Abstract:
An interferometric mask covering the front electrodes of a photovoltaic device is disclosed. Such an interferometric mask may reduce reflections of incident light from the electrodes. In various embodiments, the mask reduces reflections so that a front electrode pattern appears similar in color to adjacent regions of visible photovoltaic active material.
Abstract:
Systems and methods for sensing a chemical or gas species of interest are provided. In one aspect, a method of sensing a chemical includes determining a capacitance change between at least two layers in a MEMS device, the capacitance between the at least two layers indicative of a presence of one or more chemicals; and identifying the presence of the one or more chemicals based on a determined electrical response of the at least two layers and the determined capacitance change.
Abstract:
A camera flash system may include a light source and an array that includes MEMS-based light-modulating devices disposed in front the light source. The camera flash system may control the array to transmit light through, or substantially prevent the transmission of light through, predetermined areas of the array. In some embodiments, the array may be controlled in response to input from a user, in response to detected ambient light conditions and/or in response to the proximity of a detected subject or other detected features. For example, the camera flash system may control the array to substantially prevent the transmission of light through an area of the array that is between the light source and the eyes of a detected subject.
Abstract:
A microelectromechanical system (MEMS) device includes a first electrode, a second electrode electrically insulated from the first electrode, and a third electrode electrically insulated from the first electrode and the second electrode. The MEMS device also includes a support structure which separates the first electrode from the second electrode and a reflective element located and movable between a first position and a second position. The reflective element is in contact with a portion of the device when in the first position and is not in contact with the portion of the device when in the second position. An adhesive force is generated between the reflective element and the portion when the reflective element is in the first position. Voltages applied to the first electrode, the second electrode, and the third electrode at least partially reduce or counteract the adhesive force.
Abstract:
Methods and systems for packaging MEMS devices such as interferometric modulator arrays are disclosed. One embodiment of a MEMS device package structure includes a seal with a chemically reactant getter. Another embodiment of a MEMS device package comprises a primary seal with a getter, and a secondary seal proximate an outer periphery of the primary seal. Yet another embodiment of a MEMS device package comprises a getter positioned inside the MEMS device package and proximate an inner periphery of the package seal.
Abstract:
This disclosure provides systems, methods and apparatus, including computer programs encoded on computer storage media, for detecting proximity and/or color of an object. In one aspect, an optical sensor includes a plurality of transmissive interferometric elements, a plurality of detectors positioned to detect the presence and/or intensity of light transmitted through the elements, and a processor to determine the proximity of an object based at least in part upon input from the detectors. An optical signal can be sensed by selectively actuating certain elements in a set of transmissive interferometric elements in an array to allow transmission of optical signals within a first spectrum through the array, and detecting optical signals transmitted through the array.
Abstract:
MEMS devices include materials which are used in LCD or OLED fabrication to facilitate fabrication on the same manufacturing systems. Where possible, the same or similar materials are used for multiple layers in the MEMS device, and use of transparent conductors for partially transparent electrodes can be avoided to minimize the number of materials needed and minimize fabrication costs. Certain layers comprise alloys selected to achieve desired properties. Intermediate treatment of deposited layers during the manufacturing process can be used to provide layers having desired properties.
Abstract:
An interferometric modulator (“IMOD”) display utilizes ambient light and incorporates touch sensing without reducing the amount of ambient light that reaches the MEMS modulators, and without introducing any optical distortion or loss of performance. Electrodes for touch sensing are located at a back glass of the inteferometric display, and are used in conjunction with electrodes whose primary function is to activate the pixels of the MEMS display, in order to sense a touch. The touch deflects the IMOD layers and is sensed through the various display layers at the rear of the display.
Abstract:
Embodiments of MEMS devices comprise a conductive movable layer spaced apart from a conductive fixed layer by a gap, and supported by rigid support structures, or rivets, overlying depressions in the conductive movable layer, or by posts underlying depressions in the conductive movable layer. In certain embodiments, portions of the rivet structures extend through the movable layer and contact underlying layers. In other embodiments, the material used to form the rigid support structures may also be used to passivate otherwise exposed electrical leads in electrical connection with the MEMS devices, protecting the electrical leads from damage or other interference.
Abstract:
Embodiments of MEMS devices comprise a conductive movable layer spaced apart from a conductive fixed layer by a gap, and supported by rigid support structures, or rivets, overlying depressions in the conductive movable layer, or by posts underlying depressions in the conductive movable layer. In certain embodiments, portions of the rivet structures extend through the movable layer and contact underlying layers. In other embodiments, the material used to form the rigid support structures may also be used to passivate otherwise exposed electrical leads in electrical connection with the MEMS devices, protecting the electrical leads from damage or other interference.