-
公开(公告)号：US10827602B1
公开(公告)日：2020-11-03
申请号：US16806058
申请日：2020-03-02
Applicant: ABB Power Electronics Inc.
Inventor： Robert Joseph Roessler , Anjana Shyamsundar
IPC: H05K1/02
Abstract: At least one embodiment of a power supply includes a printed circuit board formed from a plurality of double-sided laminates and a plurality of thermally conductive, electrically insulating pre-preg sheets interleaved with the plurality of double-sided laminates. Each double-sided laminate illustratively includes an electrically insulating core, a first patterned layer of electrically conductive material arranged on a first side of the electrically insulating core, and a second patterned layer of electrically conductive material arranged on a second side of the electrically insulating core opposite the first side. The printed circuit board illustratively further includes a thermally conductive, electrically insulating additive resin filling spaces between the electrically conductive material in both the first and second patterned layers of each of the plurality of double-sided laminates, such that the electrically conductive material and the additive resin together form planar surfaces that contact the plurality of pre-preg sheets.
-
公开(公告)号：US10820420B2
公开(公告)日：2020-10-27
申请号：US16512351
申请日：2019-07-15
Applicant: ABB Schweiz AG
Inventor： Robert Joseph Roessler
Abstract: In at least one illustrative embodiment, a printed circuit board may comprise at least one insulating layer, first and second conductive layers separated from one another by the at least one insulating layer, and a conductive via extending through the at least one insulating layer and electrically coupling the first and second conductive layers. The conductive via may include an annular via sidewall having an average radial thickness of at least 2.5 mils (0.0025 inches) and a conductive pad having an average thickness of no more than 3.2 mils (0.0032 inches).
-
公开(公告)号：US10819244B1
公开(公告)日：2020-10-27
申请号：US16447456
申请日：2019-06-20
Applicant: ABB POWER ELECTRONICS INC.
Inventor： Yuxiang Shi , Liming Liu , Jing Xu
Abstract: According to one aspect of the present disclosure, a single-stage converter includes a rectifying circuit and a buck-boost circuit. The buck-boost circuit includes an inductor with a center tap configured to supply an output of the buck-boost circuit to the rectifying circuit. The buck-boost circuit also includes first and second interleaved arms arranged in parallel with a voltage input of the single-stage converter. The first and second interleaved arms are each coupled to the inductor and include a plurality of switches operable to control the output of the buck-boost circuit.
-
公开(公告)号：US11949245B2
公开(公告)日：2024-04-02
申请号：US17905003
申请日：2020-03-13
Applicant: ABB POWER ELECTRONICS INC.
Inventor： Qixue Yu , Junfeng Guan , Ming Fu
Abstract: Wireless power supply devices, wireless powered devices, wireless power transmission systems, and manufacturing methods thereof. The wireless power supply device can include a first circuit configured to convert a DC voltage to an AC voltage for wireless power transmission between the wireless power supply device and a powered device. The system can also include a pulse signal receiver configured to receive a first pulse signal from the powered device and to generate a second pulse signal based on the first pulse signal, the first pulse signal being generated based on a feedback signal of the powered device indicating information associated with received power of the powered device. The system can also include a first control unit coupled to the first circuit and the pulse signal receiver, and configured to control conversion of the first circuit based on the second pulse signal.
-
公开(公告)号：US11670444B2
公开(公告)日：2023-06-06
申请号：US16432484
申请日：2019-06-05
Applicant: ABB Power Electronics Inc.
Inventor： Ke Dai , Tom Sun , Lanlan Yin
CPC classification number: H01F27/24 , H01F3/14 , H01F27/2804 , H01F41/0206
Abstract: An integrated magnetic assembly includes a magnetic core having a first component and a second component. The first component includes a first face and a winding leg extending from the first face. The winding leg includes a top face spaced from and oriented generally parallel to the first face. The second component is coupled to the first component and has a second face facing the first face. The second component further includes a third face recessed from and oriented generally parallel to the second face and a recess sidewall extending between the second face and the third face. The integrated magnetic assembly further includes an input winding and an output winding each inductively coupled to the magnetic core. The third face and the recess sidewall define a recess within the second face. Additionally, a gap is defined between the top face and the third face.
