Configuration and fabrication of semiconductor structure using empty and filled wells
    12.
    发明授权
    Configuration and fabrication of semiconductor structure using empty and filled wells 有权
    使用空和填充井的半导体结构的配置和制造

    公开(公告)号:US08304835B2

    公开(公告)日:2012-11-06

    申请号:US12382973

    申请日:2009-03-27

    Abstract: A semiconductor structure, which serves as the core of a semiconductor fabrication platform, has a combination of empty-well regions and filled-well regions variously used by electronic elements, particularly insulated-gate field-effect transistors (“IGFETs”), to achieve desired electronic characteristics. A relatively small amount of semiconductor well dopant is near the top of an empty well. A considerable amount of semiconductor well dopant is near the top of a filled well. Some IGFETs (100, 102, 112, 114, 124, and 126) utilize empty wells (180, 182, 192, 194, 204, and 206) in achieving desired transistor characteristics. Other IGFETs (108, 110, 116, 118, 120, and 122) utilize filled wells (188, 190, 196, 198, 200, and 202) in achieving desired transistor characteristics. The combination of empty and filled wells enables the semiconductor fabrication platform to provide a wide variety of high-performance IGFETs from which circuit designers can select particular IGFETs for various analog and digital applications, including mixed-signal applications.

    Abstract translation: 作为半导体制造平台的核心的半导体结构具有由电子元件特别是绝缘栅场效应晶体管(IGFET)不同地使用的空阱区域和填充阱区域的组合,以实现期望的电子 特点 相当少量的半导体阱掺杂剂靠近空穴的顶部。 相当数量的半导体阱掺杂剂靠近填充井的顶部。 一些IGFET(100,102,112,114,124和126)利用空井(180,182,192,194,204和206)实现期望的晶体管特性。 其它IGFET(108,110,116,118,120和122)利用填充的孔(188,190,196,198,200和202)实现期望的晶体管特性。 空孔和填充孔的组合使得半导体制造平台能够提供各种各样的高性能IGFET,电路设计者可以从其中选择特定的IGFET用于各种模拟和数字应用,包括混合信号应用。

    Configuration and fabrication of semiconductor structure using empty and filled wells
    13.
    发明申请
    Configuration and fabrication of semiconductor structure using empty and filled wells 有权
    使用空和填充井的半导体结构的配置和制造

    公开(公告)号:US20100244128A1

    公开(公告)日:2010-09-30

    申请号:US12382973

    申请日:2009-03-27

    Abstract: A semiconductor structure, which serves as the core of a semiconductor fabrication platform, has a combination of empty-well regions and filled-well regions variously used by electronic elements, particularly insulated-gate field-effect transistors (“IGFETs”), to achieve desired electronic characteristics. A relatively small amount of semiconductor well dopant is near the top of an empty well. A considerable amount of semiconductor well dopant is near the top of a filled well. Some IGFETs (100, 102, 112, 114, 124, and 126) utilize empty wells (180, 182, 192, 194, 204, and 206) in achieving desired transistor characteristics. Other IGFETs (108, 110, 116, 118, 120, and 122) utilize filled wells (188, 190, 196, 198, 200, and 202) in achieving desired transistor characteristics. The combination of empty and filled wells enables the semiconductor fabrication platform to provide a wide variety of high-performance IGFETs from which circuit designers can select particular IGFETs for various analog and digital applications, including mixed-signal applications.

    Abstract translation: 作为半导体制造平台的核心的半导体结构具有由电子元件特别是绝缘栅场效应晶体管(“IGFET”)不同地使用的空阱区域和填充阱区域的组合,以实现 所需的电子特性。 相当少量的半导体阱掺杂剂靠近空穴的顶部。 相当数量的半导体阱掺杂剂靠近填充井的顶部。 一些IGFET(100,102,112,114,124和126)利用空井(180,182,192,194,204和206)实现期望的晶体管特性。 其它IGFET(108,110,116,118,120和122)利用填充的孔(188,190,196,198,200和202)实现期望的晶体管特性。 空孔和填充孔的组合使得半导体制造平台能够提供各种各样的高性能IGFET,电路设计者可以从其中选择特定的IGFET用于各种模拟和数字应用,包括混合信号应用。

    Structure and fabrication of field-effect transistor using empty well in combination with source/drain extensions or/and halo pocket
    18.
    发明申请
    Structure and fabrication of field-effect transistor using empty well in combination with source/drain extensions or/and halo pocket 有权
    使用空穴与源极/漏极延伸部分或/和晕圈组合的场效应晶体管的结构和制造

