MEMORY CELL STRUCTURE, METHOD OF MANUFACTURING A MEMORY, AND MEMORY APPARATUS

    公开(公告)号:US20180226571A1

    公开(公告)日:2018-08-09

    申请号:US15947053

    申请日:2018-04-06

    申请人: SONY CORPORATION

    IPC分类号: H01L43/08 H01L27/22 H01L43/02

    摘要: The present disclosure relates to a memory cell structure, a method of manufacturing a memory, and a memory apparatus that are capable of providing a memory cell structure of an MRAM, which reduces resistance of drawn wiring to be connected to an MTJ, reduces an area of a memory cell, and avoids performance degradation of the MTJ due to heat.A memory cell includes: a transistor that uses a first diffusion layer formed in a bottom portion of a concave portion formed by processing a silicon substrate into a groove shape, and a second diffusion layer formed in upper end portions of two opposing sidewall portions of the concave portion, to form channels at portions between the first diffusion layer and the second diffusion layer in the two sidewall portions; and a memory element that is disposed below the first diffusion layer. The first diffusion layer is electrically connected to the memory element via a contact formed after the silicon substrate is thinned.