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    Integrated circuit package having inductance loop formed from a bridge interconnect
    2.
    发明申请
    Integrated circuit package having inductance loop formed from a bridge interconnect 有权
    集成电路封装，其具有由桥互连形成的电感环路

    公开(公告)号：US20050045988A1

    公开(公告)日：2005-03-03

    申请号：US10927152

    申请日：2004-08-27

    申请人： Yido Koo ,  Hyungki Huh ,  Kang Yoon Lee ,  Jeong-Woo Lee ,  Joonbae Park ,  Kyeongho Lee

    发明人： Yido Koo ,  Hyungki Huh ,  Kang Yoon Lee ,  Jeong-Woo Lee ,  Joonbae Park ,  Kyeongho Lee

    IPC分类号： H01L20060101 ,  H01L23/64 ,  H01L29/00 ,  H03B5/12

    CPC分类号： H01L23/642 ,  H01L23/645 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6611 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H03B5/1215 ,  H03B5/1228 ,  H03B5/1265 ,  H01L2224/45099 ,  H01L2224/05599

    摘要： An integrated circuit package includes an inductance loop formed from a connection of lead wires and one or more input/output (I/O) package pins. In one embodiment, the inductance loop is formed from a first wire which connects a first bonding pad on the integrated circuit chip to a first I/O pin of the package and a second wire which connects a second bonding pad on the chip to a second I/O pin of the package. To complete the inductor loop, the first and second I/O pins are connected by a conductive bridge between the pins. The bridge may be formed by making the I/O pins have a unitary construction. In another embodiment, the bridge is formed by a metallization layer located either on the surface of the package substrate or within this substrate. The I/O pins are preferably ones which are adjacent one another; however, the loop may be formed from non-adjacent connections of I/O pins based, for example, on loop-length requirements, space considerations, and/or other design or functional factors. By forming the inductor loop within the limits of the integrated circuit package, a substantial reduction in space requirements is realized, which, in turn, promotes miniaturization. Also, the integrated circuit may be implemented in any one of a variety of systems, at least one parameter of which is controlled by the length of the inductor loop of the package.

    摘要翻译： 集成电路封装包括由引线和一个或多个输入/输出（I / O）封装引脚的连接形成的电感回路。 在一个实施例中，电感回路由将集成电路芯片上的第一接合焊盘连接到封装的第一I / O引脚的第一引线和将芯片上的第二接合焊盘连接到第二引线的第二引线形成 封装的I / O引脚。 为了完成电感环路，第一和第二I / O引脚通过引脚之间的导电桥连接。 可以通过使I / O引脚具有单一结构来形成桥。 在另一个实施例中，桥由位于封装衬底的表面上或在该衬底内的金属化层形成。 I / O引脚优选为彼此相邻的引脚; 然而，环路可以基于例如环路长度要求，空间考虑和/或其他设计或功能因素的I / O引脚的不相邻连接形成。 通过在集成电路封装的极限内形成电感器回路，实现了空间要求的显着降低，这反过来促进了小型化。 此外，集成电路可以在各种系统中的任何一个中实现，其中的至少一个参数由封装的电感器环的长度来控制。

    Integrated circuit package having an inductance loop formed from a multi-loop configuration
    3.
    发明授权
    Integrated circuit package having an inductance loop formed from a multi-loop configuration 有权
    具有由多回路配置形成的电感回路的集成电路封装

    公开(公告)号：US07768097B2

    公开(公告)日：2010-08-03

    申请号：US10927012

    申请日：2004-08-27

    申请人： Yido Koo ,  Hyungki Huh ,  Kang Yoon Lee ,  Jeong-Woo Lee ,  Joonbae Park ,  Kyeongho Lee

    发明人： Yido Koo ,  Hyungki Huh ,  Kang Yoon Lee ,  Jeong-Woo Lee ,  Joonbae Park ,  Kyeongho Lee

    IPC分类号： H01L23/58 ,  H01L29/00 ,  H03B7/06

    CPC分类号： H01L23/642 ,  H01L23/645 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05553 ,  H01L2224/48091 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2224/45099 ,  H01L2224/05599

    摘要： An integrated circuit package includes an inductance loop formed from a connection of lead wires and one or more input/output (I/O) package pins. In one embodiment, the inductance loop is formed from first and second wires which connect a first bonding pad on the integrated circuit chip to a first I/O pin of the package and a third and fourth wires which connect a second bonding pad on the chip to a second I/O pin of the package. To complete the inductor loop, the first and second I/O pins are connected by a third conductor between the pins. The third conductor may include one or more bonding wires and the I/O pins are preferably ones which are adjacent one another. However, the loop may be formed from non-adjacent connections of I/O pins based, for example, on loop-length requirements, space considerations, and/or other design or functional factors. In another embodiment, connection between the first and second I/O pins is established by making the I/O pins have a unitary construction. In another embodiment, connection between the first and second I/O pins is established by a metallization layer located either on the surface of the package substrate or within this substrate. By forming the inductor loop within the limits of the integrated circuit package, a substantial reduction in space requirements is realized, which, in turn, promotes miniaturization. Also, the integrated circuit may be implemented in any one of a variety of systems, at least one parameter of which is controlled by the length of the inductor loop of the package.

