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公开(公告)号：US11936159B2
公开(公告)日：2024-03-19
申请号：US16648363
申请日：2018-09-04
Applicant: IC-HAUS GMBH
Inventor： Ralf Burkard
IPC: H01S5/042 , H01S3/10 , H01S5/062 , H03K17/687 , H01S5/026
CPC classification number: H01S5/0428 , H01S5/06216 , H03K17/6871 , H01S3/10046 , H01S5/0261 , H01S5/06226 , H03K2217/0063 , H03K2217/0072
Abstract: Various implementations disclosed herein relate to an integrated laser driver circuit for switching a pulse current (IP) for a laser diode having a plurality of sub-switching units for generating in each case a partial current (IT) using a switch for pulsing the partial current (IT), wherein the sub-switching units are connected to one another in parallel for generating the pulse current (IP), wherein an energy accumulator is integrated into each of the sub-switching units to provide the switching energy required for switching the switch. The disclosure further relates to a laser system having a laser diode and an integrated laser driver circuit.
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公开(公告)号：US11909170B2
公开(公告)日：2024-02-20
申请号：US17357351
申请日：2021-06-24
Applicant: Lumentum Japan, Inc.
Inventor： Koichiro Adachi
IPC: H01S5/00 , H01S5/023 , H01S5/02 , H01S5/026 , H01S5/02345 , H01S5/0239 , H01S5/042 , H01S5/062 , H01S5/0625 , H01S5/02325
CPC classification number: H01S5/023 , H01S5/026 , H01S5/0207 , H01S5/0239 , H01S5/02325 , H01S5/02345 , H01S5/0427 , H01S5/06226 , H01S5/06251
Abstract: A semiconductor light emitting device includes a microstrip substrate with a single-ended transmission line on a top surface, wherein the single-ended transmission line extends from a first end portion to a second end portion, the microstrip substrate has a ground plane on a bottom surface, and the ground plane is opposed and bonded to the conductive pattern. The single-ended transmission line includes a first section and a second section, wherein the second section extends from the first section and includes the second end portion. The second section is lower in characteristic impedance than the first section. A load circuit that includes the wire, the optical modulator, and the termination resistor is electrically connected between the second end portion and the conductive pattern. The load circuit is equal to or lower in the characteristic impedance than the second section.
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公开(公告)号：US20190190608A1
公开(公告)日：2019-06-20
申请号：US16226040
申请日：2018-12-19
Applicant: Finisar Corporation
Inventor： Nicolae CHITICA , Jürgen HAUENSCHILD , Theron JONES , David NIDELIUS , Lennart LUNDQVIST , Elisabeth KÄLLÉN , Odd STEIJER , Marek CHACINSKI , Åsa JOHANSSON , Andrei KAIKKONEN
CPC classification number: H04B10/40 , G02B6/4273 , H01S5/02248 , H01S5/02296 , H01S5/02438 , H01S5/02446 , H01S5/02469 , H01S5/0261 , H01S5/0262 , H01S5/06226 , H01S5/06817 , H01S5/423 , H04B10/503
Abstract: An integrated optical transceiver, comprising a laser component, comprising an array of VCSEL diodes formed on a laser diode substrate; a laser driving component, comprising laser diode driving circuitry formed on a laser driving circuitry substrate; a photodiode component, comprising an array of photodiodes formed on a photodiode substrate; and a photodiode driving component, comprising photodiode driving circuitry formed on a photodiode driving circuitry substrate; a first heat sink comprising a connected piece of material to transport excess heat away from the integrated optical transceiver and connected to both the laser and photodiode driving components; and an electrically insulating material separating the photodiode substrate from the first heat sink and being air or dielectric material with a relative dielectric constant ε
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公开(公告)号：US09979159B2
公开(公告)日：2018-05-22
申请号：US14873659
申请日：2015-10-02
Applicant: Renesas Electronics Corporation
Inventor： Tetsuro Okuda
CPC classification number: H01S5/2275 , H01S3/08022 , H01S5/06226 , H01S5/222 , H01S5/2222 , H01S5/2224 , H01S5/2272 , H01S5/34306 , H01S2304/04
Abstract: In a semiconductor laser, a block layer is provided on both sides of a mesa-type semiconductor part having an n-type cladding layer, an active layer, and a p-type cladding layer. The block layer has: a p-type block layer formed on the side surface of the mesa-type semiconductor part and over a p-type semiconductor substrate; a high-resistance layer formed over the p-type block layer; and an n-type block layer formed over the high-resistance layer, which has a higher resistance than that of the p-type block layer. By providing the high-resistance layer between the p-type block layer and the n-type block layer, the thickness of the p-type block layer can be controlled and a leakage current (flow of a hole) can be reduced. Further, the distance between the n-type cladding layer and the n-type block layer can be secured, and hence a leakage current (flow of an electron) can be prevented.
