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公开(公告)号：US20080078573A1
公开(公告)日：2008-04-03
申请号：US11902553
申请日：2007-09-24
IPC分类号： H01R12/04
CPC分类号： H05K1/0271 , H05K1/0219 , H05K1/028 , H05K1/148 , H05K2201/09063 , H05K2201/09236 , H05K2201/09563 , H05K2201/09809
摘要： A wired circuit board has an insulating layer extending in a longitudinal direction, a conductive layer having a plurality of signal wirings covered with the insulating layer and arranged in mutually spaced-apart and parallel relation in a perpendicular direction to the longitudinal direction and a thickness direction of the insulating layer, and connecting terminals provided on both longitudinal ends of each of the signal wirings and exposed from the insulating layer, and a ground layer covered with the insulating layer and formed to surround each of the signal wirings in a perpendicular direction to the longitudinal direction. A slit along the longitudinal direction is formed between each of the signal wirings in the insulating layer.
摘要翻译： 布线电路板具有沿纵向方向延伸的绝缘层，导电层具有覆盖有绝缘层的多个信号布线，并且沿垂直于纵向的方向以相互间隔开的平行关系布置，厚度方向 的绝缘层，以及设置在每个信号布线的两个纵向端并从绝缘层露出的连接端子，以及覆盖有绝缘层的接地层，并且形成为围绕每个信号布线沿垂直于 纵向。 在绝缘层中的每个信号布线之间形成沿着纵向的狭缝。
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公开(公告)号：US08664535B2
公开(公告)日：2014-03-04
申请号：US12285837
申请日：2008-10-15
申请人： Katsutoshi Kamei , Tetsuya Ohsawa , Voon Yee Ho
发明人： Katsutoshi Kamei , Tetsuya Ohsawa , Voon Yee Ho
CPC分类号： H05K1/0248 , H05K1/0245 , H05K1/056 , H05K3/4644 , H05K2201/09672 , H05K2201/09845
摘要： A wired circuit board includes a first insulating layer, a first wire formed on the first insulating layer, a second insulating layer formed on the first insulating layer so as to cover the first wire, and a second wire placed opposite to the first wire in a thickness direction and formed in a smaller width than that of the first wire.
摘要翻译： 布线电路板包括第一绝缘层，形成在第一绝缘层上的第一布线，形成在第一绝缘层上以覆盖第一布线的第二绝缘层，以及与第一布线相对放置的第二布线 厚度方向形成为比第一线宽小的宽度。
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公开(公告)号：US20090098745A1
公开(公告)日：2009-04-16
申请号：US12285837
申请日：2008-10-15
申请人： Katsutoshi Kamei , Tetsuya Ohsawa , Voon Yee Ho
发明人： Katsutoshi Kamei , Tetsuya Ohsawa , Voon Yee Ho
IPC分类号： H01R12/00
CPC分类号： H05K1/0248 , H05K1/0245 , H05K1/056 , H05K3/4644 , H05K2201/09672 , H05K2201/09845
摘要： A wired circuit board includes a first insulating layer, a first wire formed on the first insulating layer, a second insulating layer formed on the first insulating layer so as to cover the first wire, and a second wire placed opposite to the first wire in a thickness direction and formed in a smaller width than that of the first wire.
摘要翻译： 布线电路板包括第一绝缘层，形成在第一绝缘层上的第一布线，形成在第一绝缘层上以覆盖第一布线的第二绝缘层，以及与第一布线相对放置的第二布线 厚度方向形成为比第一线宽小的宽度。
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