公开(公告)号：US20230405683A1

公开(公告)日：2023-12-21

申请号：US18034847

申请日：2020-12-01

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： BEN PON ,  JOHN SAMUEL DILIP JANGAM ,  CHANDRAKANT DURLABHBHAI PATEL

IPC: B22F10/85 ,  B33Y30/00 ,  B33Y80/00 ,  B33Y10/00 ,  B22F12/90 ,  B22F10/38 ,  B33Y50/02 ,  B22F10/14 ,  B22F5/10 ,  F28D15/04 ,  F28D15/02

CPC classification number: B22F10/85 ,  B33Y30/00 ,  B33Y80/00 ,  B33Y10/00 ,  B22F12/90 ,  B22F10/38 ,  B33Y50/02 ,  B22F10/14 ,  B22F5/106 ,  F28D15/046 ,  F28D15/0283 ,  B22F2998/10 ,  B22F2301/10 ,  F28F2255/18

Abstract: In one example in accordance with the present disclosure, an additive manufacturing system is described. The additive manufacturing system includes an additive manufacturing device to form a three-dimensional (3D) printed object with regions of differing porosity. The additive manufacturing system also includes a controller to form the 3D printed object. Specifically, by controlling ejection of a first binding agent onto a porous region and a non-porous region of the 3D printed object and controlling ejection of a second binding agent onto the non-porous region of the 3D printed object.

公开(公告)号：US11846901B2

公开(公告)日：2023-12-19

申请号：US17908594

申请日：2021-02-04

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Hojin Ryu ,  Sunhyung Lee ,  Sungwoo Kang

IPC: G03G15/20

CPC classification number: G03G15/2039 ,  G03G15/2053

Abstract: An example fuser includes a flexible fixing belt, a backup member to form a fixing nip with the fixing belt, a heater substrate for heating the fixing belt at the fixing nip and having a first surface comprising a heating element pattern, a common terminal and a driving power supply terminal for supplying power to the heating element pattern, and a second surface in contact with the fixing belt, and a temperature sensor sheet comprising a temperature sensor, a sensing terminal and an electric wire connecting the temperature sensor to the sensing terminal, wherein the temperature sensor sheet is in contact with the first surface of the heater substrate such that the sensing terminal and the electrical wire do not overlap the common terminal and the driving power supply terminal.

公开(公告)号：US11846845B2

公开(公告)日：2023-12-19

申请号：US17418879

申请日：2019-07-29

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Hsing-Hung Hsieh ,  Alexander Wayne Clark ,  Ann Alejandro Villegas

IPC: G02F1/1334 ,  G02F1/1333 ,  G02F1/1335

CPC classification number: G02F1/1334 ,  G02F1/13338 ,  G02F1/133305 ,  G02F1/133528

Abstract: An example of an apparatus is provided. The apparatus includes a display portion and a camera. In addition, the apparatus includes a thin film transistor substrate extending over the display portion and the camera. Furthermore, the apparatus includes an image generation layer disposed under the thin film transistor substrate within the display portion. Also, the apparatus includes a polymer dispersed liquid crystal disposed between the thin film transistor substrate and the camera. The polymer dispersed liquid crystal is to be switched between an opaque state and a clear state. The opaque state is to block the camera from receiving imaging light. The clear state allows light to pass through the polymer dispersed liquid crystal.

公开(公告)号：US20230401364A1

公开(公告)日：2023-12-14

申请号：US18033289

申请日：2020-10-23

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： SUNIL KOTHARI ,  LEI CHEN ,  JACOB TYLER WRIGHT ,  MARIA FABIOLA LEYVA MENDIVIL ,  JUN ZENG

IPC: G06F30/27

CPC classification number: G06F30/27 ,  G06F2113/10

Abstract: Examples of apparatuses for agent map generation are described. In some examples, an apparatus includes a memory to store a layer image. In some examples, the apparatus includes a processor coupled to the memory. In some examples, the processor is to generate, using a machine learning model, an agent map based on the layer image.

公开(公告)号：US20230400939A1

公开(公告)日：2023-12-14

申请号：US18249294

申请日：2020-10-21

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： DOUGLAS A. REYNOLDS ,  PETER ANDREW SEILER ,  BYRON A ALCORN ,  ERIC JOHN GRESSMAN ,  GREGORY MARK HUGHES ,  J. MICHAEL STAHL ,  PATRICK S ANDERSON ,  JOSEPH-JONATHAN SALZANO

IPC: G06F3/038 ,  G06F13/38

CPC classification number: G06F3/038 ,  G06F13/382 ,  G06F2203/0383 ,  G06F2213/0042

Abstract: One example of an internet protocol (IP) keyboard, video, mouse (KVM) device includes a universal serial bus (USB) port, a display port, a network port, a Bluetooth transceiver, a processor, and a memory. The USB port is to be communicatively coupled to a host device. The display port is to be communicatively coupled to the host device. The network port is to be communicatively coupled to a network. The processor is communicatively coupled to the USB port, the display port, the network port, and the Bluetooth transceiver. The memory stores a unique identifier to be transmitted to a client device via Bluetooth in response to establishing a Bluetooth connection between the client device and the IP KVM device. The unique identifier is used by the client device to establish a remote connection to the IP KVM device.

