公开(公告)号：US20210181559A1

公开(公告)日：2021-06-17

申请号：US16815800

申请日：2020-03-11

Applicant: Xiamen Tianma Micro-Electronics Co.,Ltd.

Inventor： Donghua LI ,  Xiaoli WEI ,  Xiufeng ZHOU ,  Guochang LAI ,  Shumao WU ,  Boping SHEN

IPC: G02F1/1345 ,  G02F1/1339 ,  G02F1/1362 ,  G02F1/1368 ,  G09G3/20

Abstract: A display substrate, a display module and a control method are provided in the present disclosure. The display substrate includes a first substrate and a second substrate. The first substrate includes a base substrate, conductive pads, a first switch unit group electrically connected to the conductive pads and signal wires, and a second switch unit group electrically connected to the conductive pads. The display substrate includes a substrate detection phase where all second switch units are cutoff, all first switch units are conducting, and an external detection device input a first detection signal to the substrate through the conductive pads and all first switch units. When the first switch unit group is conducting, the conductive pads are used for substrate detection, and when the second switch unit group is cutoff, the conductive pads in a same pad region are connected each other to be multiplexed as electrostatic conductive pads.

公开(公告)号：US20190041681A1

公开(公告)日：2019-02-07

申请号：US16139215

申请日：2018-09-24

Applicant: Xiamen Tianma Micro-Electronics Co., Ltd.

Inventor： Guochang LAI ,  Hongbo ZHOU ,  Huangyao WU ,  Zhongjie ZHANG ,  Qiongqin MAO

IPC: G02F1/1345 ,  G02F1/1335 ,  G02F1/1362

CPC classification number: G02F1/13452 ,  G02F1/133528 ,  G02F1/13458 ,  G02F1/136204 ,  G02F1/136286 ,  G02F2202/16 ,  G02F2202/22 ,  G02F2202/28 ,  H01L23/49572 ,  H01L23/4985 ,  H01L23/49855 ,  H01L23/5387 ,  H01L23/5388 ,  H01L27/3244 ,  H01L27/3276

Abstract: A display panel and a display device are provided. The display panel includes a first substrate having a step area; a second substrate disposed opposite to the first substrate, wherein the second substrate has a first surface facing the first substrate and an opposite second surface; a Chip On Flex (COF) disposed on the step area of the first substrate and including at least one ground pad; a conductive layer disposed on the second surface of the second substrate; and a conductive adhesive electrically connected to the conductive layer and the at least one ground pad.