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5.发明申请公开(公告)号：US20180124942A1
公开(公告)日：2018-05-03
申请号：US15805070
申请日：2017-11-06
Applicant: FINISAR CORPORATION
Inventor： Andrei Kaikkonen , Lennart Per Olof Lundqvist , Lars-Goete Svensson , Peter Lindberg
CPC classification number: H05K7/026 , G01J1/029 , G01J1/44 , G01J2001/446 , G02B6/4279 , H01S5/02276 , H01S5/0427 , H01S5/06226 , H01S5/423 , H04B10/801 , H05K1/0216 , H05K1/0243 , H05K1/025 , H05K2201/10121
Abstract: An optoelectronic module is provide and includes an electronic unit, an optical unit, and an interconnect structure. The electronic unit is capable of outputting and/or receiving electric signals, while the optical unit is capable of converting the electric signals into optical signals. The interconnect structure connects the electronic unit and the optical unit, and includes an electrically conducting substrate and a pair of transmission leads connecting electronic unit and the optical unit. The pair of transmission leads includes a signal lead and a ground lead having lower impedance than the signal lead.
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Patent Agency Ranking
公开(公告)号：US20180095229A1
公开(公告)日：2018-04-05
申请号：US15832198
申请日：2017-12-05
Applicant: Hisense Broadband Multimedia Technologies Co., Ltd. , Hisense USA Corp. , Hisense International Co., Ltd.
Inventor： Hao Wang , Hongwei Mu , YongLiang Huang , Shun Zhang
CPC classification number: G02B6/4279 , G02B6/4278 , H01L24/00 , H01P3/081 , H01S5/02276 , H01S5/024 , H01S5/02407 , H01S5/02415 , H01S5/02469 , H01S5/06226 , H01S5/068 , H01S5/06837 , H01S5/0687
Abstract: An optical component includes: a first substrate, a second substrate, and a transfer board. A first electrically conductive path is disposed on a top surface of the first substrate. A second electrically conductive path is disposed on a bottom surface of the first substrate. A third electrically conductive path is disposed on a top surface of the second substrate. A microstrip line structure is disposed on the transfer board. The microstrip line structure includes a transfer line disposed on a top surface of the transfer board. The top surface of the second substrate is opposite to the bottom surface of the first substrate, where the second electrically conductive path fits the third electrically conductive path. The transfer board is disposed on the top of the top surface of the second substrate. One end of the transfer line is electrically connected to the first electrically conductive path by a wire bonding.
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公开(公告)号：US09905995B2
公开(公告)日：2018-02-27
申请号：US15252877
申请日：2016-08-31
Applicant: Integrated Device Technology, Inc.
Inventor： Samuel Aloysius Steidl , Emad Afifi
CPC classification number: H01S5/0427 , H01S5/06226
Abstract: Disclosed is a circuit having a high speed laser driver circuit, a semiconductor laser electrically connected to the high speed laser driver circuit, and an adjustable termination circuit electrically connected between the high speed laser driver circuit and the semiconductor laser, where the adjustable termination circuit is configured to control an output impedance seen by the semiconductor laser as a function of an input current provided to the adjustable termination circuit.
