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公开(公告)号:US20090283896A1
公开(公告)日:2009-11-19
申请号:US12453405
申请日:2009-05-11
Applicant: Yu-Lin Yang
Inventor: Yu-Lin Yang
IPC: H01L23/498 , H01L21/98 , H01L21/56
CPC classification number: H01L23/3128 , H01L21/56 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0657 , H01L2224/274 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/49 , H01L2224/73265 , H01L2225/0651 , H01L2225/06575 , H01L2924/00014 , H01L2924/01014 , H01L2924/01033 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
Abstract: A semiconductor die has a surface and an active region on the surface. A thick-film coating is applied to the surface of the semiconductor die to cover only a portion or entire of the active region before the semiconductor die is cut from a wafer. The thick-film coating reduces the stress to the semiconductor die. The thick-film coating does not cover the bonding pads of the semiconductor die to avoid influencing the bonding wires bonding to the boding pads.
Abstract translation: 半导体管芯具有表面和表面上的有源区。 在半导体管芯从晶片切割之前,将厚膜涂层施加到半导体管芯的表面,以仅覆盖有源区域的一部分或全部。 厚膜涂层减少了对半导体管芯的应力。 厚膜涂层不覆盖半导体管芯的接合焊盘,以避免影响结合到焊盘的接合线。
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12.
公开(公告)号:US20240350564A1
公开(公告)日:2024-10-24
申请号:US18302922
申请日:2023-04-19
Applicant: Yu-Lin Yang
Inventor: Yu-Lin Yang
IPC: A61K35/745 , A61K35/747 , A61K36/287 , A61K36/41 , A61K36/42 , A61K36/48 , A61K36/537 , A61K36/605 , A61K36/73 , A61K36/736 , A61P39/00
CPC classification number: A61K35/745 , A61K35/747 , A61K36/287 , A61K36/41 , A61K36/42 , A61K36/48 , A61K36/537 , A61K36/605 , A61K36/73 , A61K36/736 , A61P39/00 , A61K2035/115
Abstract: A composition with NRF mitochondria activating ingredient has telomere extension, anti-aging and cell-rejuvenating effects, including salvia miltiorrhiza extract, wheat α-amylase inhibitor, and probiotic powder. After taken by users, the composition reaches a health effect by extending the telomere length and to reduce the cell age and get younger.
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