    公开(公告)号:US20100244130A1

    公开(公告)日:2010-09-30

    申请号:US12382968

    申请日:2009-03-27

    Abstract: Insulated-gate field-effect transistors (“IGFETs”), both symmetric and asymmetric, suitable for a semiconductor fabrication platform that provides IGFETs for analog and digital applications, including mixed-signal applications, utilize empty-well regions in achieving high performance. A relatively small amount of semiconductor well dopant is near the top of each empty well. Each IGFET (100, 102, 112, 114, 124, or 126) has a pair of source/drain zones laterally separated by a channel zone of body material of the empty well (180, 182, 192, 194, 204, or 206). A gate electrode overlies a gate dielectric layer above the channel zone. Each source/drain zone (240, 242, 280, 282, 520, 522, 550, 552, 720, 722, 752, or 752) has a main portion (240M, 242M, 280M, 282M, 520M, 522M, 550M, 552M, 720M, 722M, 752M, or 752M) and a more lightly doped lateral extension (240E, 242E, 280E, 282E, 520E, 522E, 550E, 552E, 720E, 722E, 752E, or 752E). Alternatively or additionally, a more heavily doped pocket portion (250 or 290) of the body material extends along one of the source/drain zones. When present, the pocket portion typically causes the IGFET to be an asymmetric device.

    Abstract translation: 对称和不对称的绝缘栅场效应晶体管(“IGFET”)适用于为模拟和数字应用(包括混合信号应用)提供IGFET的半导体制造平台,利用空井区域实现高性能。 相对少量的半导体阱掺杂剂在每个空的孔的顶部附近。 每个IGFET(100,102,112,114,124或126)具有由空井(180,182,192,194,204或206)的主体材料的通道区横向隔开的一对源/排出区 )。 栅极电极覆盖在沟道区上方的栅极电介质层。 每个源/漏区(240,242,282,282,520,522,550,552,720,722,752或752)具有主要部分(240M,242M,280M,282M,520M,522M,550M, 552M,720M,722M,752M或752M)和更轻掺杂的侧向延伸部(240E,242E,280E,282E,520E,522E,550E,552E,720E,722E,752E或752E)。 替代地或另外地,主体材料的更加掺杂的凹穴部分(250或290)沿着源极/漏极区域中的一个延伸。 当存在时,口袋部分通常使IGFET成为非对称装置。

    Semiconductor architecture having field-effect transistors especially suitable for analog applications
    20.
    发明授权
    Semiconductor architecture having field-effect transistors especially suitable for analog applications 有权
    具有特别适用于模拟应用的场效应晶体管的半导体架构

    公开(公告)号:US08395212B2

    公开(公告)日:2013-03-12

    申请号:US13177552

    申请日:2011-07-06

    Abstract: An insulated-gate field-effect transistor (100, 100V, 140, 150, 150V, 160, 170, 170V, 180, 180V, 190, 210, 210W, 220, 220U, 220V, 220W, 380, or 480) has a hypoabrupt vertical dopant profile below one (104 or 264) of its source/drain zones for reducing the parasitic capacitance along the pn junction between that source/drain zone and adjoining body material (108 or 268). In particular, the concentration of semiconductor dopant which defines the conductivity type of the body material increases by at least a factor of 10 in moving from that source/drain zone down to an underlying body-material location no more than 10 times deeper below the upper semiconductor surface than that source/drain zone. The body material preferably includes a more heavily doped pocket portion (120 or 280) situated along the other source/drain zone (102 or 262). The combination of the hypoabrupt vertical dopant profile below the first-mentioned source/drain zone, normally serving as the drain, and the pocket portion along the second-mentioned source/drain zone, normally serving as the source, enables the resultant asymmetric transistor to be especially suitable for high-speed analog applications.

    Abstract translation: 绝缘栅场效应晶体管(100,100V,140,150,150V,160,170,170V,180,180V,190,210,210W,220,220U,220V,220W,380或480)具有 低于其源极/漏极区(104或264)的垂直掺杂剂分布,用于减小源极/漏极区与邻接体材料(108或268)之间的pn结的寄生电容。 特别地,限定主体材料的导电类型的半导体掺杂剂的浓度在从该源极/漏极区向下移动到下面的主体材料位置时不小于10倍深度的上方增加至少10倍 半导体表面比该源/漏区。 主体材料优选地包括沿着另一个源极/漏极区(102或262)设置的更重掺杂的凹穴部分(120或280)。 通常用作漏极的第一提及的源极/漏极区下方的低破坏垂直掺杂物分布以及通常用作源的第二次提供的源极/漏极区的凹穴部分的组合使得所得的不对称晶体管能够 特别适用于高速模拟应用。

Patent Agency Ranking