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    SHAPE MEMORY ALLOY DRIVER
    11.
    发明申请
    SHAPE MEMORY ALLOY DRIVER 失效
    形状记忆合金驱动

    公开(公告)号：US20100320943A1

    公开(公告)日：2010-12-23

    申请号：US12745283

    申请日：2008-11-25

    申请人： Yasuhiro Honda

    发明人： Yasuhiro Honda

    IPC分类号： H02N10/00

    CPC分类号： F03G7/065 ,  G02B7/028 ,  G02B7/08

    摘要： A shape memory alloy driver comprises a displacement detection portion, a drive control portion, and a compensation calculation portion. The displacement detection portion detects displacement of a shape memory alloy based on a resistance value etc. detected from the shape memory alloy. The drive control portion applies a voltage or current to the shape memory alloy by servo control to thereby displace the shape memory alloy to a target displacement value fed from a microcomputer etc. The compensation calculation portion calculates a compensated displacement value from the detected displacement value and a variation—attributable to the environment temperature—of the drive control value which the drive control portion uses for controlling the voltage or current. Having been fed with the compensated displacement value, the drive control portion varies the drive control value such that the compensated displacement value is equal to the target displacement value.

    摘要翻译： 形状记忆合金驱动器包括位移检测部分，驱动控制部分和补偿计算部分。 位移检测部根据从形状记忆合金检测出的电阻值等来检测形状记忆合金的位移。 驱动控制部通过伺服控制向形状记忆合金施加电压或电流，从而将形状记忆合金移动到从微型计算机等馈送的目标位移值。补偿计算部根据检测到的位移值计算补偿位移值， 驱动控制部分用于控制电压或电流的驱动控制值的环境温度的变化。 已经馈送了补偿的位移值，驱动控制部分改变驱动控制值，使得补偿的位移值等于目标位移值。

    Thermoplastic resin composition
    13.
    发明授权
    Thermoplastic resin composition 失效
    热塑性树脂组合物

    公开(公告)号：US4490506A

    公开(公告)日：1984-12-25

    申请号：US539787

    申请日：1983-10-07

    申请人： Hajime Sakano ,  Akitoshi Ito ,  Motoichi Yano ,  Yasuhiro Honda

    发明人： Hajime Sakano ,  Akitoshi Ito ,  Motoichi Yano ,  Yasuhiro Honda

    IPC分类号： C08L51/00 ,  C08L7/00 ,  C08L21/00 ,  C08L33/00 ,  C08L33/02 ,  C08L51/02 ,  C08L51/04 ,  C08L55/02 ,  C08L69/00

    CPC分类号： C08L55/02 ,  C08L69/00

    摘要： A thermoplastic resin composition excellent in impact resistance and moldability and improved in falling ball impact strength at a weld part which comprises (A) a polycarbonate resin having a reduced viscosity at 25.degree. C. in chloroform of 0.40 to 0.55 and (B) a diene-rubber modified resin comprising 10 to 100% by weight of a graft polymer of a diene rubber chosen from polybutadiene, styrene/butadiene copolymer and butadiene-acrylonitrile copolymer, with an aromatic vinyl compound and at least one of a vinyl cyanide and an alkyl unsaturated carboxylate grafted thereon and 90 to 0% by weight of a copolymer of an aromatic vinyl compound with at least one of a vinyl cyanide and an alkyl unsaturated carboxylate. The diene-rubber modified resin has apparent melt viscosities at 250.degree. C. of 5.times.10.sup.3 to 1.times.10.sup.5 poise at a shear rate of 10.sup.2 sec.sup.-1 and of 1.5.times.10.sup.3 to 1.times.10.sup.4 poise at a shear rate of 10.sup.3 sec.sup.-1, the weight proportion of the components (A) and (B) being from 20:80 to 80:20.

