公开(公告)号：US20140182338A1

公开(公告)日：2014-07-03

申请号：US14200675

申请日：2014-03-07

申请人： Corning Incorporated

发明人： Anatoli A. ABRAMOV ,  Jae H. YU ,  Naiyue ZHOU

IPC分类号： C03B33/08 ,  C03B21/00 ,  C03B17/06

CPC分类号： C03B33/082 ,  B65G2249/04 ,  C03B17/06 ,  C03B21/00 ,  C03B33/0215 ,  C03B33/091

摘要： Disclosed is a method of separating a glass sheet from a moving glass ribbon, wherein the glass ribbon comprises thickened bead portions. The method comprises weakening the bead portions of the ribbon using laser-initiated ablation at the bead portions to overcome the potential for uncontrolled cracking through the bead portion.

摘要翻译： 公开了一种从移动玻璃带分离玻璃板的方法，其中玻璃带包括增厚的珠部。 该方法包括在胎圈部分使用激光引发的烧蚀来削弱带的胎圈部分，以克服通过胎圈部分的不受控制的破裂的可能性。

公开(公告)号：US20120067858A1

公开(公告)日：2012-03-22

申请号：US13375499

申请日：2009-06-04

申请人： Jarno Kangastupa ,  Tiina Amberla

发明人： Jarno Kangastupa ,  Tiina Amberla

IPC分类号： B23K26/00

CPC分类号： C03C23/0025 ,  B23K26/0624 ,  B23K26/244 ,  B23K26/32 ,  B23K2101/40 ,  B23K2103/50 ,  B28D5/0011 ,  C03B33/0222 ,  C03B33/082 ,  Y02P40/57

摘要： The invention relates to a method and apparatus for processing substrates, such as glass and semiconductor wafers. The method comprises directing to the substrate from a laser source a plurality of sequential focused laser pulses having a predetermined duration, pulsing frequency and focal spot diameter, the pulses being capable of locally melting the substrate, and moving the laser source and the substrate with respect to each other at a predetermined moving velocity so that a structurally modified zone is formed to the substrate. According to the invention, the pulse duration is in the range of 20-100 ps, pulsing frequency at least 1 MHz and moving velocity adjusted such that the distance between successive pulses is less than ⅕ of the diameter of the focal spot. The invention can be utilized, for example, for efficient dicing, scribing and welding of materials which are normally transparent.

摘要翻译： 本发明涉及用于处理诸如玻璃和半导体晶片的衬底的方法和装置。 该方法包括从激光源引导具有预定持续时间，脉冲频率和焦斑直径的多个顺序聚焦的激光脉冲，脉冲能够局部熔化基板，以及相对于基板移动激光源和基板 以预定的移动速度彼此相连，从而在基底上形成结构上改性的区域。 根据本发明，脉冲持续时间在20-100ps的范围内，脉冲频率至少为1MHz，移动速度被调整为使得连续脉冲之间的距离小于焦点直径的。。 本发明可以用于例如通常是透明的材料的有效切割，划线和焊接。

公开(公告)号：US20110027971A1

公开(公告)日：2011-02-03

申请号：US12906534

申请日：2010-10-18

申请人： Fumitsugu FUKUYO ,  Kenshi Fukumitsu ,  Naoki Uchiyama ,  Toshimitsu Wakuda

发明人： Fumitsugu FUKUYO ,  Kenshi Fukumitsu ,  Naoki Uchiyama ,  Toshimitsu Wakuda

IPC分类号： H01L21/268 ,  B23K26/00

CPC分类号： H01L21/78 ,  B23K20/023 ,  B23K20/16 ,  B23K20/233 ,  B23K20/26 ,  B23K26/03 ,  B23K26/032 ,  B23K26/034 ,  B23K26/046 ,  B23K26/0624 ,  B23K26/066 ,  B23K26/073 ,  B23K26/0853 ,  B23K26/16 ,  B23K26/364 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  B28D5/0011 ,  B65G2249/04 ,  C03B33/023 ,  C03B33/082 ,  C03B33/102 ,  C03C23/0025 ,  G02F1/1368 ,  H01L21/6836 ,  H01L2221/68327 ,  Y02P40/57 ,  Y10T29/49144 ,  Y10T83/0341

摘要： A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

摘要翻译： 一种激光束加工方法和激光束加工装置，其能够切割工件而不产生在工件表面上的预定切割线的定影和裂纹，其中脉冲激光束照射在工件的预定切割线上 在导致多光子吸收的条件下并且具有与工件内部对准的凝聚点的工作表面，并且沿着预定的切割线沿着预定的切割线沿着预定的切割线移动凝聚点而在工件内部形成改质区域 由此，可以用相当小的力通过从修改区域开始沿着预定切割线的工作而切割工件，并且因为辐射的脉冲激光束几乎不被吸收到工件的表面上，所以表面不熔合 即使形成了修改区域。