-
Patent Agency Ranking
26.发明授权公开(公告)号：US11605496B2
公开(公告)日：2023-03-14
申请号：US15948383
申请日：2018-04-09
Applicant: ABB Power Electronics Inc.
Inventor： Robert Joseph Roessler , Anjana Shyamsundar
IPC: H01F27/32 , H01F27/28 , H01F41/063 , H01F27/24
Abstract: A magnetic assembly includes a magnetic core including at least one winding leg and at least one winding. The at least one winding inductively coupled to the magnetic core and wound around the at least one winding leg. The at least one winding includes a foil conductive material and a tape. The tape includes a thermally conductive adhesive layer and an electrically insulating layer.
-
公开(公告)号：US20210274636A1
公开(公告)日：2021-09-02
申请号：US17087822
申请日：2020-11-03
Applicant: ABB Power Electronics Inc.
Inventor： Robert Joseph Roessler , Anjana Shyamsundar
IPC: H05K1/02
Abstract: At least one embodiment of a power supply includes a printed circuit board formed from a plurality of double-sided laminates and a plurality of thermally conductive, electrically insulating pre-preg sheets interleaved with the plurality of double-sided laminates. Each double-sided laminate illustratively includes an electrically insulating core, a first patterned layer of electrically conductive material arranged on a first side of the electrically insulating core, and a second patterned layer of electrically conductive material arranged on a second side of the electrically insulating core opposite the first side. The printed circuit board illustratively further includes a thermally conductive, electrically insulating additive resin filling spaces between the electrically conductive material in both the first and second patterned layers of each of the plurality of double-sided laminates, such that the electrically conductive material and the additive resin together form planar surfaces that contact the plurality of pre-preg sheets.
-
公开(公告)号：US20210166860A1
公开(公告)日：2021-06-03
申请号：US16701098
申请日：2019-12-02
Applicant: ABB Power Electronics Inc.
Inventor： Arturo Silva
Abstract: Illustrative embodiments of hybrid transformers, power supplies, and methods relating to the same are disclosed. In at least one embodiment, a hybrid transformer includes first and second wire coils arranged on opposing surfaces of a printed circuit board (PCB), a core extending through the PCB, wherein the first and second coils are each wound around the core, and at least one header electrically coupling one of the first and second wire coils to the PCB.
-
公开(公告)号：US10993325B2
公开(公告)日：2021-04-27
申请号：US16528505
申请日：2019-07-31
Applicant: ABB Power Electronics Inc.
Inventor： John Andrew Trelford , Richard John Yeager , Alok Kumar Lohia , Thang Danh Truong
Abstract: Interposer printed circuit boards for power modules and associated methods are disclosed. In at least one illustrative embodiment, a printed circuit board assembly may comprise a printed circuit board having a surface, an electrical component mounted on the surface, a pin mounted on the surface, and an interposer printed circuit board mounted on the surface. The electrical component may have a first height orthogonal to the surface. The pin may have a second height orthogonal to the surface, where the second height is greater than the first height. The interposer printed circuit board may comprise a pad and an outer solder bump positioned on the pad. The outer solder bump may have a third height orthogonal to the surface, where the third height is greater than the first height.
-
公开(公告)号：US10824180B2
公开(公告)日：2020-11-03
申请号：US15888847
申请日：2018-02-05
Applicant: ABB Power Electronics Inc.
Abstract: A DC-to-DC power converter includes a reference voltage generator and a tangible, non-transitory, computer-readable memory. The memory stores a temperature coefficient, and the temperature coefficient is based upon a temperature response of said reference voltage generator over a range of temperatures. The DC-to-DC power converter also includes a controller coupled to the reference voltage generator and the memory and operable to retrieve the temperature coefficient from the memory, and adjust an output voltage of the DC-to-DC power converter based upon the temperature coefficient.
-
-
-
-
-
-
-
-
-
Search Results
30
records
(took 0.081 seconds)