    摘要翻译： 集成电路封装包括由引线和一个或多个输入/输出（I / O）封装引脚的连接形成的电感回路。 在一个实施例中，电感回路由将集成电路芯片上的第一接合焊盘连接到封装的第一I / O引脚的第一和第二引线形成，以及连接芯片上的第二焊盘的第三和第四引线 到包的第二个I / O引脚。 为了完成电感线圈，第一和第二I / O引脚通过引脚之间的第三根导体连接。 第三导体可以包括一个或多个接合线，并且I / O引脚优选地彼此相邻。 然而，环路可以基于例如环路长度要求，空间考虑和/或其他设计或功能因素的I / O引脚的不相邻连接形成。 在另一个实施例中，通过使I / O引脚具有整体结构来建立第一和第二I / O引脚之间的连接。 在另一个实施例中，第一和第二I / O引脚之间的连接由位于封装基板的表面上或者在该基板内的金属化层建立。 通过在集成电路封装的极限内形成电感器回路，实现了空间要求的显着降低，这反过来促进了小型化。 此外，集成电路可以在各种系统中的任何一个中实现，其中的至少一个参数由封装的电感器环的长度来控制。

    Integrated circuit package having inductance loop formed from a bridge interconnect
    4.
    发明授权
    Integrated circuit package having inductance loop formed from a bridge interconnect 有权
    集成电路封装，其具有由桥互连形成的电感环路

    公开(公告)号：US07071535B2

    公开(公告)日：2006-07-04

    申请号：US10927152

    申请日：2004-08-27

    申请人： Yido Koo ,  Hyungki Huh ,  Kang Yoon Lee ,  Jeong-Woo Lee ,  Joonban Park ,  Kyeongho Lee

    发明人： Yido Koo ,  Hyungki Huh ,  Kang Yoon Lee ,  Jeong-Woo Lee ,  Joonban Park ,  Kyeongho Lee

    IPC分类号： H01L29/00 ,  H03B7/14

    CPC分类号： H01L23/642 ,  H01L23/645 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6611 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H03B5/1215 ,  H03B5/1228 ,  H03B5/1265 ,  H01L2224/45099 ,  H01L2224/05599

    摘要： An integrated circuit package includes an inductance loop formed from a connection of lead wires and one or more input/output (I/O) package pins. In one embodiment, the inductance loop is formed from a first wire which connects a first bonding pad on the integrated circuit chip to a first I/O pin of the package and a second wire which connects a second bonding pad on the chip to a second I/O pin of the package. To complete the inductor loop, the first and second I/O pins are connected by a conductive bridge between the pins. The bridge may be formed by making the I/O pins have a unitary construction. In another embodiment, the bridge is formed by a metallization layer located either on the surface of the package substrate or within this substrate. The I/O pins are preferably ones which are adjacent one another; however, the loop may be formed from non-adjacent connections of I/O pins based, for example, on loop-length requirements, space considerations, and/or other design or functional factors. By forming the inductor loop within the limits of the integrated circuit package, a substantial reduction in space requirements is realized, which, in turn, promotes miniaturization. Also, the integrated circuit may be implemented in any one of a variety of systems, at least one parameter of which is controlled by the length of the inductor loop of the package.

    摘要翻译： 集成电路封装包括由引线和一个或多个输入/输出（I / O）封装引脚的连接形成的电感回路。 在一个实施例中，电感回路由将集成电路芯片上的第一接合焊盘连接到封装的第一I / O引脚的第一引线和将芯片上的第二接合焊盘连接到第二引线的第二引线形成 封装的I / O引脚。 为了完成电感环路，第一和第二I / O引脚通过引脚之间的导电桥连接。 可以通过使I / O引脚具有单一结构来形成桥。 在另一个实施例中，桥由位于封装衬底的表面上或在该衬底内的金属化层形成。 I / O引脚优选为彼此相邻的引脚; 然而，环路可以基于例如环路长度要求，空间考虑和/或其他设计或功能因素的I / O引脚的不相邻连接形成。 通过在集成电路封装的极限内形成电感器回路，实现了空间要求的显着降低，这反过来促进了小型化。 此外，集成电路可以在各种系统中的任何一个中实现，其中的至少一个参数由封装的电感器环的长度来控制。

    Sample and hold type fractional-N frequency synthesizer
    5.
    发明授权
    Sample and hold type fractional-N frequency synthesizer 有权
    采样和保持型小数N频率合成器

    公开(公告)号：US06704383B2

    公开(公告)日：2004-03-09

    申请号：US09940808

    申请日：2001-08-29

    申请人： Jeongwoo Lee ,  Yido Koo ,  Kang Yoon Lee ,  Eunseok Song ,  Hyungki Huh ,  Joonbae Park ,  Kyeongho Lee

