公开(公告)号：US20020150840A1

公开(公告)日：2002-10-17

申请号：US10061273

申请日：2002-02-04

Applicant: PIONEER CORPORATION

Inventor： Masahiro Katsumura ,  Tetsuya Iida ,  Nobuhiro Oda ,  Takashi Ueno

IPC: C25D005/54 ,  C25D005/56

CPC classification number: C25D1/10 ,  B81C99/009 ,  B81C2201/0128 ,  B81C2201/032

Abstract: A stamper-forming electrode material contains Cu as its main ingredient and at least one other element, preferably Ag and/or Ti. It is preferred that the Ag content be 10.0 wt % or less and that the Ti content be 5.0 wt % or less. A stamper-forming thin film is made of this stamper-forming electrode material, whereby its corrosion resistance is improved to suppress damage to itself, and a high-quality stamper can hence be formed.

Abstract translation: 压模形成电极材料包含Cu作为其主要成分和至少一种其它元素，优选Ag和/或Ti。 Ag含量优选为10.0重量％以下，Ti含量为5.0重量％以下。 压模形成薄膜由该压模形成用电极材料制成，由此其耐腐蚀性得到改善以抑制其自身的损坏，因此可以形成高质量的压模。

公开(公告)号：US5496668A

公开(公告)日：1996-03-05

申请号：US340617

申请日：1994-11-16

Applicant: Henry Guckel ,  Todd R. Christenson ,  Kenneth Skrobis

Inventor： Henry Guckel ,  Todd R. Christenson ,  Kenneth Skrobis

IPC: G03F7/027 ,  B81B1/00 ,  B81C1/00 ,  G03F7/00 ,  G03F7/20 ,  G03F7/26 ,  G03F7/30 ,  G03F7/38 ,  G03F7/40 ,  H01L21/027 ,  H05K3/18

CPC classification number: G03F7/38 ,  B81C1/0038 ,  G03F7/00 ,  G03F7/0035 ,  B81C2201/0128 ,  B81C2201/0159 ,  B81C2201/019 ,  B81C2201/032 ,  Y10S430/168 ,  Y10T428/31504

Abstract: In the formation of microstructures, a preformed sheet of photoresist, such as polymethylmethacrylate (PMMA), which is strain free, may be milled down before or after adherence to a substrate to a desired thickness. The photoresist is patterned by exposure through a mask to radiation, such as X-rays, and developed using a developer to remove the photoresist material which has been rendered susceptible to the developer. Micrometal structures may be formed by electroplating metal into the areas from which the photoresist has been removed. The photoresist itself may form useful microstructures, and can be removed from the substrate by utilizing a release layer between the substrate and the preformed sheet which can be removed by a remover which does not affect the photoresist. Multiple layers of patterned photoresist can be built up to allow complex three dimensional microstructures to be formed.

公开(公告)号：US5378583A

公开(公告)日：1995-01-03

申请号：US66988

申请日：1993-05-24

Applicant: Henry Guckel ,  Todd R. Christenson ,  Kenneth Skrobis

Inventor： Henry Guckel ,  Todd R. Christenson ,  Kenneth Skrobis

IPC: G03F7/027 ,  B81B1/00 ,  B81C1/00 ,  G03F7/00 ,  G03F7/20 ,  G03F7/26 ,  G03F7/30 ,  G03F7/38 ,  G03F7/40 ,  H01L21/027 ,  H05K3/18 ,  G03C5/00

CPC classification number: G03F7/38 ,  B81C1/0038 ,  G03F7/00 ,  G03F7/0035 ,  B81C2201/0128 ,  B81C2201/0159 ,  B81C2201/019 ,  B81C2201/032 ,  Y10S430/168 ,  Y10T428/31504

Abstract: In the formation of microstructures, a preformed sheet of photoresist, such as polymethylmethacrylate (PMMA), which is strain free, may be milled down before or after adherence to a substrate to a desired thickness. The photoresist is patterned by exposure through a mask to radiation, such as X-rays, and developed using a developer to remove the photoresist material which has been rendered susceptible to the developer. Micrometal structures may be formed by electroplating metal into the areas from which the photoresist has been removed. The photoresist itself may form useful microstructures, and can be removed from the substrate by utilizing a release layer between the substrate and the preformed sheet which can be removed by a remover which does not affect the photoresist. Multiple layers of patterned photoresist can be built up to allow complex three dimensional microstructures to be formed.

Abstract translation: 在微结构的形成中，可以在将粘附到基底上之前或之后将预成型的光致抗蚀剂片材（例如无甲基丙烯酸甲酯（PMMA））磨碎到期望的厚度。 光致抗蚀剂通过掩模通过掩模曝光到例如X射线的辐射而被图案化，并且使用显影剂显影以除去已经对显影剂易感的光致抗蚀剂材料。 微米结构可以通过将金属电镀到已经除去光致抗蚀剂的区域中而形成。 光致抗蚀剂本身可以形成有用的微结构，并且可以通过利用基材和预成型片材之间的剥离层从基材上除去，该剥离层可以通过不影响光致抗蚀剂的去除剂去除。 可以构建多层图案化的光致抗蚀剂，以形成复杂的三维微结构。