Method for making a SOI semiconductor substrate with thin active semiconductor layer
    242.
    发明授权
    Method for making a SOI semiconductor substrate with thin active semiconductor layer 有权
    制造具有薄的有源半导体层的SOI半导体衬底的方法

    公开(公告)号:US07029991B2

    公开(公告)日:2006-04-18

    申请号:US10312024

    申请日:2001-06-21

    CPC classification number: H01L21/26533 H01L21/76243

    Abstract: The invention concerns a method comprising: 1) a first phase including steps which consist in forming in the upper part of a first initial semiconductor substrate a first layer of insulating material above a sectional plane of said first substrate, contacting the first layer of insulating material with the insulating upper part of a second initial substrate, so as to form a single layer of insulating material, a break at the sectional plane, so as to obtain an intermediate semiconductor substrate on the single insulating material layer; then, 2) in a second phase which consists in forming in the intermediate semiconductor substrate an additional insulating material layer adjacent to the single insulating material and topped with an upper layer of a final semiconductor substrate.

    Abstract translation: 本发明涉及一种方法,包括:1)包括以下步骤的第一相:第一阶段,其包括在第一初始半导体衬底的上部形成在所述第一衬底的截面上方的第一绝缘材料层,与第一绝缘材料层接触 与第二初始衬底的绝缘上部形成单层绝缘材料,在截面上形成断裂,以在单个绝缘材料层上获得中间半导体衬底; 那么2)在第二阶段中,其包括在中间半导体衬底中形成与单个绝缘材料相邻的附加的绝缘材料层并且顶上最后的半导体衬底的上层。

    Circuit for detecting and formatting data frames
    245.
    发明授权
    Circuit for detecting and formatting data frames 有权
    用于检测和格式化数据帧的电路

    公开(公告)号:US07003407B1

    公开(公告)日:2006-02-21

    申请号:US10399817

    申请日:2000-10-23

    CPC classification number: G06K19/07 G06K19/0723

    Abstract: The invention concerns non-contact smart cards and, more particularly in such cards, a circuit for detecting data frames and providing them with a parallel format for their processing. The invention is characterised in that it consists in using the information contained in the first octets of the frame being currently received, thereby enabling to identify them as they are received and route them into registers (80). This is provided by a state machine (60) whereof the shift from one state to the other is switched by the circuitry (62, 76) output signals.

    Abstract translation: 本发明涉及非接触式智能卡,更具体地说,涉及这种卡,用于检测数据帧并为它们提供用于其处理的并行格式的电路。 本发明的特征在于,它包括使用包含在当前接收到的帧的第一个八比特组中的信息,从而使得能够在它们被接收时识别它们,并将它们路由到寄存器(80)中。 这由状态机(60)提供,其中通过电路(62,76)切换从一个状态到另一状态的输出信号。

    Transmission of generic digital messages through a microprocessor montoring circuit
    246.
    发明申请
    Transmission of generic digital messages through a microprocessor montoring circuit 审中-公开
    通过微处理器监控电路传输通用数字消息

    公开(公告)号:US20060026313A1

    公开(公告)日:2006-02-02

    申请号:US10531510

    申请日:2002-10-29

    Inventor: Laurent Regnier

    CPC classification number: G06F11/273 G06F11/2236 G06F11/3466

    Abstract: The invention concerns a method for transmitting digital messages through a microprocessor monitoring circuit (18) of specific type and integrated to a microprocessor (12). Each message including an identifier and consisting of several groups of successive and juxtaposed bits divided into segments. The method consists in successively transmitting segments associated with a first group corresponding to the identifier and comprising a fixed number of bits; with second groups, at least one of the second group comprising a fixed number of bits depending on the type of monitoring circuit, the number of other second groups being independent of the type of monitoring circuit; with a third group comprising a number of bits greater than one: and with fourth groups comprising each a number of bits greater than one, the number of fourth groups depending on the identifier and on the type of monitoring circuit.

    Abstract translation: 本发明涉及一种通过特定类型的微处理器监视电路(18)发送数字消息并集成到微处理器(12)的方法。 每个消息包括标识符并由被划分成段的连续和并置位的几组组成。 该方法包括连续地发送与对应于该标识符的第一组相关联的段并且包括固定数量的比特; 利用第二组,根据监视电路的类型,第二组中的至少一个包括固定位数,其他第二组的数量与监视电路的类型无关; 其中第三组包括大于1的位数,并且第四组包括大于1的位数,第四组的数量取决于标识符和监视电路的类型。

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