公开(公告)号：US20030179064A1

公开(公告)日：2003-09-25

申请号：US10387203

申请日：2003-03-11

Applicant: Xerox Corporation

Inventor： Christopher L. Chua ,  Francesco Lemmi ,  Koenraad F. Van Schuylenbergh ,  Jeng Ping Lu ,  David K. Fork ,  Eric Peeters ,  Decai Sun ,  Donald L. Smith ,  Linda T. Romano

IPC: H01F005/00

CPC classification number: H01L24/13 ,  G01R1/06727 ,  G01R3/00 ,  H01F17/0033 ,  H01F17/02 ,  H01F41/041 ,  H01L21/76838 ,  H01L21/7688 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/5227 ,  H01L24/11 ,  H01L24/16 ,  H01L24/48 ,  H01L28/10 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/13099 ,  H01L2224/4847 ,  H01L2224/8592 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12034 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  Y10T29/4902 ,  Y10T29/49071 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/4921 ,  Y10T29/49218 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/85399 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member having an intrinsic stress profile. The intrinsic stress profile biases a free portion away from the substrate forming a loop winding. An anchor portion remains fixed to the substrate. The free portion end becomes a second anchor portion which may be connected to the substrate via soldering or plating. A series of individual coil structures can be joined via their anchor portions to form inductors and transformers.

Abstract translation: 可以用于高Q电感和变压器的片上集成的平面外微结构使得磁场方向平行于衬底平面而不需要高纵横比处理。 光刻图案的线圈结构包括具有固有应力分布的弹性构件。 固有的应力分布使形成环绕的基板远离基板偏移。 锚固部分​​保持固定到基底上。 自由部分端部成为可以通过焊接或电镀而连接到基板的第二锚固部分。 一系列单独的线圈结构可以通过它们的锚定部分接合以形成电感器和变压器。

公开(公告)号：US20030057977A1

公开(公告)日：2003-03-27

申请号：US10225555

申请日：2002-08-21

Applicant: Xerox Corporation

Inventor： Alan J. Werner JR. ,  Fred F. Hubble III ,  Stanley J. Wallace ,  R. Enrique Viturro ,  Eric Peeters ,  Joel A. Kubby

IPC: G01R029/12 ,  G01R031/02

CPC classification number: G01R29/12

Abstract: An electrostatic type voltmeter for measuring the potential on a surface, the voltmeter including a probe; a support for supporting the probe in spaced relationship with the surface, the probe having a plurality of spacing element sites thereon for measuring a distance between each of the plurality of spacing element sites and a corresponding area on the surface opposite of each of the plurality of spacing element sites; a plurality of electrostatic element sites, intermixed and adjacent to the plurality of spacing element sites on the probe, for measuring a voltage between each of the plurality of spacing element sites and an area on the surface adjacent to the corresponding area opposite of each of the plurality of spacing element sites. A processor for compensating an output signal of the probe in response to the measurements received from the plurality of spacing element sites and the plurality of electrostatic element sites.

Abstract translation: 一种用于测量表面上的电位的静电型电压表，所述电压表包括探针; 用于支撑所述探针与所述表面间隔开的关系，所述探针在其上具有多个间隔元件位置，用于测量所述多个间隔元件位置中的每一个之间的距离以及与所述多个 间距单元; 多个静电元件位置，与探针上的多个间隔元件位置相互混合并相邻，用于测量多个间隔元件位置中的每一个之间的电压，以及与表面上相邻的相应区域相邻的表面上的区域 多个间距元件位置。 一种处理器，用于响应于从多个间隔元件位置和多个静电元件位点接收的测量值来补偿探针的输出信号。