SHIELD ENCLOSURES FOR MEMORY MODULES
    2.
    发明公开

    公开(公告)号:US20230221898A1

    公开(公告)日:2023-07-13

    申请号:US17574928

    申请日:2022-01-13

    CPC classification number: G06F3/0614 G06F3/0653 G06F3/0673

    Abstract: In example implementations, an apparatus is provided. The apparatus includes a polymer based enclosure, an absorber, and a connection interface. The polymer based enclosure is shaped to enclose a memory module connected to a memory module connection interface on a printed circuit board. The absorber is coated over the polymer based enclosure to block radio frequency signals generated by the memory modules. The connection interface is to connect to the memory module connection interface.

    SIZEABLE CONDUITS
    4.
    发明申请

    公开(公告)号:US20230051861A1

    公开(公告)日:2023-02-16

    申请号:US17793661

    申请日:2020-02-14

    Abstract: According to an example, a conduit sizeable in length and width comprises a first cover and a second cover. The first cover comprises a first interfacing area between a first component and a second component. The second cover comprises a second interfacing area between a third component and a fourth component. The first cover and the second cover comprise a third interfacing area.

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