摘要:
The invention relates to modular heat-dissipating housing covers for opto-electronic modules, e.g. transceivers. The housing covers according to the present invention are constructed out of various different parts, which provide different levels of heat dissipation depending on the desired implementation, while maintaining a seal against EMI leakage. Extra heat sinking portions are provided to dissipate heat generated from specific heat generating sources. The extra heat sinking portions are configured into a shape and/or out of a material that provides more thermal dissipation than the standard cover provided. Independent control over the different heat sinking portions enables a better fit and appropriate dissipation.
摘要:
The present invention relates to a latching system for an optical transceiver module that eliminates the use of compound latching mechanisms by providing a single latching lever for unplugging the module from its mounting cage. The latching lever includes a pair of arms with a bail handle on one end to facilitate actuation of the latching lever and manipulation of the module. The other end of the latching lever applies a force to the cage to separate first and second mating latching members on the module and the cage, respectively. The fulcrum of the lever is provided by a bend in each arm, which acts like a journal, mounted in a bearing depression formed in the module housing.
摘要:
The present invention relates to an optical sub-assembly, i.e. a receiver optical subassembly or a transmitter optical sub-assembly, for use in an optical transceiver device. The optical sub-assembly according to the present invention includes a hermetic ceramic package with a multi-layer ceramic structure providing a unique RF signal and ground structure providing a controlled signal impedance to achieve high signal transmission quality.
摘要:
An easily removable modular optical signal transceiver unit for conversion between modulated light signal transmission and electronic data signals and which conforms to the Small Form Factor standard for transceiver interfaces is disclosed. The structural details of its chassis include aspects which insure the proper positioning of electronic circuit boards of a transmitter optical subassembly and a receiver optical subassembly as well as the positioning of electromagnetic radiation shielding on the chassis. In conjunction with an interface device on an electronic circuit board of a host device, the chassis supports electromagnetic radiation shielding which substantially encloses the sources of electromagnetic radiation within the module and suppresses the escape of electromagnetic radiation, thereby preventing electromagnetic interference with sensitive components and devices in proximity to the module.
摘要:
The invention relates to a receiver optical sub-assembly (ROSA) for use in a high-speed small-form factor transceiver. The ROSA, according to the present invention, includes a stacked chip design in which a semiconductor micro-bench, upon which the photodiode and trans-impedance amplifier are mounted, is disposed perpendicular to the direction that the light travels. A flexible electrical connector is attached to the semiconductor micro-bench for electrically connecting the ROSA to a host a transceiver device. The flexible electrical connector is fixed to the surface of the semiconductor micro-bench with portions cut-out to receive the amplifier and other electrical components extending therefrom. To facilitate assembly, wells are etched from the semiconductor micro-bench corresponding to bumps extending from a mounting flange for the optical coupler.
摘要:
A fiber optic arrangement includes a chip, and a first light emitter and a second light emitter formed on the chip. A guide is formed on the chip and in registration with an active region of the second light emitter. An optical fiber is coupled to the second light emitter for transmitting light from the second light emitter. The guide aligns the optical fiber relative to the active region of the second light emitter. A light-sensing device is provided. An optical element transmits light emitted from the first light emitter to the light-sensing device for controlling an output optical power of at least the second light emitter.
摘要:
An opto-electronic module is housed in a hermetically sealed housing which is fabricated on a base member of solderable material to which a side wall structure is soldered. A cover is similarly provided that either is soldered to the top open end of the housing at the edge of the housing wall structure or is a cup-shaped member that slides over the wall structure and is soldered at the juxtaposed faces of the walls of the cover and the wall structure. Overlapping slots co-align to form a passage through which optical fibers may pass through the walls. The hermetic seal of the housing prevents the internal contamination of the module by water vapor, particulate matter or other contaminants.
摘要:
An electrical component is provided that has a plurality of electrical leads. Further, an electromagnetic interference shield and ground cage is provided which has a plurality of conductive walls connected together to form an enclosure having an open bottom. One of the walls has a plurality of openings formed therein to allow the plurality of leads to be passed into the enclosure. The electromagnetic interference shield and ground cage further has at least two ground connection pins attached to a lower edge of the walls. One of the leads is a ground lead that is electrically coupled to the electromagnetic interference shield and ground cage at one of the openings, thus reducing the length, inductance and impedance of the ground lead.
摘要:
The invention relates to an optical sub-assembly package for use in receiver optical sub-assemblies or transmitter optical sub-assemblies in which the electrical connections between the transducer chip, e.g. photo-detector or light source, and the device printed circuit board is made by a single flexible circuit conductor extending through the wall of the package. The package is comprised of a housing and a stiffening plate, which encloses and end of the housing and forms a mechanical support for an end of the flexible circuit conductor.
摘要:
An optical signal transceiver subassembly is mounted on a lead frame for further attachment to an electronic printed circuit board. The optical subassembly is comprised of a solid-state laser, a pair of photo-detectors, an over-mold of transparent material having shapes forming the exposed surface thereof, the surface and a selective silvering of a portion thereof defining a beam-splitter mirror and an interior reflective focusing surface, preferably in the shape of a partial cylindrical surface. The beam-splitter mirror is lightly silvered and the cylindrical surface is silvered to enhance the reflection of the laser beam. The optical subassembly is further enclosed with a housing incorporating a pair of lenses and alignment pins. The lenses focus the data stream of optical light signals onto the end of the outgoing optical fiber and the data stream of optical light signals from the incoming optical fiber onto and through the beam-splitter and onto a first photo-detector. The beam-splitter and the partial cylindrical surface reflect the laser beam portion deflected from the primary laser beam path onto a second photo-detector to provide a data stream from which the operation of the laser may be monitored, thereby insuring the proper transmission of the data signals provided to the laser through the lead frame and its associated electronic connections.