Abstract:
An electrical connector includes a first connector which includes a first insulating body and first terminals disposed in the first insulating body with one end thereof being exposed outside for connecting with one external connector, a second connector which includes a second insulating body and second terminals disposed in the second insulating body with one end thereof being exposed outside for connecting with another different external connector, and a shell enclosing the first connector and the second connector and looped from a metal plate with a matching mouth being freely opened for the convenience of the insertion of the external connectors to connect with the first connector or the second connector, wherein the first connector and the second connector are connected together by molding the first insulating body and the second insulating body integrally in a single mold.
Abstract:
A card connector is disclosed. The card connector comprises an insulative base, a plurality of connecting terminals, a card ejecting mechanism and a shielding case. The shielding case covers the insulative base. A card insertion region is formed between the insulative base and the shielding case. A plurality of terminal slots is defined on a surface of the insulative base facing the card insertion region. The connecting terminals are received in the terminal slots. The tray comprises an inner tray and an outer tray. The outer tray is pivotally connected to the inner tray. The inner tray and the outer tray are connected together to form a receiving groove for receiving a SIM card. The tray is formed by pivotally connecting the inner tray to the outer tray, therefore, the card connector according to the present invention can be used more conveniently.
Abstract:
An electrical connector includes an insulating body, a low-speed transmission terminal group including electrical terminals, a high-speed transmission terminal group including at least one outputting signal terminal and at least one receiving signal terminal, and a positioning body which has a fastening portion mounted under a rear of the insulating body and a positioning portion hanged behind the insulating body. Each of the terminals has a fastening strip, a contact portion and a soldering tail connected with two opposite ends of the fastening strip. The soldering tails of the outputting and receiving signal terminals protrude sideward to form eave boards broadening the outputting and receiving signal terminals for lowering the differential impedance of the high-speed transmission terminal group. The fastening strips are disposed in two opposite surfaces of the insulating body. The soldering tails and the eave boards stretch behind the insulating body to be positioned in the positioning portion.
Abstract:
An electrical connector includes an insulating body having a base portion and a tongue portion extending forward from the base portion, a plurality of terminals disposed in two opposite surfaces of the tongue portion and each having a soldering tail which stretches behind the base portion and further projects upward beyond a top of the base portion, and a lid having a positioning body and a fastening portion protruding forward from the positioning body. The positioning body defines a plurality of positioning apertures spaced from one another and each extending vertically to penetrate through the positioning body. The fastening portion is mounted to the top of the base portion to make the positioning body locate behind the base portion. The soldering tails are inserted in the positioning apertures to be positioned and strengthened by the positioning body, with free ends thereof projecting beyond a top of the positioning body.
Abstract:
A card connector adapted for receiving a SIM card includes an insulating housing having a front surface and two opposite lateral surfaces. The front surface has at least one receiving recess extending rearward. Each of the lateral surfaces has a propping portion which passes through a top surface of the insulating housing. A plurality of connecting terminals is received in the insulating housing. The metal shell coupled with the insulating housing has a covering plate and two lateral plates extending downwards from two opposite sides of the covering plate. A front edge of the covering plate has at least one first mating portion of L shape of which a bottom is received in the receiving recess. A bottom of the lateral plate curves inwards to form a resistive portion resting against the propping portion for forming a chamber for receiving the SIM card.
Abstract:
Phase shifting allows generating very narrow features in a printed features layer. Thus, forming a fabrication layout for a physical design layout having critical features typically includes providing a layout for shifters. Specifically, pairs of shifters can be placed to define critical features, wherein the pairs of shifters conform to predetermined design rules. After placement, phase information for the shifters associated with the set of critical features can be assigned. Complex designs can lead to phase-shift conflicts among shifters in the fabrication layout. An irresolvable conflict can be passed to the design process earlier than in a conventional processes, thereby saving valuable time in the fabrication process for printed circuits.
Abstract:
Systems and methods for timing-driven shape closure in integrated circuit (“IC”) fabrication are provided. These Integrated Design-Manufacturing Processes (“IDMP”) include a delta flow that integrates information of the IC fabrication timing and geometry verification processes into the IC design. The delta flow is an incremental flow that includes delta-geometry timing prediction processes and/or delta-timing shape prediction processes for processing difference information associated with circuit characterization parameters. The delta flow independently re-characterizes an IC design using the difference or delta information corresponding to the circuit characterization parameters. The delta flow provides delta outputs (incremental) that enhance or re-characterize corresponding parameters of the devices and interconnect structures without the need to generate new circuit characterization parameters and without the need to re-process all information of the IC design.