    发明人： Jeongwoo Lee ,  Yido Koo ,  Kang Yoon Lee ,  Eunseok Song ,  Hyungki Huh ,  Joonbae Park ,  Kyeongho Lee

    IPC分类号： H03D324

    CPC分类号： H03L7/0898 ,  H03L7/087 ,  H03L7/095 ,  H03L7/1976

    摘要： A phase-locked loop (PLL) fractional-N type frequency synthesizer incorporates a sample-and-hold circuit. The synthesizer can reduce circuit size by eliminating a loop filter. Further, the synthesizer can incorporate fractional spur compensation circuitry to compensate charge pump ripple whenever a charge pump operates. The synthesizer or fractional-N type PLL can use a divider and at least two phase detectors coupled to a sample-and-hold circuit. A lock detecting circuit can initially determine a reference voltage for the sample-and-hold circuit. Also, fractional compensation is accomplished dynamically and in a manner that is robust to environmental changes while a control voltage is stably maintained for the voltage controlled oscillator.

    摘要翻译： 锁相环（PLL）小数N型频率合成器包含采样保持电路。 合成器可以通过消除环路滤波器来减小电路尺寸。 此外，合成器可以包括分数支路补偿电路，以便在电荷泵工作时补偿电荷泵波动。 合成器或分数N型PLL可以使用分频器和耦合到采样和保持电路的至少两个相位检测器。 锁定检测电路可以最初确定采样和保持电路的参考电压。 此外，分数补偿是动态地实现的，并且以对于环境变化是稳健的方式实现，同时稳定地维持用于压控振荡器的控制电压。

    Integrated circuit package having an inductance loop formed from a multi-loop configuration
    9.
    发明申请
    Integrated circuit package having an inductance loop formed from a multi-loop configuration 有权
    具有由多回路配置形成的电感回路的集成电路封装

    公开(公告)号：US20050045986A1

    公开(公告)日：2005-03-03

    申请号：US10927012

    申请日：2004-08-27

    申请人： Yido Koo ,  Hyungki Huh ,  Kang Lee ,  Jeong-Woo Lee ,  Joonbae Park ,  Kyeongho Lee

    发明人： Yido Koo ,  Hyungki Huh ,  Kang Lee ,  Jeong-Woo Lee ,  Joonbae Park ,  Kyeongho Lee

    IPC分类号： H01L20060101 ,  H01L23/64 ,  H01L29/00

    CPC分类号： H01L23/642 ,  H01L23/645 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05553 ,  H01L2224/48091 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2224/45099 ,  H01L2224/05599

    摘要： An integrated circuit package includes an inductance loop formed from a connection of lead wires and one or more input/output (I/O) package pins. In one embodiment, the inductance loop is formed from first and second wires which connect a first bonding pad on the integrated circuit chip to a first I/O pin of the package and a third and fourth wires which connect a second bonding pad on the chip to a second I/O pin of the package. To complete the inductor loop, the first and second I/O pins are connected by a third conductor between the pins. The third conductor may include one or more bonding wires and the I/O pins are preferably ones which are adjacent one another. However, the loop may be formed from non-adjacent connections of I/O pins based, for example, on loop-length requirements, space considerations, and/or other design or functional factors. In another embodiment, connection between the first and second I/O pins is established by making the I/O pins have a unitary construction. In another embodiment, connection between the first and second I/O pins is established by a metallization layer located either on the surface of the package substrate or within this substrate. By forming the inductor loop within the limits of the integrated circuit package, a substantial reduction in space requirements is realized, which, in turn, promotes miniaturization. Also, the integrated circuit may be implemented in any one of a variety of systems, at least one parameter of which is controlled by the length of the inductor loop of the package.

    摘要翻译： 集成电路封装包括由引线和一个或多个输入/输出（I / O）封装引脚的连接形成的电感回路。 在一个实施例中，电感回路由将集成电路芯片上的第一接合焊盘连接到封装的第一I / O引脚的第一和第二引线形成，以及连接芯片上的第二焊盘的第三和第四引线 到包的第二个I / O引脚。 为了完成电感线圈，第一和第二I / O引脚通过引脚之间的第三根导体连接。 第三导体可以包括一个或多个接合线，并且I / O引脚优选地彼此相邻。 然而，环路可以基于例如环路长度要求，空间考虑和/或其他设计或功能因素的I / O引脚的不相邻连接形成。 在另一个实施例中，通过使I / O引脚具有整体结构来建立第一和第二I / O引脚之间的连接。 在另一个实施例中，第一和第二I / O引脚之间的连接由位于封装基板的表面上或者在该基板内的金属化层建立。 通过在集成电路封装的极限内形成电感器回路，实现了空间要求的显着降低，这反过来促进了小型化。 此外，集成电路可以在各种系统中的任何一个中实现，其中的至少一个参数由封装的电感器环的长度来控制。