    摘要翻译： 一种耐冲击性和成型性优异的热塑性树脂组合物，并且在焊接部分具有提高落球冲击强度的热塑性树脂组合物，该热塑性树脂组合物包含（A）在氯仿中在25℃下的粘度比为0.40至0.55的聚碳酸酯树脂和（B）二烯 - 橡胶改性树脂，其包含10至100重量％的选自聚丁二烯，苯乙烯/丁二烯共聚物和丁二烯 - 丙烯腈共聚物的二烯橡胶的接枝聚合物，具有芳族乙烯基化合物和至少一种乙烯基氰和不饱和烷基 羧酸酯和90至0重量％的芳族乙烯基化合物与至少一种乙烯基氰和不饱和羧酸烷基酯的共聚物。 二烯 - 橡胶改性树脂在102秒剪切速率下在250℃下具有5×10 3至1×10 5泊的表观熔体粘度，在103秒-1的剪切速率下具有1.5×10 3至1×10 4泊的显着熔体粘度， 组分（A）和（B）为20:80至80:20。

    Position control device, position control method, drive device and imaging device
    15.
    发明授权
    Position control device, position control method, drive device and imaging device 有权
    位置控制装置，位置控制方法，驱动装置和成像装置

    公开(公告)号：US08789765B2

    公开(公告)日：2014-07-29

    申请号：US12993725

    申请日：2009-05-11

    申请人： Yasuhiro Honda

    发明人： Yasuhiro Honda

    IPC分类号： G05D23/02

    CPC分类号： G02B7/08 ,  F03G7/065

    摘要： A position control device 1 and a position control method of the present invention are a technology used in a shape memory alloy actuator for moving a movable member using a shape memory alloy member. In controlling the position of the movable member, an instruction value indicating a position of the movable member as a control target is changed to reduce the temperature of a shape memory alloy member when an amount of power supplied to the shape memory alloy member is in excess of a predetermined first threshold value. A drive device and an imaging device C of the present invention include a shape memory alloy actuator and the position control device 1.

    摘要翻译： 本发明的位置控制装置1和位置控制方法是用于使用形状记忆合金构件移动可动构件的形状记忆合金致动器中使用的技术。 在控制可动构件的位置时，改变表示可动构件作为控制对象的位置的指示值，当供给到形状记忆合金构件的功率量超过时，形状记忆合金构件的温度降低 的预定第一阈值。 本发明的驱动装置和成像装置C包括形状记忆合金致动器和位置控制装置1。

    SHAPE MEMORY ALLOY ACTUATOR DRIVE DEVICE AND METHOD, AND IMAGING DEVICE USING THE SAME
    16.
    发明申请
    SHAPE MEMORY ALLOY ACTUATOR DRIVE DEVICE AND METHOD, AND IMAGING DEVICE USING THE SAME 审中-公开
    形状记忆合金致动器驱动装置和方法以及使用其的成像装置

    公开(公告)号：US20110242398A1

    公开(公告)日：2011-10-06

    申请号：US13133830

    申请日：2009-12-08

    申请人： Yasuhiro Honda ,  Nobuya Miki

    发明人： Yasuhiro Honda ,  Nobuya Miki

    IPC分类号： H04N5/232

    CPC分类号： G02B7/08 ,  F03G7/065

    摘要： A driving circuit (21) of a shape memory alloy actuator of the present invention measures by a measurement part a parameter value corresponding to a target position of a moving part that is displaced by being driven on account of the expansion and contraction of an SMA (15), which expands and contracts with temperature changes and which exhibits hysteresis in a parameter-distortion characteristic relating to the expansion and contraction, while the temperature of the SMA (15) is being raised or lowered. The driving circuit (21) sets the measured parameter value as a target parameter. The temperature of the SMA (15) is raised or lowered such that the parameter value measured by the measurement part passes the target parameter, before the crystal phase of the SMA (15) becomes a martensitic phase. Thereafter, the temperature of the SMA (15) is raised or lowered again such that the parameter value measured by the measurement part reaches the target parameter.

