摘要:
An LC-VCO includes a multivibrator which outputs a frequency signal, a fine tuning circuit which tunes the frequency signal by a first amount, a coarse tuning circuit which tunes the frequency signal by a second amount, and a control circuit which controls the fine and coarse tuning circuits. The coarse tuning circuit is formed from one or more capacitive arrays and the fine tuning circuit is formed from one or more varactors. The capacitive arrays are preferably controlled by a digital signal, where each bit selectively couples a respective capacitor to the multivibrator. An analog signal controls the value of the varactors. The capacitive arrays and varactors charge and discharge an inducator in the multivibrator to tune the frequency signal. The VCO may be incorporated within a phase-locked loop, where the capacitors may be assigned different weight and/or redundancy values to tune an output frequency signal. In one embodiment, coarse tuning and lead-lag detection is performed more accurately to allow the size of the varactors to become significantly reduced compared with other circuits which have been proposed.
摘要:
A voltage-controlled oscillator including an active oscillator circuit, an inductor, and capacitive circuits is disclosed. The capacitive circuits are selectively turned on and off to control the frequency of the voltage-controlled oscillator. Particularly, the inductor and the capacitors in the capacitive circuits form LC circuits that provide feedback to the active oscillator circuit. To avoid damage to the switches in the capacitive circuits, the capacitive circuits further comprise resistors. The resistors can be configured in several different ways so that the voltage-controlled oscillator can have a high degree of reliability, and a wide tuning range with constant phase noise performance.
摘要:
An integrated circuit package includes an inductance loop formed from a connection of bonding wires and one or more input/output (I/O) package pins. In one embodiment, the inductance loop is formed from a first wire which connects a bonding pad on the integrated circuit chip to an I/O pin of the package and a second wire which connects the same bonding pad to the same pin. By forming the inductor loop within the limits of the integrated circuit package, a substantial reduction in space requirements is realized, which, in turn, promotes miniaturization.
摘要:
An integrated circuit package includes an inductance loop formed from a connection of bonding wires and one or more input/output (I/O) package pins. In one embodiment, the inductance loop is formed from a first wire which connects a bonding pad on the integrated circuit chip to an I/O pin of the package and a second wire which connects the same bonding pad to the same pin. By forming the inductor loop within the limits of the integrated circuit package, a substantial reduction in space requirements is realized, which, in turn, promotes miniaturization.
摘要:
An integrated circuit package includes an inductance loop formed from a connection of lead wires and one or more input/output (I/O) package pins. In one embodiment, the inductance loop is formed from a first wire which connects a first bonding pad on the integrated circuit chip to a first I/O pin of the package and a second wire which connects a second bonding pad on the chip to a second I/O pin of the package. To complete the inductor loop, the first and second I/O pins are connected by a conductive bridge between the pins. The bridge may be formed by making the I/O pins have a unitary construction. In another embodiment, the bridge is formed by a metallization layer located either on the surface of the package substrate or within this substrate. The I/O pins are preferably ones which are adjacent one another; however, the loop may be formed from non-adjacent connections of I/O pins based, for example, on loop-length requirements, space considerations, and/or other design or functional factors. By forming the inductor loop within the limits of the integrated circuit package, a substantial reduction in space requirements is realized, which, in turn, promotes miniaturization. Also, the integrated circuit may be implemented in any one of a variety of systems, at least one parameter of which is controlled by the length of the inductor loop of the package.
摘要:
An integrated circuit package includes an inductance loop formed from a connection of bonding wires and one or more input/output (I/O) package pins. In one embodiment, the inductance loop is formed from a first wire which connects a bonding pad on the integrated circuit chip to an I/O pin of the package and a second wire which connects the same bonding pad to the same pin. By forming the inductor loop within the limits of the integrated circuit package, a substantial reduction in space requirements is realized, which, in turn, promotes miniaturization.
摘要:
A sigma-delta based phase lock loop device is provided that includes a phase frequency detector (PFD), a charge pump and a voltage controlled oscillator. The PFD to receive a reference signal and a feedback signal and to output signals based on a comparison of the reference signal and the feedback signal. The charge pump to output a charge based on the output signals from the PFD. The charge pump including a first current source to apply a fixed amount of current and a second current source to apply a variable amount of current. The voltage controlled oscillator to output a clock signal based on the received charge from the charge pump.
摘要:
An LC-VCO includes a multivibrator which outputs a frequency signal, a fine tuning circuit which tunes the frequency signal by a first amount, a coarse tuning circuit which tunes the frequency signal by a second amount, and a control circuit which controls the fine and coarse tuning circuits. The coarse tuning circuit is formed from one or more capacitive arrays and the fine tuning circuit is formed from one or more varactors. The capacitive arrays are preferably controlled by a digital signal, where each bit selectively couples a respective capacitor to the multivibrator. An analog signal controls the value of the varactors. The capacitive arrays and varactors charge and discharge an inducator in the multivibrator to tune the frequency signal. The VCO may be incorporated within a phase-locked loop, where the capacitors may be assigned different weight and/or redundancy values to tune an output frequency signal. In one embodiment, coarse tuning and lead-lag detection is performed more accurately to allow the size of the varactors to become significantly reduced compared with other circuits which have been proposed.
摘要:
An integrated circuit package includes an inductance loop formed from a connection of lead wires and one or more input/output (I/O) package pins. In one embodiment, the inductance loop is formed from first and second wires which connect a first bonding pad on the integrated circuit chip to a first I/O pin of the package and a third and fourth wires which connect a second bonding pad on the chip to a second I/O pin of the package. To complete the inductor loop, the first and second I/O pins are connected by a third conductor between the pins. The third conductor may include one or more bonding wires and the I/O pins are preferably ones which are adjacent one another. However, the loop may be formed from non-adjacent connections of I/O pins based, for example, on loop-length requirements, space considerations, and/or other design or functional factors. In another embodiment, connection between the first and second I/O pins is established by making the I/O pins have a unitary construction. In another embodiment, connection between the first and second I/O pins is established by a metallization layer located either on the surface of the package substrate or within this substrate. By forming the inductor loop within the limits of the integrated circuit package, a substantial reduction in space requirements is realized, which, in turn, promotes miniaturization. Also, the integrated circuit may be implemented in any one of a variety of systems, at least one parameter of which is controlled by the length of the inductor loop of the package.
摘要:
A sigma-delta based phase lock loop device is provided that includes a phase frequency detector (PFD), a charge pump and a voltage controlled oscillator. The PFD to receive a reference signal and a feedback signal and to output signals based on a comparison of the reference signal and the feedback signal. The charge pump to output a charge based on the output signals from the PFD. The charge pump including a first current source to apply a fixed amount of current and a second current source to apply a variable amount of current. The voltage controlled oscillator to output a clock signal based on the received charge from the charge pump.