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公开(公告)号：US09864155B2
公开(公告)日：2018-01-09
申请号：US14849362
申请日：2015-09-09
Applicant: Hisense Broadband MultiMedia Technologies Co., Ltd , Hisense USA Corp. , Hisense International Co., Ltd.
Inventor： Hao Wang , Hongwei Mu , YongLiang Huang , Shun Zhang
CPC classification number: G02B6/4279 , G02B6/4278 , H01L24/00 , H01P3/081 , H01S5/02276 , H01S5/024 , H01S5/02407 , H01S5/02415 , H01S5/02469 , H01S5/06226 , H01S5/068 , H01S5/06837 , H01S5/0687
Abstract: An optical component includes: a first substrate, a second substrate, and a transfer board. A first electrically conductive path is disposed on a top surface of the first substrate. A second electrically conductive path is disposed on a bottom surface of the first substrate. A third electrically conductive path is disposed on a top surface of the second substrate. A microstrip line structure is disposed on the transfer board. The microstrip line structure includes a transfer line disposed on a top surface of the transfer board. The top surface of the second substrate is opposite to the bottom surface of the first substrate, where the second electrically conductive path fits the third electrically conductive path. The transfer board is disposed on the top of the top surface of the second substrate. One end of the transfer line is electrically connected to the first electrically conductive path by a wire bonding.
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公开(公告)号：US09814153B2
公开(公告)日：2017-11-07
申请号：US14736462
申请日：2015-06-11
Applicant: FINISAR CORPORATION
Inventor： Andrei Kaikkonen , Lennart Per Olof Lundqvist , Lars-Goete Svensson , Peter Lindberg
IPC: G01J1/44 , H05K7/02 , H01S5/022 , H01S5/042 , G01J1/02 , H04B10/80 , H01S5/062 , H01S5/42 , H05K1/02 , G02B6/42
CPC classification number: H05K7/026 , G01J1/029 , G01J1/44 , G01J2001/446 , G02B6/4279 , H01S5/02276 , H01S5/0427 , H01S5/06226 , H01S5/423 , H04B10/801 , H05K1/0216 , H05K1/0243 , H05K1/025 , H05K2201/10121
Abstract: An optoelectronic module is provide and includes an electronic unit, an optical unit, and an interconnect structure. The electronic unit is capable of outputting and/or receiving electric signals, while the optical unit is capable of converting the electric signals into optical signals. The interconnect structure connects the electronic unit and the optical unit, and includes an electrically conducting substrate and a pair of transmission leads connecting electronic unit and the optical unit. The pair of transmission leads includes a signal lead and a ground lead having lower impedance than the signal lead.
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公开(公告)号：US09806498B2
公开(公告)日：2017-10-31
申请号：US15143653
申请日：2016-05-02
Applicant: TOKYO INSTITUTE OF TECHNOLOGY , FUJI XEROX CO., LTD.
Inventor： Fumio Koyama , Hamed Dalir , Takashi Kondo , Naoki Jogan , Kazutaka Takeda , Hideo Nakayama
CPC classification number: H01S5/1835 , H01S5/02284 , H01S5/06226 , H01S5/1032 , H01S5/18302 , H01S5/18313 , H01S5/18344 , H01S5/18394 , H01S5/3432
Abstract: A vertical-cavity surface-emitting laser diode includes: a first resonator that has a plurality of semiconductor layers comprising a first current narrowing structure having a first conductive region and a first non-conductor region; a first electrode that supplies electric power to drive the first resonator; a second resonator that has a plurality of semiconductor layers comprising a second current narrowing structure having a second conductive region and a second non-conductive region and that is formed side by side with the first resonator, the second current narrowing structure being formed in same current narrowing layer as the layer where the first current narrowing structure is formed; and a coupling portion as defined herein; and an equivalent refractive index of the coupling portion is smaller than an equivalent refractive index of each of the first resonator and the second resonator.
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