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11.
公开(公告)号:US08633597B2
公开(公告)日:2014-01-21
申请号:US12714918
申请日:2010-03-01
CPC分类号: H01L23/3677 , H01L21/6835 , H01L23/49816 , H01L23/5389 , H01L24/16 , H01L24/25 , H01L24/48 , H01L24/82 , H01L25/03 , H01L2224/16225 , H01L2224/16227 , H01L2224/2518 , H01L2224/48091 , H01L2224/82001 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01087 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19107 , H01L2924/00 , H01L2224/0401 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: In a multi-module integrated circuit package having a package substrate and package contacts, a die is embedded in the package substrate with thermal vias that couple hotspots on the embedded die to some of the package contacts.
摘要翻译: 在具有封装衬底和封装触点的多模块集成电路封装中,裸片被嵌入封装衬底中,其中热通孔将嵌入裸片上的热点耦合到一些封装触点。