Abstract:
An integrated circuit including a structure of inductances on a semiconductor substrate, intended for operating at frequencies greater than several hundreds of MHz, including a first inductance formed by a conductive track and having first and second terminals respectively connected to each of the two ends of the conductive track, including a second inductance formed by the conductive track between the second terminal and any intermediary point of the conductive track connected to a third terminal, said second and third terminals forming the two terminals of the second inductance, and means for setting the third terminal to high impedance when the first inductance is used.
Abstract:
The invention concerns a method comprising: 1) a first phase including steps which consist in forming in the upper part of a first initial semiconductor substrate a first layer of insulating material above a sectional plane of said first substrate, contacting the first layer of insulating material with the insulating upper part of a second initial substrate, so as to form a single layer of insulating material, a break at the sectional plane, so as to obtain an intermediate semiconductor substrate on the single insulating material layer; then, 2) in a second phase which consists in forming in the intermediate semiconductor substrate an additional insulating material layer adjacent to the single insulating material and topped with an upper layer of a final semiconductor substrate.
Abstract:
A method of simultaneously fabricating a pair of insulated gate transistors respectively having a thin oxide and a thick oxide, and an integrated circuit including a pair of transistors of this kind. Forming low-doped NLDD areas of the thin oxide second transistor includes implanting a first dopant having a first concentration and implanting a second dopant having a second concentration lower than the first concentration. Forming low-doped areas NLDD of the first, thick oxide transistor includes only said implantation of the second dopant.
Abstract:
The invention relates to a device for setting up a write current on at least one write conducting line in an MRAM type integrated circuit memory, including a current mirror composed of a first stage acting as the reference regulated cascode stage receiving all or part of the write current on its input and a second stage acting as the copy regulated cascode stage copying the write current onto the write line.
Abstract:
The invention concerns non-contact smart cards and, more particularly in such cards, a circuit for detecting data frames and providing them with a parallel format for their processing. The invention is characterised in that it consists in using the information contained in the first octets of the frame being currently received, thereby enabling to identify them as they are received and route them into registers (80). This is provided by a state machine (60) whereof the shift from one state to the other is switched by the circuitry (62, 76) output signals.
Abstract:
The invention concerns a method for transmitting digital messages through a microprocessor monitoring circuit (18) of specific type and integrated to a microprocessor (12). Each message including an identifier and consisting of several groups of successive and juxtaposed bits divided into segments. The method consists in successively transmitting segments associated with a first group corresponding to the identifier and comprising a fixed number of bits; with second groups, at least one of the second group comprising a fixed number of bits depending on the type of monitoring circuit, the number of other second groups being independent of the type of monitoring circuit; with a third group comprising a number of bits greater than one: and with fourth groups comprising each a number of bits greater than one, the number of fourth groups depending on the identifier and on the type of monitoring circuit.
Abstract:
An integrated circuit including a structure of inductances on a semiconductor substrate, intended for operating at frequencies greater than several hundreds of MHz, including a first inductance formed by a conductive track and having first and second terminals respectively connected to each of the two ends of the conductive track, including a second inductance formed by the conductive track between the second terminal and any intermediary point of the conductive track connected to a third terminal, said second and third terminals forming the two terminals of the second inductance, and means for setting the third terminal to high impedance when the first inductance is used.
Abstract:
An optical unit including a glass substrate supporting a diaphragm intended to receive a lens with a circular base, the surface of the diaphragm having one or several protruding elements for guiding the lens in horizontal positioning, and its manufacturing method.
Abstract:
A transistor is located on a base layer 1 resting on a semiconductor substrate SB and formed from a relaxed silicon-germanium layer, and includes, under the isolated gate 7, a first strained silicon layer 2 resting on the base layer 1, surmounted by a buried insulating layer 10, surmounted by a second strained silicon layer 4 extending between the source S and drain D regions.
Abstract:
A method and an element of ciphering by an integrated processor of data to be stored in a memory, including applying a ciphering algorithm which is a function of a key specific to the integrated circuit and of an initialization vector, and of memorizing at least the ciphered data, the initialization vector depending at least on the address of storage of the data in the memory.