公开(公告)号：US20230400834A1

公开(公告)日：2023-12-14

申请号：US18032289

申请日：2020-10-28

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Nicholas SAUNDERS ,  David WOODLOCK ,  James MCCUTCHEON

IPC: G05B19/4099 ,  B33Y80/00 ,  B33Y10/00 ,  B33Y50/00 ,  B29C64/386 ,  B28B1/00 ,  B22F10/30

CPC classification number: G05B19/4099 ,  B33Y80/00 ,  B33Y10/00 ,  B33Y50/00 ,  B29C64/386 ,  B28B1/001 ,  B22F10/30 ,  B29D99/0089

Abstract: In an example implementation, a method of generating a conformal structure, includes generating a bottom surface and a top surface of a conformal structure, positioning seed points on a seed surface, where the seed surface comprises the bottom surface or the top surface, and expanding the seed points as spherical cells whose cell boundaries form walls perpendicular to the surfaces as the cell boundaries intersect with cell boundaries of neighboring spherical cells. The method includes intersecting the walls with the top surface as the cells expand vertically upward from the seed surface and intersecting the walls with the bottom surface as the cells expand vertically downward from the seed surface, and applying the conformal structure to a 3D object model for fabrication in an additive manufacturing device.

公开(公告)号：US20230400220A1

公开(公告)日：2023-12-14

申请号：US17805996

申请日：2022-06-08

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chao-Wen Cheng ,  Tsung-Yen Chen ,  Chien Fa Huang ,  Wen Shih Chen ,  Mo-Hsuan Lin

IPC: F24F13/24 ,  G10K11/178

CPC classification number: F24F13/24 ,  G10K11/17823 ,  F24F2013/247

Abstract: In some examples, an electronic device includes an audio output device, an airflow generator to generate an airflow, and a system controller to control an operational speed of the airflow generator. The electronic device further includes an audio controller to generate a noise cancellation audio output based on an indicator of the operational speed of the airflow generator provided from the system controller to the audio controller, and send the noise cancellation audio output to the audio output device to mitigate noise produced by the airflow generator.

公开(公告)号：US20230398732A1

公开(公告)日：2023-12-14

申请号：US18033542

申请日：2020-10-30

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： JARRID ALEXANDER WITTKOPF ,  KRISTOPHER J ERICKSON ,  EMRE HIRO DISCEKICI ,  STERLING CHAFFINS ,  KEVIN P DeKAM ,  RAGHUVIR N SENGUPTA ,  ALBERT LIU ,  ELIZABETH GALATI

IPC: B29C64/165

CPC classification number: B29C64/165 ,  B33Y30/00

Abstract: The present disclosure describes materials, methods, and systems for three-dimensional printing. In one example, a three-dimensional printing kit can include a fusing agent and a microbe-inhibiting agent. The fusing agent can include water and an electromagnetic radiation absorber. The electromagnetic radiation absorber can absorb radiation and convert the radiation energy to heat. The microbe-inhibiting agent can include a liquid vehicle and a metal bis(dithiolene) complex. The disclosure also describes methods of three-dimensional printing that utilize a metal-containing microbe-inhibiting material, which can be a metal bis(dithiolene) complex or other materials.

公开(公告)号：US11841682B2

公开(公告)日：2023-12-12

申请号：US17430395

申请日：2019-07-25

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Inna Tzomik ,  Albert Teishev ,  Katty Noorany ,  Daniel Skvirsky

IPC: G03G9/13 ,  C09D11/037 ,  C09D11/106 ,  C09D11/54 ,  G03G9/12 ,  G03G15/00

CPC classification number: G03G9/131 ,  C09D11/037 ,  C09D11/106 ,  C09D11/54 ,  G03G9/122 ,  G03G15/6585

Abstract: Herein is described a method of providing a printed shrink sleeve, the method comprising: providing a printed substrate comprising a liquid electrophotographically printed ink image; and coating the liquid electrophotographically printed ink image of the printed substrate with a water-based overprint varnish composition. The water-based overprint varnish composition comprising: a varnish resin; a crosslinking component comprising: a compound containing at least two epoxide groups; a compound containing an epoxide group and a silane group; or a compound containing at least two carbodiimide groups; and hydrophobic particles, the ratio of the crosslinking component to the hydrophobic particles by weight being in the range of about 4.9:0.1 to about 1:4.

公开(公告)号：US11840075B2

公开(公告)日：2023-12-12

申请号：US17863934

申请日：2022-07-13

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： John Rossi ,  Erik D. Ness ,  James Michael Gardner ,  Scott A. Linn

IPC: B41J2/36 ,  B41J2/045

CPC classification number: B41J2/0454 ,  B41J2/04541 ,  B41J2/04546 ,  B41J2/04563 ,  B41J2/04586

Abstract: An integrated circuit includes thermal tracking logic, control logic, and an output interface. The thermal tracking logic determines a temperature of a fluid ejection die. The control logic defines an emulated parameter of the fluid ejection die as a function of the temperature of the fluid ejection die. The output interface outputs the emulated parameter to a printer system based on the function and the temperature of the fluid ejection die.