公开(公告)号：US07825350B2

公开(公告)日：2010-11-02

申请号：US11101543

申请日：2005-04-08

申请人： Fumitsugu Fukuyo ,  Kenshi Fukumitsu ,  Naoki Uchiyama ,  Toshimitsu Wakuda

发明人： Fumitsugu Fukuyo ,  Kenshi Fukumitsu ,  Naoki Uchiyama ,  Toshimitsu Wakuda

IPC分类号： B23K26/00

CPC分类号： H01L21/78 ,  B23K20/023 ,  B23K20/16 ,  B23K20/233 ,  B23K20/26 ,  B23K26/03 ,  B23K26/032 ,  B23K26/034 ,  B23K26/046 ,  B23K26/0624 ,  B23K26/066 ,  B23K26/073 ,  B23K26/0853 ,  B23K26/16 ,  B23K26/364 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  B28D5/0011 ,  B65G2249/04 ,  C03B33/023 ,  C03B33/082 ,  C03B33/102 ,  C03C23/0025 ,  G02F1/1368 ,  H01L21/6836 ,  H01L2221/68327 ,  Y02P40/57 ,  Y10T29/49144 ,  Y10T83/0341

摘要： A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

公开(公告)号：US20100102042A1

公开(公告)日：2010-04-29

申请号：US12288751

申请日：2008-10-23

申请人： Sean Matthew Garner ,  Xinghua Li

发明人： Sean Matthew Garner ,  Xinghua Li

IPC分类号： B23K26/38 ,  B29C35/08

CPC分类号： C03B33/0215 ,  C03B33/0222 ,  C03B33/082 ,  C03B33/093 ,  Y02P40/57

摘要： A non-contact glass shearing device and a method are described herein that vertically scribes or cuts a downward moving glass sheet to remove outer edges (beads) from the downward moving glass sheet. In addition, the non-contact glass shearing device and method can horizontally scribe or cut the downward moving glass sheet (without the outer edges) so that it can be separated into distinct glass sheets.

摘要翻译： 本文描述了一种非接触式玻璃剪切装置和方法，其垂直划线或切割向下移动的玻璃板，以从向下移动的玻璃板移除外边缘（珠）。 此外，非接触式玻璃剪切装置和方法可以水平地划分或切割向下移动的玻璃板（没有外边缘），使得其可以分离成不同的玻璃板。

公开(公告)号：US07592238B2

公开(公告)日：2009-09-22

申请号：US11106648

申请日：2005-04-15

申请人： Fumitsugu Fukuyo ,  Kenshi Fukumitsu ,  Naoki Uchiyama ,  Toshimitsu Wakuda ,  Kazuhiro Atsumi ,  Kenichi Muramatsu

发明人： Fumitsugu Fukuyo ,  Kenshi Fukumitsu ,  Naoki Uchiyama ,  Toshimitsu Wakuda ,  Kazuhiro Atsumi ,  Kenichi Muramatsu

IPC分类号： H01L21/78 ,  H01L21/82

CPC分类号： H01L21/78 ,  B23K20/023 ,  B23K20/16 ,  B23K20/233 ,  B23K20/26 ,  B23K26/03 ,  B23K26/032 ,  B23K26/034 ,  B23K26/046 ,  B23K26/0624 ,  B23K26/066 ,  B23K26/073 ,  B23K26/0853 ,  B23K26/16 ,  B23K26/364 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  B28D5/0011 ,  B65G2249/04 ,  C03B33/023 ,  C03B33/082 ,  C03B33/102 ,  C03C23/0025 ,  G02F1/1368 ,  H01L21/6836 ,  H01L2221/68327 ,  Y02P40/57 ,  Y10T29/49144 ,  Y10T83/0341

摘要： A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

公开(公告)号：US07217448B2

公开(公告)日：2007-05-15

申请号：US10369604

申请日：2003-02-21

申请人： Hirotaka Koyo ,  Keiji Tsunetomo

发明人： Hirotaka Koyo ,  Keiji Tsunetomo

IPC分类号： C03C21/00

CPC分类号： C03C23/0025 ,  B23K26/073 ,  B23K26/384 ,  B23K26/389 ,  C03B33/082 ,  Y10T428/24273

摘要： A limited portion of a surface of a glass substrate is removed by application of a laser beam on the limited portion of the glass substrate to thereby produce a glass structure according to the invention. The glass substrate contains at least one element such as titanium, iron, vanadium, bismuth, lead, thallium, tin, cerium, rhodium or cobalt capable of absorbing energy of the laser beam and has a threshold of not larger than 1.0 J/cm2 per laser beam pulse in terms of machining energy of the laser beam. When such a glass substrate 21 is used, a glass structure having a through-hole 61 or cavity optional in sectional shape can be formed by irradiation with the laser beam 10.

