 信号导体形成多个被配置为承载差分信号的信号对。 接地导体在信号对之间交错。 电连接器还具有包括接地框架和支撑体的至少一个谐振控制接地总线。 支撑体至少部分地覆盖地面框架。 支撑体包括有损材料。 接地框架包括多个臂，其各自接合并电连接到相应的一个接地导体，以便与由臂接合的接地导体电气共同。

公开(公告)号：US09490587B1

公开(公告)日：2016-11-08

申请号：US14967563

申请日：2015-12-14

Applicant: TYCO ELECTRONICS CORPORATION

Inventor： Michael John Phillips ,  Thomas Taake de Boer ,  Bruce Allen Champion ,  John Joseph Consoli ,  Sandeep Patel ,  Linda Ellen Shields

IPC: H01R9/03 ,  H01R13/6586 ,  H01R13/6599 ,  H01R13/6587

CPC classification number: H01R13/6586 ,  H01R13/6587 ,  H01R13/6599

Abstract: A contact module stack includes signal contact modules and ground contact modules flanking the signal contact modules in a ground-signal-signal-ground contact module arrangement. The signal contact modules each include signal leadframes and signal dielectric bodies. The ground contact modules each include ground leadframes and ground dielectric bodies. The ground leadframes each have at least one ground contact. Each ground dielectric body has a low loss layer on a first side of the ground leadframe and a lossy layer on a second side of the ground leadframe. The lossy layer and the low loss layer substantially enclose a transition portion of the ground contact. The lossy layers are manufactured from lossy material having conductive particles in a dielectric binder material. The lossy layers absorb electrical resonance propagating through the contact module stack.

Abstract translation: 触点模块堆叠包括接地信号 - 接地触头模块装置中的信号触头模块侧面的信号触点模块和接地触头模块。 信号触点模块各自包括信号引线框架和信号电介质体。 接地触头模块各自包括接地引线框架和接地绝缘体。 接地引线框架各自具有至少一个接地触点。 每个接地电介质体在接地引线框架的第一侧具有低损耗层，在接地引线框架的第二侧具有有损层。 有损层和低损耗层基本上包围接地触点的过渡部分。 有损层由介电粘合剂材料中具有导电颗粒的有损耗材料制成。 有损层吸收通过触点模块叠层传播的电谐振。