    摘要翻译： 本发明的形状记忆合金致动器的驱动电路（21）通过测量部分测量与通过SMA的膨胀和收缩而被驱动的移动部件的目标位置相对应的参数值（ 15），其随着温度变化而膨胀和收缩，并且在SMA（15）的温度升高或降低的同时，在与膨胀和收缩相关的参数失真特性中表现出迟滞。 驱动电路（21）将所测量的参数值设定为目标参数。 在SMA（15）的结晶相成为马氏体相之前，SMA（15）的温度升高或降低，使得由测量部件测量的参数值通过目标参数。 此后，SMA（15）的温度再次升高或降低，使得由测量部件测量的参数值达到目标参数。

    POSITION CONTROL DEVICE, POSITION CONTROL METHOD, DRIVE DEVICE AND IMAGING DEVICE
    17.
    发明申请
    POSITION CONTROL DEVICE, POSITION CONTROL METHOD, DRIVE DEVICE AND IMAGING DEVICE 有权
    位置控制装置，位置控制方法，驱动装置和成像装置

    公开(公告)号：US20110071663A1

    公开(公告)日：2011-03-24

    申请号：US12993725

    申请日：2009-05-11

    申请人： Yasuhiro Honda

    发明人： Yasuhiro Honda

    IPC分类号： G06F19/00

    CPC分类号： G02B7/08 ,  F03G7/065

    摘要： A position control device 1 and a position control method of the present invention are a technology used in a shape memory alloy actuator for moving a movable member using a shape memory alloy member. In controlling the position of the movable member, an instruction value indicating a position of the movable member as a control target is changed to reduce the temperature of a shape memory alloy member when an amount of power supplied to the shape memory alloy member is in excess of a predetermined first threshold value. A drive device and an imaging device C of the present invention include a shape memory alloy actuator and the position control device 1.

    摘要翻译： 本发明的位置控制装置1和位置控制方法是用于使用形状记忆合金构件移动可动构件的形状记忆合金致动器中使用的技术。 在控制可动构件的位置时，改变表示可动构件作为控制对象的位置的指示值，当供给到形状记忆合金构件的功率量超过时，形状记忆合金构件的温度降低 的预定第一阈值。 本发明的驱动装置和成像装置C包括形状记忆合金致动器和位置控制装置1。

    DRIVING DEVICE MADE OF SHAPE-MEMORY ALLOY
    18.
    发明申请
    DRIVING DEVICE MADE OF SHAPE-MEMORY ALLOY 失效
    形状记忆合金的驱动装置

    公开(公告)号：US20100296183A1

    公开(公告)日：2010-11-25

    申请号：US12812572

    申请日：2009-01-14

    申请人： Yasuhiro Honda ,  Yasutaka Tanimura ,  Natsuko Shiota ,  Yoshihiro Hara

    发明人： Yasuhiro Honda ,  Yasutaka Tanimura ,  Natsuko Shiota ,  Yoshihiro Hara

    IPC分类号： G02B7/04

    CPC分类号： F03G7/065 ,  G02B7/08

    摘要： A storing section (70) stores a second initial contact instruction value, which is predefined as an instruction value for positioning a movable portion (5) to a second contact position where the movable portion (5) is contacted with a stopper (8), and an initial standby instruction value, which is predefined as an instruction value for positioning the movable portion (5) to a specified standby position within a moving range of the movable portion (5). A correcting section (42) calculates an actual standby instruction value by correcting the initial standby instruction value, based on a second actual contact instruction value obtained when a contact detection section (41) has detected that the movable portion (5) is positioned to the second contact position, and the second initial contact instruction value. A setting section (43) sets a standby position corresponding to the actual standby instruction value, as an actual standby position of the movable portion (5).

    摘要翻译： 存储部（70）存储第二初始接触指示值，其被预先定义为用于将可动部（5）定位到可动部（5）与止动件（8）接触的第二接触位置的指示值， 以及初始待机指令值，其被预先定义为用于将可动部分（5）定位在可动部分（5）的移动范围内的指定待机位置的指令值。 校正部件（42）基于当接触检测部件（41）检测到可动部分（5）位于所述第二实际接触指令值时获得的第二实际接触指令值，通过校正初始待机指令值来计算实际待机指令值 第二接触位置和第二初始接触指令值。 设定部（43）将与实际待机指示值对应的待机位置设定为可动部（5）的实际备用位置。