摘要翻译： 通过在玻璃基板的有限部分上施加激光束去除玻璃基板的表面的有限部分，从而制造根据本发明的玻璃结构。 玻璃基板含有至少一种能够吸收激光束能量的钛，铁，钒，铋，铅，铊，锡，铈，铑或钴的元素，其阈值不大于1.0J / 对于激光束的加工能量，每激光束脉冲的SUP> 2 。 当使用这样的玻璃基板21时，可以通过用激光束10照射来形成具有通孔61或可选择为截面形状的空腔的玻璃结构。

公开(公告)号：US20060160331A1

公开(公告)日：2006-07-20

申请号：US11106645

申请日：2005-04-15

申请人： Fumitsugu Fukuyo ,  Kenshi Fukumitsu ,  Naoki Uchiyama ,  Toshimitsu Wakuda

发明人： Fumitsugu Fukuyo ,  Kenshi Fukumitsu ,  Naoki Uchiyama ,  Toshimitsu Wakuda

IPC分类号： H01L21/78

CPC分类号： H01L21/78 ,  B23K20/023 ,  B23K20/16 ,  B23K20/233 ,  B23K20/26 ,  B23K26/03 ,  B23K26/032 ,  B23K26/034 ,  B23K26/046 ,  B23K26/0624 ,  B23K26/066 ,  B23K26/073 ,  B23K26/0853 ,  B23K26/16 ,  B23K26/364 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  B28D5/0011 ,  B65G2249/04 ,  C03B33/023 ,  C03B33/082 ,  C03B33/102 ,  C03C23/0025 ,  G02F1/1368 ,  H01L21/6836 ,  H01L2221/68327 ,  Y02P40/57 ,  Y10T29/49144 ,  Y10T83/0341

摘要： A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

公开(公告)号：US06992026B2

公开(公告)日：2006-01-31

申请号：US10385696

申请日：2003-03-12

申请人： Fumitsugu Fukuyo ,  Kenshi Fukumitsu ,  Naoki Uchiyama ,  Toshimitsu Wakuda

发明人： Fumitsugu Fukuyo ,  Kenshi Fukumitsu ,  Naoki Uchiyama ,  Toshimitsu Wakuda

IPC分类号： H01L21/36 ,  G06F17/00

CPC分类号： H01L21/78 ,  B23K20/023 ,  B23K20/16 ,  B23K20/233 ,  B23K20/26 ,  B23K26/03 ,  B23K26/032 ,  B23K26/034 ,  B23K26/046 ,  B23K26/0624 ,  B23K26/066 ,  B23K26/073 ,  B23K26/0853 ,  B23K26/16 ,  B23K26/364 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  B28D5/0011 ,  B65G2249/04 ,  C03B33/023 ,  C03B33/082 ,  C03B33/102 ,  C03C23/0025 ,  G02F1/1368 ,  H01L21/6836 ,  H01L2221/68327 ,  Y02P40/57 ,  Y10T29/49144 ,  Y10T83/0341

摘要： A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

公开(公告)号：US20050150881A1

公开(公告)日：2005-07-14

申请号：US11069833

申请日：2005-02-28

申请人： Joseph Worrall ,  Alexander Williamson ,  John McEntee

发明人： Joseph Worrall ,  Alexander Williamson ,  John McEntee

IPC分类号： C03B33/08 ,  C03B33/09 ,  B23K26/40

CPC分类号： C03B33/093 ,  C03B33/082

摘要： Methods for producing glass substrates having scribed edges with straight and smooth ends substantially free of edge protrusions, and microarray glass substrates produced thereby, are provided. In certain embodiments, at least one scribe line is scribed in glass using reduced laser power at the beginning and end of each scribe line relative to the laser power used to scribe the remaining portions of each respective scribe line. In other embodiments, a heat absorbing laser element is positioned adjacent the beginning and end of each scribe line. In all embodiments, the scribed glass is singulated to produce a plurality of scribed glass pieces, each having straight and smooth ends substantially free of edge protrusions. The scribed glass can be used as substrates for biopolymeric microarrays. Also provided are biopolymeric microarrays produced from the subject methods and kits which include the subject microarrays, as well as methods for using the same.